Topic
Heat pipe
About: Heat pipe is a research topic. Over the lifetime, 30354 publications have been published within this topic receiving 243669 citations. The topic is also known as: heatpipe & heat-pipe.
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TL;DR: In this paper, a teaching-learning-based optimization (TLBO) algorithm is used for single objective as well as multi-objective design optimization of heat pipe, which is easy to implement, does not make use of derivatives and can be applied to unconstrained or constrained problems.
65 citations
TL;DR: In this paper, pore-scale analysis of thin-film evaporation through sintered copper wicks is performed using X-ray microtomography to generate geometrically faithful, feature-preserving meshes.
65 citations
Patent•
19 Dec 1996TL;DR: In this article, the inlet and return flow paths inside the cable are respectively connected to the in-let and outlet of a flow path which is in heat conductive relationship with the heat pipe in the probe handle.
Abstract: A device for improving thermal transfer inside an ultrasound probe and reducing heat build-up near the transducer face. The cable components (40) are used as heat pipes which conduct heat out of the probe handle (14). These heat pipes are coupled to an internal heat pipe (36) which is in heat conductive relationship with the transducer pallet (2). Thus, heat generated by the transducer array can be transferred, via the internal heat pipe plate and the cable heat pipes, away from the probe surface which contacts the patient. A heat conductive structure can be embedded in the overall shield braid of the cable (16). Suitable heat conductive structures include thread or wire made of material having a high coefficient of thermal conductivity, as well as narrow tubing filled with heat conductive fluid. Alternatively, inlet and return flow paths for cooling fluid are incorporated in the cable. The inlet and return flow paths inside the cable are respectively connected to the inlet and outlet of a flow path which is in heat conductive relationship with the heat pipe in the probe handle.
65 citations
TL;DR: In this paper, a multiple-effect diffusion solar still (MEDS) with a bended-plate design in multiple effect diffusion unit (MDU) was developed to solve the peel-off problem of wick material.
65 citations
Patent•
28 Mar 2002TL;DR: In this article, a computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess, with an evaporating end portion of the heat pipe overlying the die recess and being resiliently deflectable toward a phase change thermal pad mounted on the top side of the die and inset into the housing die.
Abstract: A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in the microprocessor bond line thickness and includes a sheet metal EMI shield wall overlying the microprocessor and having a condensing end portion of a thermosyphoning heat pipe secured to its bottom side, with an evaporating end portion of the heat pipe overlying the die recess and being resiliently deflectable toward a phase change thermal pad mounted on the top side of the die and inset into the housing die recess. A metal heat sink member is rotatably mounted on the heat pipe evaporating end portion and has a flat bottom side and an arcuate top side. The heat sink member is resiliently deflected into the die recess, and has its flat bottom side resiliently pressed against the thermal interface pad, by a spring plate portion of a clamping structure downwardly engaging the arcuate top side of the heat sink member. During operation of the microprocessor, die heat is transferred to the metal shield wall sequentially through the thermal pad, the heat sink member, and the heat pipe and then dissipated from the shield wall using fan-generated cooling air flowed along the shield wall.
65 citations