Topic
Hardening (metallurgy)
About: Hardening (metallurgy) is a research topic. Over the lifetime, 25584 publications have been published within this topic receiving 376012 citations.
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164 citations
TL;DR: In this article, a new empirical method is proposed for analyzing nano-indentation load-displacement curves based on experimental results and finite element (FEM) calculations reported in the literature.
164 citations
TL;DR: In this paper, the homogeneous anisotropic hardening (HAH) approach was extended to crossloading cases with latent hardening effects, which is based on the physical understanding of dislocation structure evolution during strain path changes.
164 citations
TL;DR: In this paper, the microstructural evolutions and hardening mechanisms of pure 1-μm thick Cu film and Cu/Nb multilayers of individual layer thickness of 70nm, 5-nm and 2.5-nm were investigated after 1 at.% and 7-at.% He ion implants at room temperature.
163 citations
TL;DR: In this article, a measurement technique based on the determination of wafer curvature with a laser scanning device is utilized to directly measure the film stress in situ as a function of temperature during thermal cycling.
Abstract: Mechanical stress in interconnection is a problem of growing importance in VLSI devices. Open circuits due to metal cracking and voiding and short circuits due to hillocks are stress-related phenomena. The origins of this stress are discussed including intrinsic stresses from the synthesis of the films and thermally induced stresses. A measurement technique based on the determination of wafer curvature with a laser scanning device is utilized to directly measure the film stress in situ as a function of temperature during thermal cycling. The changes in stress observed during thermal cycles are interpreted quantitatively and mechanisms that lead to plastic deformation and their relationship to hillocks are discussed. In the stress vs. temperature measurements, several regions have been identified including elastic and plastic behavior both under compression and tension, the yield strength, recrystallization, gain growth, hardening, and solid-state reactions. The effects of deposition conditions on these regions are also examined. >
163 citations