Heat pipe

About: Heat pipe is a research topic. Over the lifetime, 30354 publications have been published within this topic receiving 243669 citations. The topic is also known as: heatpipe & heat-pipe.

Heat transfer behavior of a rectangular thermosyphon loop

Abstract: The thermal performance of a rectangular thermosyphon loop was studied. The analysis, using a one-dimensional approximation, the convectional friction factor, and an empirical correlation for the overall heat transfer in the cooler, was shown to be able to predict accurately the loop performance at steady state or approaching steady state, if the effective length was used to replace the geometeric length in the calculation of loop friction. The steady-state natural circulation flow solution obtained was shown to be a function of a dimensionless group PY or (NuGr/Pr) Y and agrees very well with the experimental results.

Heat pipe hinge structure for electronic device

Abstract: A heat pipe hinge structure for an electronic device comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is made of a high heat-conductive material disposed at a coupling portion in which a pair of housing portions to be opened and closed are coupled. The heat pipe hinge member comprises a heat pipe hinge main body to receive a heat from a heat generating component disposed in one of the pair of housing portions, and a heat pipe holding portion provided in a vicinity of the heat pipe hinge main body to pivotably hold by an elastic member at least a part of a first heat pipe disposed in other of the pair of housing portions. The hinge portion is made of a low heat-conductive material to fox the heat pipe hinge member on at least one housing portion of the pair of housing portions.

A powerful way of cooling computer chip using liquid metal with low melting point as the cooling fluid

Abstract: With the improvement of computational speed, thermal management becomes a serious concern in computer system. CPU chips are squeezing into tighter and tighter spaces with no more room for heat to escape. Total power-dissipation levels now reside about 110 W, and peak power densities are reaching 400–500 W/mm2 and are still steadily climbing. As a result, higher performance and greater reliability are extremely tough to attain. But since the standard conduction and forced-air convection techniques no longer be able to provide adequate cooling for sophisticated electronic systems, new solutions are being looked into liquid cooling, thermoelectric cooling, heat pipes, and vapor chambers. In this paper, we investigated a novel method to significantly lower the chip temperature using liquid metal with low melting point as the cooling fluid. The liquid gallium was particularly adopted to test the feasibility of this cooling approach, due to its low melting point at 29.7 °C, high thermal conductivity and heat capacity. A series of experiments with different flow rates and heat dissipation rates were performed. The cooling capacity and reliability of the liquid metal were compared with that of the water-cooling and very attractive results were obtained. Finally, a general criterion was introduced to evaluate the cooling performance difference between the liquid metal cooling and the water-cooling. The results indicate that the temperature of the computer chip can be significantly reduced with the increasing flow rate of liquid gallium, which suggests that an even higher power dissipation density can be achieved with a large flow of liquid gallium and large area of heat dissipation. The concept discussed in this paper is expected to provide a powerful cooling strategy for the notebook PC, desktop PC and large computer. It can also be extended to more wide area involved with thermal management on high heat generation rate.