Topic
Heat pipe
About: Heat pipe is a research topic. Over the lifetime, 30354 publications have been published within this topic receiving 243669 citations. The topic is also known as: heatpipe & heat-pipe.
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Patent•
19 Jan 1977
TL;DR: In this paper, a heat pipe is equipped with fins in direct contact with the heat storing material while a second portion is in thermal contact with a heating medium in the heat exchanger.
Abstract: Heat of liquefaction and solidification is transmitted between a heat storing material undergoing the phase transition and a heating medium in a heat exchanger by means of a partly gaseous, partly liquid fluid sealed in a heat pipe a portion of which is received in the container for the aforementioned material, and which is equipped with fins in direct contact with the heat storing material while a second portion of the heat pipe is in thermal contact with the heating medium in the heat exchanger.
65 citations
TL;DR: Li et al. as mentioned in this paper presented an ultra-thin flat heat pipe (UTFHP) with a total thickness of 0.95mm and an inner height of 0.55mm, which provided strong capillary force as well as low flow resistance for the working fluid.
65 citations
Patent•
31 Jul 1978
TL;DR: In this article, a high performance heat pipe and a method for constructing it is described. Butler et al. describe a wick structure of sintered metal, which is formed directly into the heat pipe casing and contains simultaneously formed tunnels which permit the flow of large quantities of liquid with low pressure loss.
Abstract: A high performance heat pipe and the method for constructing it. A unique wick structure of sintered metal is formed directly into the heat pipe casing and contains simultaneously formed tunnels which permit the flow of large quantities of liquid with low pressure loss. A method of constructing a hybrid structure with heat pipe sections at both ends of a section used to transport the internal liquid and vapor over long distances is also included.
64 citations
01 Jan 2003
TL;DR: In this article, the authors propose to use a capillary pumped heat transport device (LHP) to transport large amounts of heat over long distances in small flexible lines for heat rejection.
Abstract: Thermal management of modern electronics has become a problem of significant interest due to the demand for power and reduction in packaging size. Requirements of next-generation microprocessors in terms of power dissipation and heat flux will certainly outgrow the capability of today’s thermal control technology. LHPs, like conventional heat pipes, are capillary pumped heat transport devices. They contain no mechanical moving part to wear out or require electrical power to operate. But unlike heat pipes, LHPs possess much higher heat transport capabilities enabling them to transport large amounts of heat over long distances in small flexible lines for heat rejection. In fact, a miniature ammonia LHP developed for a NASA space program is capable of transporting 60W over a distance of 1 meter in 1/16”O.D. stainless steel tubing. Therefore, miniature LHPs using water as the working fluid are excellent candidates to replace heat pipes as heat transports in electronic cooling systems. However, a number of operational issues regarding system performance, cost, and integration/packaging must be resolved before water LHPs can become a viable option for commercial electronics.Copyright © 2003 by ASME
64 citations
TL;DR: In this paper, the performance analysis of a finned U-shape heat pipe used for desktop PC-CPU cooling is presented by mounting the system vertically over a heat source situated inside a rectangular tunnel, and force convection is facilitated by means of a blower.
64 citations