Heat pipe

About: Heat pipe is a research topic. Over the lifetime, 30354 publications have been published within this topic receiving 243669 citations. The topic is also known as: heatpipe & heat-pipe.

Flexible thermal transfer apparatus for cooling electronic components

Abstract: A thermal transfer apparatus (10) adapted for thermal connection to a heat source (11) for conducting heat away from the heat source. The thermal transfer apparatus includes a container (12) which is substantially impermeable to fluid and forms an expandable compartment (16) that is substantially gas-free. A thermal transfer liquid (14) is positioned within the expandable compartment for thermal connection to the heat source. The thermal transfer liquid has a boiling point that is at or below an operating temperature of the heat source. When the heat source is in a non-operating state, the thermal transfer liquid is compressed and substantially fills the expandable compartment. When the heat source is in an operating state, the thermal transfer liquid conducts heat from the heat source. The liquid vaporizes and forms a vapor (13) within the expandable compartment which causes the expandable compartment to expand and create a vapor space above the liquid. A condenser (24) condenses the vapor into a condensate at a location remote from the heat source. The condensate then returns to the body of liquid for additional cooling of the heat source.

Advanced survivable space solar power system

Abstract: A photovoltaic electric power system for use in space A self contained sun powered electric power generating system comprising a fresnel mirror array made up of a plurality of quadrilateral mirrors individually mounted on a generally flat supporting structure with the mirrors aimed at a common point above the structure, a photovoltaic array positioned at the common point by a movable strut mechanism, heat exchanger means at the PV array to draw excess heat therefrom, coolant lines from the heat exchanger means running through the struts to transfer heat to heat pipes configured as flat panels at the edges of and perpendicular to the supporting structure, and positioning means attached to a separate structure to enable the system to track the sun The system is designed to fold into itself in the form of an elongate box for launch, maneuvering and protection

Pavement snow melting

Abstract: The design of pavement snow melting systems is presented based on criteria established by ASHRAE. The heating requirements depends on rate of snow fall, air temperature, relative humidity and wind velocity. Piping materials are either metal or plastic, however, due to corrosion problems, cross-linked polyethylene pipe is now generally used instead of iron. Geothermal energy is supplied to systems through the use of heat pipes, directly from circulating pipes, through a heat exchanger or by allowing water to flow directly over the pavement. Examples of geothermal and other systems in New Jersey, Wyoming, Virginia, Japan, Argentina, Canada, Switzerland and Oregon are presented.

Phase change material/heat pipe and Copper foam-based heat sinks for thermal management of electronic systems

Abstract: Phase change material (PCM) has been extensively used for their thermal management but due to low conductivity that hinders the performance of a system. Since heat pipe and porous materials both have high thermal conductivities, they can be used to form hybrid system with PCM which significantly enhance the heat transfer capability of PCM. In current research of heat pipe, copper foam (pore density 40PPI and porosity 93%) and PCM based heat sinks are used to inspect the thermal performance of heat sink with respect to time by varying heat fluxes. ‘‘RT-35HC” PCM, copper foam and gravity assisted heat pipe with and without cooling fan are used in experimental investigation. The results showed after 6000 s when charging ends hybrid cooling (Foam-PCM-HP) with fan have maximum temperature reduction i.e. 47%, 51% and 54% at heat flux of 2, 2.5 and 3 kW/m2 respectively. Similarly, for discharging hybrid cooling with fan showed excellent cooling results at all heat fluxes.

Cooling apparatus, system, and associated method

Abstract: A cooling apparatus, system, and method are provided. The cooling apparatus includes at least one printed circuit board having opposed major surfaces, and at least one electrical component or other heat source positioned on one major surface of the printed circuit board. The cooling apparatus also includes a pulsating heat pipe having at least a portion that is positioned to either extend along and proximate to one of the major surfaces or be embedded within the printed circuit board. As such, the pulsating heat pipe is capable of transferring heat from the printed circuit board.