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Heat pipe

About: Heat pipe is a research topic. Over the lifetime, 30354 publications have been published within this topic receiving 243669 citations. The topic is also known as: heatpipe & heat-pipe.


Papers
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Patent
24 Aug 1993
TL;DR: In this paper, a heat transfer assembly for transferring heat from a heat generating electronic device or computer chip to ambient air is described, which is comprised of a heat pipe 20 mounted perpendicular to a heat-generating electronic device.
Abstract: A heat transfer assembly 11 is disclosed for transferring heat from a heat generating electronic device 15 or computer chip to ambient air. The heat transfer assembly 11 is comprised of a heat pipe 20 mounted perpendicular to a heat generating electronic device 15. The heat transfer assembly 11 is designed to provide a mechanically solid support for the bonding of the various heat transfer assembly components and to use circumferentially mounted fins 23 to increase the efficiency of heat transfer away from the electronic devices 15. The heat transfer assembly can function effectively when mounted in any direction. Thermocouples 42 are used to monitor the temperature and efficiency of the heat generating electronic device 15 such that corrective action can be initiated if the device begins to overheat.

84 citations

Journal ArticleDOI
TL;DR: In this paper, the effect of varying nitrogen-doped graphene (NDG) nanosheets concentrations, heat pipe inclination angles and input heating powers on the performance of a grooved heat pipe was analyzed.

84 citations

Patent
06 Mar 1995
TL;DR: A rotatable and slidable heat pipe apparatus for transferring heat away from a microprocessor chip more rapidly than by heat sink surface area dissipation to the surrounding air alone is presented in this article.
Abstract: A rotatable and slidable heat pipe apparatus for transferring heat away from a microprocessor chip more rapidly than by heat sink surface area dissipation to the surrounding air alone, comprising a heat sink with an integral cylindrical passageway adapted to receive a first end of a heat pipe shaped like a crankshaft, and a heat spreader formed from a metal plate with a first end rolled up to define a cylindrical opening adapted to receive a second end of the heat pipe. The heat spreader is attached to an underside of a keyboard. Since the heat pipe is able to rotate within the cylindrical passageway and the cylindrical opening, the keyboard can be raised to an open position and lowered to a closed position quickly and simply without the risk of breaking or bending the heat pipe, and manufacturing position tolerances between the heat pipe apparatus components are increased resulting in a simplified manufacturing process. The heat pipe can also be slid in to and out of the cylindrical passageway or the cylindrical opening, thereby enabling computer manufacturers to incorporate the heat pipe into portable battery powered notebook-type computer systems designed to allow a user to remove, replace, or swap internal components by simply flipping open or removing the keyboard, and further enabling a user to perform maintenance work or repairs on the computer system without concern for damage to the heat pipe.

84 citations

Journal ArticleDOI
TL;DR: This is the first demonstration of the operation of a heat engine with a finite quantum heat bath, and the system shows thermalization, and can model a reversible heat engine cycle.
Abstract: We present a theoretical and numerical analysis of a quantum system that is capable of functioning as a heat engine. This system could be realized experimentally using cold bosonic atoms confined to a double well potential that is created by splitting a harmonic trap with a focused laser. The system shows thermalization, and can model a reversible heat engine cycle. This is the first demonstration of the operation of a heat engine with a finite quantum heat bath.

84 citations

Journal ArticleDOI
TL;DR: In this article, the effect of the condenser and evaporator resurfacing on overall performance of a 1 m height closed two-phase thermosyphon was investigated at 44 power inputs from 43 W to 668 W.

84 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
2023343
2022511
2021619
2020986
20191,301
20181,498