Topic
Heat pipe
About: Heat pipe is a research topic. Over the lifetime, 30354 publications have been published within this topic receiving 243669 citations. The topic is also known as: heatpipe & heat-pipe.
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TL;DR: In this article, a micro channel separate heat pipe (MCSHP) that can use natural cold energy was developed to reduce the cooling energy consumptions of telecommunications stations (TSs) by exploring the optimal refrigerant filling ratio of MCSHP under different outdoor conditions and flow rates.
59 citations
Patent•
22 Oct 1981
TL;DR: In this article, a closed-loop heat transfer system consisting of a heat pipe and an external liquid-phase pump is described, where the working field in liquid phase absorbs heat from a heat source by evaporation.
Abstract: A closed-loop heat transfer system comprises a heat pipe (10) and an external liquid-phase pump (11). The heat pipe (10) includes an evaporator (12) and a condenser (13) connected by a conduit (14). The evaporator (12) is a hollow structure having an interior surface defining an evaporation region in which a working field in liquid phase absorbs heat from a heat source by evaporation. A capillary pumping structure, e.g., capillary channels (30) or a fine-mesh screen (41), is provided on or adjacent the interior wall of the evaporator (12). Evaporated working fluid laden with heat is thermodynamically driven substantially adiabatically via the conduit (14) from the evaporator (12) to the condenser (13), wherein the working fluid rejects heat to a heat sink by condensation. Condensed working fluid is thereupon returned from the condenser (13) to the evaporator (12) via external conduits (22, 15) by means of the liquid-phase pump (11). The capillary pumping structure inside the evaporator (12) serves to maintain a constant supply of working fluid in liquid phase adjacent the interior surface of the evaporator (12), thereby promoting efficient transfer of heat from the heat source to the working fluid in the evaporator (12). There is no limitation on the length of the heat pipe (10) caused by capillary pumping requirements of the system. Pursuant to 37 CFR 1.72(b), the foregoing abstract shall not be used for interpreting the scope of the claims herein.
59 citations
TL;DR: In this article, the authors investigated the thermal performances of a two-phase loop thermosyphon (TPLT) by examining the boiling heat transfer and instabilities, the thermodynamic cycles and the constituent and overall thermal resistances with the aid of boiling flow structures collected from visualization tests.
59 citations
TL;DR: In this article, a novel fin configuration is optimized based on both charging and discharging processes using Response Surface Method (RSM), and the optimum fin array is attached to heat pipe to improve its ability in increasing thermal penetration depth into the phase change materials (PCM).
59 citations
Patent•
29 Apr 1982
TL;DR: In this article, a low cost, compact, and efficient thermoelectric system was proposed for converting waste heat into electrical energy, which has no moving parts for converting heat into electricity.
Abstract: The present invention provides a low cost, compact, efficient thermoelectric system which has no moving parts for converting waste heat into electrical energy. The system includes a plurality of heat pipes having at least one substantially planar sidewall and integral heat collecting fins. The planar sidewalls on the heat pipes enable broad surface thermal contact with thermoelectric devices. The heat pipes and integral heat collecting fins provide for the efficient collection and transmission of waste heat to the side of the thermoelectric devices contacting the heat pipes at a location outside of the flow of waste heat. The other side of each thermoelectric device is either water or air cooled to establish a temperature differential thereacross for the generation of electrical energy. The heat pipes are preferably generally rectangular in cross section to provide opposed substantially planar surfaces for making efficient, low heat loss, broad surface thermal contact with the thermoelectric devices.
59 citations