Showing papers on "Heat pipe published in 2009"

LED illuminating device and light engine thereof

Abstract: An LED illuminating device includes an optical section, an electrical section, and a heat dissipation section. The heat dissipation section is provided with a heat sink and at least one heat pipe therein. The heat sink includes a metal tube, a plurality of metal fins extending radially and outwardly from the metal tube, and a heat-absorbing plate attached to a bottom of the metal tube. A chamber is axially recessed from a top of the metal tube to the heat-absorbing plate. The heat pipe includes an evaporating section and a condensing section. The evaporating section of the heat pipe is attached to an inner surface of the heat-absorbing plate. The condensing section of the heat pipe is attached to an inner circumferential surface of the metal tube. The light source is attached to an outer surface of the heat-absorbing plate.

Analysis of the Wicking and Thin-Film Evaporation Characteristics of Microstructures

Abstract: The topology and geometry of microstructures play a crucial role in determining their heat transfer performance in passive cooling devices such as heat pipes. It is therefore important to characterize microstructures based on their wicking performance, the thermal conduction resistance of the liquid filling the microstructure, and the thin-film characteristics of the liquid meniscus. In the present study, the free-surface shapes of the static liquid meniscus in common microstructures are modeled using SURFACE EVOLVER for zero Bond number. Four well-defined topologies, viz., surfaces with parallel rectangular ribs, horizontal parallel cylinders, vertically aligned cylinders, and spheres (the latter two in both square and hexagonal packing arrangements), are considered. Nondimensional capillary pressure, average distance of the liquid free-surface from solid walls (a measure of the conduction resistance of the liquid), total exposed area, and thin-film area are computed. These performance parameters are presented as functions of the nondimensional geometrical parameters characterizing the microstructures, the volume of the liquid filling the structure, and the contact angle between the liquid and solid. Based on these performance parameters, hexagonally-packed spheres on a surface are identified to be the most efficient microstructure geometry for wicking and thin-film evaporation. The solid-liquid contact angle and the nondimensional liquid volume that yield the best performance are also identified. The optimum liquid level in the wick pore that yields the highest capillary pressure and heat transfer is obtained by analyzing the variation in capillary pressure and heat transfer with liquid level and using an effective thermal resistance model for the wick. DOI: 10.1115/1.3160538

Lighting device, heat transfer structure and heat transfer element

Abstract: A heat pipe configured to transfer heat from a central portion of a lighting device to an edge portion of the lighting device, the heat pipe comprising one region which extends along a portion of a diameter of a substantially circular, substantially annular shape and another region that extends along a diameter of the shape Also, a lighting device comprising a housing, a reflector, a light emitter and a heat pipe as described above Also, a self ballasted lamp comprising a solid state light source, an electrical connector, an AC power supply, a reflector configured to receive light from the source and emit reflected light from an aperture, and a thermal management system Also, a lighting device, comprising a housing, a reflector, a light emitter comprising an array of solid state light emitters, a heat pipe and a sensor

Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics

Abstract: A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.

Effect of Wick Characteristics on the Thermal Performance of the Miniature Loop Heat Pipe

Abstract: Two phase heat transfer devices based on the miniature version of loop heat pipe (LHP) can provide very promising cooling solutions for the compact electronic devices due to their high heat flux management capability and long distance heat transfer with minimal temperature losses. This paper discusses the effect of the wick properties on the heat transfer characteristics of the miniature LHP. The miniature model of the LHP with disk-shaped evaporator, 10 mm thick and 30 mm disk diameter, was designed using copper containment vessel and water as the working fluid, which is the most acceptable combination in electronic cooling applications. In the investigation, wick structures with different physical properties including thermal conductivity, pore radius, porosity, and permeability and with different structural topology including monoporous or biporous evaporating face were used. It was experimentally observed that copper wicks are able to provide superior thermal performance than nickel wicks, particularly for low to moderate heat loads due to their low heat conducting resistance. With monoporous copper wick, maximum evaporator heat transfer coefficient (hev) of 26,270 W/m2 K and evaporator thermal resistance (Rev) of 0.06–0.10°C/W were achieved. For monoporous nickel wick, the corresponding values were 20,700 W/m2 K for hev and 0.08–0.21°C/W for Rev. Capillary structure with smaller pore size, high porosity, and high permeability showed better heat transfer characteristics due to sufficient capillary pumping capability, low heat leaks from evaporator to compensation chamber and larger surface area to volume ratio for heat exchange. In addition to this, biporous copper wick structure showed much higher heat transfer coefficient of 83,787 W/m2 K than monoporous copper wick due to improved evaporative heat transfer at wick wall interface and separated liquid and vapor flow pores. The present work was able to classify the importance of the wick properties in the improvement of the thermal characteristics for miniature loop heat pipes.

Method of cooling a battery pack using flat heat pipes

Abstract: Methods of cooling a battery pack comprising a large number of cells are disclosed in various embodiments. In one embodiment, one or more low thermal resistance heat pipes are used to transfer heat away from the battery pack. In another embodiment, the heat pipes are coupled to a cold plate cooled by circulating liquid.

Measurement of boiling heat transfer coefficient in liquid nitrogen bath by inverse heat conduction method

Abstract: Inverse heat conduction method (IHCM) is one of the most effective approaches to obtaining the boiling heat transfer coefficient from measured results. This paper focuses on its application in cryogenic boiling heat transfer. Experiments were conducted on the heat transfer of a stainless steel block in a liquid nitrogen bath, with the assumption of a 1D conduction condition to realize fast acquisition of the temperature of the test points inside the block. With the inverse-heat conduction theory and the explicit finite difference model, a solving program was developed to calculate the heat flux and the boiling heat transfer coefficient of a stainless steel block in liquid nitrogen bath based on the temperature acquisition data. Considering the oscillating data and some unsmooth transition points in the inverse-heat-conduction calculation result of the heat-transfer coefficient, a two-step data-fitting procedure was proposed to obtain the expression for the boiling heat transfer coefficients. The coefficient was then verified for accuracy by a comparison between the simulation results using this expression and the verifying experimental results of a stainless steel block. The maximum error with a revised segment fitting is around 6%, which verifies the feasibility of using IHCM to measure the boiling heat transfer coefficient in liquid nitrogen bath.

Operational characteristics of miniature loop heat pipe with flat evaporator

Abstract: Loop heat pipes are heat transfer devices whose operating principle is based on the evaporation and condensation of a working fluid, and which use the capillary pumping forces to ensure the fluid circulation. A series of tests have been carried out with a miniature loop heat pipe (mLHP) with flat evaporator and fin-and-tube type condenser. The loop is made of pure copper with stainless mesh wick and methanol as the working fluid. Detailed study is conducted on the start-up reliability of the mLHP at high as well as low heat loads. During the testing of mLHP under step power cycles, the thermal response presented by the loop to achieve steady state is very short. At low heat loads, temperature oscillations are observed throughout the loop. The amplitudes and frequencies of these fluctuations are large at evaporator wall and evaporator inlet. It is expected that the extent and nature of the oscillations occurrence is dependent on the thermal and hydrodynamic conditions inside the compensation chamber. The thermal resistance of the mLHP lies between 0.29 and 3.2°C/W. The effects of different liquid charging ratios and the tilt angles to the start-up and the temperature oscillation are studied in detail.

Experimental Investigation of Miniature Three-Dimensional Flat-Plate Oscillating Heat Pipe

Abstract: An experimental investigation on the effects of condenser temperatures, heating modes, and heat inputs on a miniature three-dimensional (3D) flat-plate oscillating heat pipe (FP-OHP) was conducted visually and thermally. The 3D FP-OHP was charged with acetone at a filling ratio of 0.80, had dimensions of 101.60×63.50×2.54 mm 3 , possessed 30 total turns, and had square channels on both sides of the device with a hydraulic diameter of 0.762 mm. Unlike traditional flat-plate designs, this new three-dimensional compact design allows for multiple heating arrangements and higher heat fluxes. Transient and steady-state temperature measurements were collected at various heat inputs, and the activation/start-up of the OHP was clearly observed for both bottom and side heating modes during reception of its excitation power for this miniature 3D FP-OHP. The neutron imaging technology was simultaneously employed to observe the internal working fluid flow for all tests directly through the copper wall. The activation was accompanied with a pronounced temperature field relaxation and the onset of chaotic thermal oscillations occurring with the same general oscillatory pattern at locations all around the 3D FP-OHP. Qualitative and quantitative analysis of these thermal oscillations, along with the presentation of the average temperature difference and thermal resistance, for all experimental conditions are provided. The novelty of the three-dimensional OHP design is its ability to still produce the oscillating motions of liquid plugs and vapor bubbles and, more importantly, its ability to remove higher heat fluxes.