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Heat pipe

About: Heat pipe is a research topic. Over the lifetime, 30354 publications have been published within this topic receiving 243669 citations. The topic is also known as: heatpipe & heat-pipe.


Papers
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Patent
25 Jul 2000
TL;DR: In this article, a very flexible heat pipe is constructed of multiple layers of material laminated into the final structure, and the center of the symmetrical structure is a coarse screen which creates a vapor space.
Abstract: The invention is a very flexible heat pipe which is constructed of multiple layers of material laminated into the final structure. The center of the symmetrical structure is a coarse screen which creates a vapor space. The layers on either side of the screen are copper felt pads, and the outer casing is two layers of metal foil and a layer of polypropylene. The heat pipe constructed in this manner is so a flexible that when one outside surface is covered with adhesive, the heat pipe can essentially be used as tape or a stick-on heat transfer surface which conforms to a body being cooled.

79 citations

Journal ArticleDOI
TL;DR: In this article, a thermometer/heater for high heat-flux cooling of the CNT biwick structure is presented, which is a 100-nm-thick and 600 μm wide Z-shaped platinum wire resistor, fabricated on a thermally oxidized silicon substrate of a CNT sample to heat a 2 ×2 mm 2 wick area.
Abstract: With the increase in power consumption in compact electronic devices, passive heat transfer cooling technologies with high-heat-flux characteristics are highly desired in microelectronic industries. Carbon nanotube (CNT) clusters have high thermal conductivity, nanopore size, and large porosity and can be used as wick structure in a heat pipe heatspreader to provide high capillary force for high-heat-flux thermal management. This paper reports investigations of high-heat-flux cooling of the CNT biwick structure, associated with the development of a reliable thermometer and high performance heater. The thermometer/heater is a 100-nm-thick and 600 μm wide Z-shaped platinum wire resistor, fabricated on a thermally oxidized silicon substrate of a CNT sample to heat a 2 ×2 mm 2 wick area. As a heater, it provides a direct heating effect without a thermal interface and is capable of high-temperature operation over 800°C. As a thermometer, reliable temperature measurement is achieved by calibrating the resistance variation versus temperature after the annealing process is applied. The thermally oxidized layer on the silicon substrate is around 1-μm-thick and pinhole-free, which ensures the platinum thermometer/heater from the severe CNT growth environments without any electrical leakage. For high-heat-flux cooling, the CNT biwick structure is composed of 250 μm tall and 100 μm wide stripelike CNT clusters with 50 μm stripe-spacers. Using 1 ×1 cm 2 CNT biwick samples, experiments are completed in both open and saturated environments. Experimental results demonstrate 600 W/cm 2 heat transfer capacity and good thermal and mass transport characteristics in the nanolevel porous media.

79 citations

Journal ArticleDOI
TL;DR: In this paper, a comprehensive mathematical and physical model of miniature oscillating heat pipes (MOHPs) was built to simulate the two-phase flow behavior in vertical bottom heating mode Water was used as the working fluid.

79 citations

Journal ArticleDOI
TL;DR: In this paper, binary mixtures with a non-linear dependence of the surface tension with temperature were investigated as potential working fluids for wicked heat pipes to take advantage of Marangoni effect.

79 citations

Journal ArticleDOI
TL;DR: In this article, a detailed mathematical model predicting fluid flow and heat transfer through the thin film region is developed, considering the effects of inertial force, disjoining pressure, surface tension, and curvature.
Abstract: The evaporating thin film region is an extended meniscus beyond the apparent contact line at a liquid/solid interface. Thin film evaporation plays a key role in a highly efficient heat pipe. A detailed mathematical model predicting fluid flow and heat transfer through the thin film region is developed. The model considers the effects of inertial force, disjoining pressure, surface tension, and curvature. Utilizing the order analysis, the model is simplified and can be numerically solved for the thin film profile, interfacial temperature, meniscus radius, heat flux distribution, velocity distribution, and mass flow rate in the evaporating thin film region. The prediction shows that while the inertial force can affect the thin film profile, interfacial temperature, meniscus radius, heat flux distribution, velocity distribution, and mass flow rate, in particular, near the non-evaporating region, the effect can be neglected. It is found that a maximum velocity, a maximum heat flux, and a maximum curvature exist for a given superheat, but the locations for these maximum values are different.

79 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
2023343
2022511
2021619
2020986
20191,301
20181,498