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Heat pipe

About: Heat pipe is a research topic. Over the lifetime, 30354 publications have been published within this topic receiving 243669 citations. The topic is also known as: heatpipe & heat-pipe.


Papers
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Journal ArticleDOI
TL;DR: In this paper, the authors used a CLOHP/CV with inner diameters of 1.77 and 2.03 millimeters and showed that the heat transfer rate increases with an increase of Rcv and decreases with an increased aspect ratio.

82 citations

Patent
12 Oct 1999
TL;DR: In this paper, the reliability and effectiveness of the cooling apparatus are greatly increased through the use of a heat pipe having two condenser regions that are attached to different types of heat dissipating bodies.
Abstract: A computer including a microprocessor, an input coupled to provide input to the microprocessor, a mass storage coupled to the microprocessor and a memory coupled to the microprocessor to provide storage to facilitate execution of computer programs by the microprocessor. A heat pipe including spaced apart condenser regions and an evaporator region disposed between the condenser regions is provided. The evaporator region is positioned adjacent the microprocessor. A first heat dissipating device is attached to the heat pipe adjacent to a first one of the condenser regions. A second heat dissipating device is attached to the heat pipe adjacent to a second one of the condenser regions. The second heat dissipating device is of a different type than the first heat dissipating device. The reliability and effectiveness of the cooling apparatus are greatly increased through the use of a heat pipe having two condenser regions that are attached to different types of heat dissipating bodies.

81 citations

Journal ArticleDOI
TL;DR: In this article, three composite wick structures (copper power or mesh sintered on grooved tube) are proposed to improve the thermal performance of ultra-thin heat pipes (UTHPs), and the maximum heat transport capacities are 12 W, 13 W and 14 W, under the corresponding optimum filling ratios of 70, 70, and 80%, for the SSGW, BSGW and MGW UTHPs, respectively.

81 citations

Patent
08 Feb 1971
TL;DR: In this paper, a spiral capillary groove is constructed by cutting the metal from the wall of the tube and raising and folding the cut metal over to provide a narrow opening for a maximum capillary action.
Abstract: A unit for recovering thermal energy which utilizes a plurality of unique heat pipes, and the method and apparatus for fabricating the heat pipes is disclosed. The heat pipes are disposed horizontally and are filled with a volume of working fluid sufficient to cause the liquid phase to travel in either direction by gravity. Circumferential capillary grooves in the side walls of the heat pipes transport the liquid phase vertically above the liquid level to increase the area of the liquid-vapor interface. Additionally, the solid metal strips which form the grooves provide a low impedance thermal path from the walls of the heat pipe to the liquid-vapor interface where evaporation and condensation occur. These two factors significantly increase the efficiency of the system. A divider plate having an X-shaped cross section separates the liquid phase from the high velocity vapor phase to prevent slugging under high energy transfer conditions. The divider plate is operative when the unit is disposed in either of two horizontal positions. The method and apparatus provides a means for fabricating a spiraled capillary groove by cutting the metal from the wall of the tube and raising and folding the cut metal over to provide a groove having a narrow opening for a maximum capillary action. The cutting tool has a curved cutting edge formed by the intersection of a planar surface and a cylindrical surface. Apparatus for driving the cutting tool is also described.

81 citations

Patent
15 Apr 1998
TL;DR: In this paper, a flat plate heat pipe is used to deliver heat from the interior of an electronic equipment enclosure through a connector to a removable external heat sink, where channels formed between adjacent rods are partially evacuated and injected with an evaporative fluid.
Abstract: A cooling system for an electronic equipment enclosure employs a flat plate heat pipe to deliver heat from the interior of the enclosure through a connector to a removable external heat sink. The heat pipe includes a metallic bottom plate having a depression therein containing a set of rods evenly spaced from one another. A top plate covers the bottom plate with the rods compressed therebetween. Channels formed between adjacent rods are partially evacuated and injected with an evaporative fluid. The fluid and its vapor circulate in the channels to convey heat from a warm end of the heat pipe to a cool end. The heat sink is of similar construction.

81 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
2023343
2022511
2021619
2020986
20191,301
20181,498