Heat pipe

About: Heat pipe is a research topic. Over the lifetime, 30354 publications have been published within this topic receiving 243669 citations. The topic is also known as: heatpipe & heat-pipe.

Improvement on thermal performance of a disk-shaped miniature heat pipe with nanofluid

Abstract: The present study used nanofluid as the working medium for a disk-shaped miniature heat pipe (DMHP) The nanofluid is a suspension with gold nanoparticles of an average diameter of 17 nm in an aqueous solution An experimental system was set up to measure the thermal resistance of the disk-shaped miniature heat pipe (DMHP) with both nanofluid and DI-water A mounting base is designed and integrated with the DMHP as a heat spreader for a laser diode TO can package The present mounting base is made of aluminum (6061 T6) The measured results show that the thermal resistance of the DMHP varies with the charge volume and the type of working medium At the same charge volume, a significant reduction in the thermal resistance of the DMHP can be found if nanofluid is used instead of DI-water

Heat sink assembly with rotating heat pipe

Abstract: A portable computer includes a chassis having a heat producing electronic component mounted therein. A heat sink is mounted in the chassis adjacent the component. A heat pipe has a first end rotatably connected to the heat sink and extends to a second end engaged with the component. The heat pipe is rotatable so as to move the second end into and out of engagement with the component.

Arrangement for mounting and cooling high density tab IC chips

Abstract: A printed circuit board assembly includes a printed circuit board having a top side, a bottom side and a hole. A heat spreader which comprises a plate made of a material having high thermal conductivity is mounted on the bottom side of the printed circuit board. The plate includes a pedestal which extends up into the hole. A high density TAB IC chip is mounted on top of the pedestal and is electrically connected to pads on the top side of the printed circuit board. A heat pipe is mounted underneath the plate of the heat spreader through a mounting pad which is fixed to the heat pipe and which is made of a material having good thermal conductivity. In operation, heat generated by the chip during use is spread out by the heat spreader and then removed by the heat pipe.

Thermal Applications of Cellular Lattice Structures

Abstract: Numerous methods have recently emerged for fabricating cellular lattice structures with unit cells that can be repeated to create 3D space filling systems with very high interconnected pore fractions. These lattice structures possess exceptional mechanical strength resulting in highly efficient load supporting systems when configured as the cores of sandwich panels. These same structures also provide interesting possibilities for cross flow heat exchange. In this scenario, heat is transported from a locally heated facesheet through the lattice structure by conduction and is dissipated by a cross flow that propagates through the low flow resistant pore passages. The combination of efficient thermal conduction along the lattice trusses and low flow resistance through the pore channels results in highly efficient cross flow heat exchange. Recent research is investigating the use of hollow truss structures that enable their simultaneous use as heat pipes which significantly increases the efficiency of heat transport through the lattice and their mechanical strength. The relationships between heat transfer, frictional flow losses and topology of the lattice structure are discussed and opportunities for future developments identified.