Topic
Heat pipe
About: Heat pipe is a research topic. Over the lifetime, 30354 publications have been published within this topic receiving 243669 citations. The topic is also known as: heatpipe & heat-pipe.
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TL;DR: In this paper, an experimental investigation on the thermal performance of an air-to-air heat exchanger, which utilises heat pipe technology, was presented, which consisted of 7 loop heat pipes with finned evaporator and condenser sections.
79 citations
Patent•
23 May 2007
TL;DR: In this paper, a heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base, which is made of metal extrusion.
Abstract: A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.
79 citations
TL;DR: In this paper, a miniature loop heat pipe (mLHP) employing a 1.2 mm thick flat evaporator and a vapor line, liquid line and condenser with 1.0 mm thickness is presented.
79 citations
Patent•
13 Jan 2000TL;DR: In this paper, an integrated cooling device employing heat pipes for cooling an electronic component and a method of manufacturing the same was presented. But the authors did not specify a manufacturing process for the same.
Abstract: The present invention provides an integrated cooling device employing heat pipes for cooling an electronic component and a method of manufacturing the same. In one embodiment, the integrated cooling device includes a plate couplable to and supportable by the electronic component. The plate has at least one channel therein that presents an enhanced surface area. The cooling device further includes a sealed heat pipe having a heat-receiving portion fitted within the channel such that the enhanced surface area in contact with the heat pipe experiences an increased thermal communication between the plate and the heat pipe. The heat pipe also has a heat-removing portion that is distal from the heat receiving portion. Inside the heat pipe, a fluid, initially located in the heat-receiving portion of the heat pipe as a liquid, receives heat and evaporates to form a vapor that travels to the heat-removing portion. In the heat-removing portion of the heat pipe, the vapor condenses and cycles back o the heat-receiving portion.
79 citations
TL;DR: In this article, a theoretical model of an open oscillatory heat pipe taking gravity, surface tension, friction and pressure into account is presented, using vapour bubble, liquid plug and liquid film control volumes.
79 citations