Topic
Heat pipe
About: Heat pipe is a research topic. Over the lifetime, 30354 publications have been published within this topic receiving 243669 citations. The topic is also known as: heatpipe & heat-pipe.
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Patent•
16 Sep 1994
TL;DR: A trough-shaped collector for solar radiation for steam generation is described in this paper, where heat is transferred transversely from the collector to the steam generator tube by a heat pipe structure.
Abstract: A trough-shaped collector for solar radiation for steam generation. A trough-shaped mirror extending in a longitudinal direction receives and reflects radiation onto an absorber line enclosing within its interior a steam generator tube. Heat is transferred transversely from the absorber line to the steam generator tube by a heat pipe structure.
64 citations
Patent•
19 Dec 1996
TL;DR: In this paper, a notebook computer display housing is pivotally connected to its associated CPU housing by a heat dissipating hinge structure having telescoped, relatively rotatable first and second sections respectively anchored to the CPU and display housings.
Abstract: A notebook computer display housing is pivotally connected to its associated CPU housing by a heat dissipating hinge structure having telescoped, relatively rotatable first and second sections respectively anchored to the CPU and display housings. The heat absorbing evaporation end of a first thermosyphoning heat pipe is conductively connected to a heat generating electronic component within the CPU housing, with the heat rejecting condensing end of the heat pipe defining the first hinge structure section. During computer operation, heat from the electronic component is sequentially transferred through the heat pipe and the second hinge structure section, in which the first hinge section is journaled, to the display housing for dissipation therefrom to ambient. Heat transfer from the second hinge structure section to the display housing is representatively facilitated by a second thermosyphoning heat pipe having an evaporator end received in an opening in the second hinge structure section, and laterally offset from the condensing end of the first heat pipe, and a condensing end thermally communicated with the display housing.
64 citations
Patent•
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08 Dec 2004
TL;DR: In this article, an apparatus is provided for dissipating heat from a semiconductor device that meets dimensional requirements for the semiconductor devices and provides enhanced cooling for the SVM, which provides a relatively large surface area for transferring heat away from a SVM.
Abstract: An apparatus is provided for dissipating heat from a semiconductor device that meets dimensional requirements for the semiconductor device and provides enhanced cooling for the semiconductor device. The apparatus provides a relatively large surface area for transferring heat away from a semiconductor device, and provides for enhanced coolant flow through or around the apparatus. The apparatus includes a channel that may accommodate a heat pipe to further enhance transfer of heat away from the semiconductor device.
64 citations
TL;DR: In this article, an experimental study was performed to investigate the thermal performance of heat pipes using SiC/water nanofluid as the working fluid, and four cylindrical copper heat pipes containing two layers of...
64 citations
Patent•
11 Jul 2007
TL;DR: In this article, a battery cooling system consisting of a battery mounted on a vehicle and used for travelling is presented. But the battery case is not used to store the battery, and the connection between the battery and the heat pipe is not discussed.
Abstract: PROBLEM TO BE SOLVED: To provide a battery cooling system for a vehicle having excellent cooling efficiency while suppressing noise. SOLUTION: This battery cooling system comprises a battery 2 mounted on a vehicle and used for travelling, a heat pipe heat-absorbing part 3 installed closely to the side of a battery case 1b in which the battery 3 is contained and absorbing heat by a refrigerant flowing therein, a heat pipe heat-dissipating part 4 installed on the outside of a cabin and dissipating heat by the refrigerant flowing therein, and connection parts 6, 7 for connecting the heat pipe heat-absorbing part 3 to the heat pipe heat-dissipating part 4 so that the refrigerant can be circulated therein. A heat pipe in which the refrigerant is circulated due to the condensation and evaporation of the refrigerant is formed of the heat pipe heat-absorbing part 3, the heat pipe heat-dissipating part 4, and the connection parts 6, 7. COPYRIGHT: (C)2008,JPO&INPIT
63 citations