Topic
Hardening (metallurgy)
About: Hardening (metallurgy) is a research topic. Over the lifetime, 25584 publications have been published within this topic receiving 376012 citations.
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TL;DR: In this article, an extensive parametric study is performed on two-dimensional (2D) axisymmetric finite element (FE) unit cell calculations, using a Kocks-Mecking type hardening law.
117 citations
TL;DR: In this article, thin solid films were deposited onto cemented carbide (WC-Co) substrates by arc evaporation and X-ray diffraction and transmission electron microscopy showed that all films were of NaCl-structure type phase.
Abstract: Ti1−xSixN (0 ≤ x ≤ 0.14) thin solid films were deposited onto cemented carbide (WC-Co) substrates by arc evaporation. X-ray diffraction and transmission electron microscopy showed that all films were of NaCl-structure type phase. The as-deposited films exhibited a competitive columnar growth mode where the structure transits to a feather-like nanostructure with increasing Si content. Films with 0 ≤ x ≤ 0.01 had a 〈111〉 crystallographic preferred orientation which changed to an exclusive 〈200〉 texture for 0.05 ≤ x ≤ 0.14. X-ray photoelectron spectroscopy revealed the presence of Si–N bonding, but no amorphous Si3N4. Band structure calculations performed using a full potential linear muffin tin orbital method showed that for a given NaCl-structure Ti1−xSixN solid solution, a phase separation into cubic SiN and TiN is energetically favorable. The microstructure was maintained for the Ti0.86Si0.14N film annealed at 900 °C, while recrystallization in the cubic state took place at 1100 °C annealing during 2 h. The Si content influenced the film hardness close to linearly, by combination of solid-solution hardening in the cubic state and defect hardening. For x = 0 and x = 0.14, nanoindentation gave a hardness of 31.3 ± 1.3 GPa and 44.7 ± 1.9 GPa, respectively. The hardness was retained after annealing at 900 °C, while it decreased to below 30 GPa for 1100 °C following recrystallization and W and Co interdiffusion.
117 citations
TL;DR: In this article, the mechanical stability of Pb-free SnAgCu solder connections is studied in comparison to conventional eutectic SnPb. The strength and ductility of the Pbfree joints depend significantly on Ag content.
117 citations
TL;DR: In this paper, the authors investigated the hot-deformation behavior of nickel-based Alloy 718 and found that dynamic recrystallization plays a significant role in determining final microstructures for the given temperature ranges.
116 citations
TL;DR: In this article, it is shown how microstructural ideas involving dislocation micro-mechanisms do, when properly coupled to the classical continuum theories, prescribe not one but several forms of kinematic hardening and these forms are suggestive of strain hardening mechanisms on the micro as well as on the macro scale.
116 citations