Topic
Heat pipe
About: Heat pipe is a research topic. Over the lifetime, 30354 publications have been published within this topic receiving 243669 citations. The topic is also known as: heatpipe & heat-pipe.
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Patent•
23 Dec 2005
TL;DR: In this paper, a two-stage Peltier effect module is used to form a sealed wall between a sub-cool side and a warm side of a variable temperature cushion.
Abstract: A heat pump for use in a variable temperature cushion includes a housing with an inlet and a blower motor to draw in outside air to a two stage Peltier effect module that forms a sealed wall between a sub-cool side and a warm side of the housing. At the bottom of the housing are a pair of outlets and a condensate trap spanning across that facilitates condensate transfer from the cool side to the warm side for evaporation out of the warm side outlet. The heat pump also preferably includes a heat pipe from the warm side to the cool side to transfer heat and reheat the air (at a lower relative humidity) exiting through the cool outlet. Applications of the heat pump include a variable temperature cushion such as a seat and backrest, or bedding such as a pillow. An air conditioned pillowcase includes a pair of air impervious layers connected together forming a plenum with tubular spacer material inside and having a plurality of outlet vents around the perimeter. A multi-channel air duct connects the plenum to the heat pump, and further there is an optional noise cancellation system, both to minimize noise from operation of the heat pump.
64 citations
Patent•
14 Apr 1977
TL;DR: A heat pipe thermal mounting pipe has a very high thermal conductivity and provides a relatively uniform temperature surface for attaching of circuit card-mounted electronic components as mentioned in this paper, which can be used to cool circuit card mounted electronic components.
Abstract: Heat pipe technology may be utilized to cool circuit card-mounted electronic components A heat pipe thermal mounting pipe has a very high thermal conductivity and provides a relatively uniform temperature surface for attaching of circuit card-mounted electronic components It comprises thin evaporator and condenser wicks (for low temperature gradients) as well as a relatively porous sintered metal artery wick (for high heat transfer capability) The heat sink or other heat exchanger may be mounted at the edge of the thermal mounting plate in the vicinity of the condenser wick The electronic components are mounted in the vicinity of the evaporator wicks
64 citations
Patent•
24 Feb 2005
TL;DR: In this article, heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices. But they do not have a mounting surface with a coefficient of thermal expansion matching that of silicon.
Abstract: Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.
64 citations
Patent•
01 May 2000
TL;DR: In this article, a multifunctional capacillary system is located within and between a single compensation chamber (CC) and the evaporator of a loop heat pipe, which provides: vapor-liquid interface control for all gravity states from the micro-gravity condition of space (near 0-g) through the earth's gravitational condition (1-g), with liquid supply to the primary wick via wicking from the CC in microgravity and for all orientations (tilts) of the CC-evaporator assembly in earth gravity.
Abstract: A Multifunctional Capillary System is located within and between a single compensation chamber (CC) and the evaporator of a loop heat pipe. It provides: vapor-liquid interface control for all gravity states from the micro-gravity condition of space (near 0-g) through the earth's gravitational condition (1-g), with liquid supply to the evaporator via wicking from the CC in micro-gravity, and for all orientations (tilts) of the CC-evaporator assembly in earth gravity. As a single compensation chamber is used, dual compensation chamber penalties of weight and wide-temperature-variation are avoided. The system has combined, parallel wicking structure, paths, and joints for micro-gravity and 1-g liquid acquisition. The wick system is comprised of an axial-groove, evaporator-core secondary wick—concentric, contiguous, and in intimate contact with the primary evaporator wick. This secondary wick mates to a porous vane assembly in the CC. The design provides wicking continuity at this and at other joints within the system. In both the micro-gravity environment and under worst case 1-g orientation (CC below evaporator) the design can supply liquid to the primary wick under a wide range of temperature and power for steady state, startup, and transient conditions.
64 citations
Patent•
16 Sep 2003
TL;DR: In this article, the first heat dissipating element is mounted on the thermal conductive surface and a plurality of thermal conductors with thermal conductivity larger than that of the thermalconductive heat sink are mounted to the connecting surface.
Abstract: An integrated heat dissipation apparatus, having a first heat dissipating element, a second heat dissipating element, a thermal conductive heat sink and at least one L-shape heat pipe. The thermal conductive heat sink has a connecting surface and a thermal conductive surface opposing the connecting surface. The first heat dissipating element is mounted on the thermal conductive surface. A plurality of thermal conductors with thermal conductivity larger than that of the thermal conductive heat sink are mounted to the connecting surface. The L-shape heat pipe has two ends, including one end serial connecting to the second heat dissipating element, and the other end extending to connect with the thermal conductors on the thermal conductive heat sink.
64 citations