Fracture toughness

About: Fracture toughness is a research topic. Over the lifetime, 39642 publications have been published within this topic receiving 854338 citations.

Fracture properties of bamboo

Abstract: Bamboo is a typical natural composite material, which is longitudinally reinforced by strong fibers. The fibers are distributed densely in the outer surface region, and sparsely in the inner surface region, and their volume fraction changes with respect to radius. The structure of bamboo has been characterized by tensile tests and its mechanical properties have been related to its structure. This paper presents the fracture toughness of bamboo culms and nodes. A notch is inserted into the culm and node specimens using a razor blade with a thickness of 0.4 mm. Tensile tests are carried out to evaluate fracture toughness. The average value obtained was 56.8 MPa m1/2, which is higher than that of Al-alloy. It was concluded that the fracture toughness of the bamboo culm depends on the volume fraction of fibers.

Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

Abstract: The presence of an intermetallic is often an indication of good wetting in a solder joint. However, excessive intermetallic growth and the brittleness of the intermetallic layer may be detrimental to joint reliability. This study examined the growth and mechanical behavior of interfacial intermetallics between copper and six solder alloys commonly used in electronics assembly. The solder alloys tested were 60Sn-40Pb, 63Sn-37Pb, 95Sn-5Sb, 96.5Sn-3.5Ag, 50Pb-50In, 50Sn-50In, and 40In-40Sn-20Pb. The 50Sn-50In and 40In-40Sn-20Pb exhibited faster solid state growth of the intermetallic layer at 100 °C as compared to the near-eutectic Sn-Pb control solder. The 50In-50Pb had a slower growth rate, relative to 63Sn-37Pb, at the aging temperature of 170 °C due to slower reaction rate kinetics of indium with copper. The 96.5Sn-3.5Ag and 95Sn-5Sb had similar intermetallic growth rates at 170 °C and 205 °C, and the aging was comparable to that of the 63Sn-37Pb alloy. The 95Sn-5Sb solder/copper intermetallic had a faster growth rate of the Cu3Sn layer than was observed in the Sn-Ag or Sn-Pb alloys. Modified fracture toughness and low load indentation tests were used to characterize the mechanical behavior of the intermetallics. The intermetallics were harder than both the base metal and the solder alloy. The fracture behavior of the joints in tension was dependent upon the strength of the solder alloy. Solders with low strengths failed in the solder by plastic deformation. The failure of solders with higher strengths was dependent upon intermetallic thickness. When the intermetallic was thin, fracture occurred in the solder or at the solder/ intermetallic interface. As the interfacial intermetallic thickened, the fracture path moved into the intermetallic layer.

Mechanisms and modeling of cleavage fracture in simulated heat-affected zone microstructures of a high-strength low alloy steel

Abstract: The effect of the welding cycle on the fracture toughness properties of high-strength low alloy (HSLA) steels is examined by means of thermal simulation of heat-affected zone (HAZ) microstructures. Tensile tests on notched bars and fracture toughness tests at various temperatures are performed together with fracture surface observations and cross-sectional analyses. The influence of martensite-austenite (M-A) constituents and of “crystallographic” bainite packets on cleavage fracture micromechanisms is, thus, evidenced as a function of temperature. Three weakest-link probabilistic models (the “Master-curve” (MC) approach, the Beremin model, and a “double-barrier” (DB) model) are applied to account for the ductile-to-brittle transition (DBT) fracture toughness curve. Some analogy, but also differences, are found between the MC approach and the Beremin model. The DB model, having nonfitted, physically based scatter parameters, is applied to the martensite-containing HAZ microstructures and gives promising results.