Fracture toughness

About: Fracture toughness is a research topic. Over the lifetime, 39642 publications have been published within this topic receiving 854338 citations.

Effect of electric field on fracture of piezoelectric ceramics

Abstract: Closed form solutions for all three modes of fracture for an infinite piezoelectric medium containing a center crack subjected to a combined mechanical and electrical loading were obtained. The explicit mechanical and electrical fields near the crack tip were derived, from which the strain energy release rate and the total potential energy release rate were obtained by using the crack closure integral. The suitability in using the stress intensity factor, the total energy release rate, or the mechanical strain energy release rate as the fracture criterion was discussed.

An analysis of ductile rupture modes at a crack tip

Abstract: An elastic-Viscoplastic model of a ductile, porous solid is used to study the influence of the nucleation and growth of micro-voids in the material near the tip of a crack. Conditions of small scale yielding are assumed, and the numerical analyses of the stress and strain fields are based on finite strain theory, so that crack tip blunting is fully accounted for. An array of large inclusions or inclusion colonies, with a relatively low strength, results in large voids near the crack tip at a rather early stage, whereas small second phase particles in the matrix material between the inclusions require large strains before cavities nucleate. Various distributions of the large inclusions, and various critical strains for nucleation of the small scale voids between the inclusions, are considered. Localization of plastic flow plays an important role in determining the failure path between the crack tip and the nearest larger void, and the path is strongly sensitive to the distribution of the large inclusions. Values of the J-integral and the crack opening displacement at fracture initiation are estimated, together with values of the tearing modulus during crack growth, and these values are related to experimental results.

Nanomechanical characterisation of solid surfaces and thin films

Abstract: To measure nanomechanical properties of surface layers of bulk materials and thin films, depth-sensing nanoindentation measurement techniques are used commonly. The nanoindentation apparatus continuously monitors the load and the position of the indenter relative to the surface of the specimen (depth of an indent or displacement) during the indentation process. Indentation experiments can be performed at a penetration depth of as low as about 5 nm. This chapter presents an overview of various nanoindentation techniques, various measurement options, and data analysis. Data on elastic-plastic deformation behavior, hardness, elastic modulus, scratch resistance, film-substrate adhesion, residual stresses, time-dependent creep and relaxation properties, fracture toughness, and fatigue are presented.