Topic
Heat pipe
About: Heat pipe is a research topic. Over the lifetime, 30354 publications have been published within this topic receiving 243669 citations. The topic is also known as: heatpipe & heat-pipe.
Papers published on a yearly basis
Papers
More filters
Patent•
05 May 1997TL;DR: In this article, a semiconductor device is thermally coupled to the bottom external surface of a cover, which includes an external top surface, an external bottom surface and an inner cavity that comprises a heat pipe.
Abstract: An apparatus for spreading the heat generated by a semiconductor device. In one embodiment, a semiconductor device, such as a CPU, is mounted to a package substrate. A cover is attached to the package substrate creating a space therebetween for accommodating the semiconductor device. The package cover includes an external top surface and an external bottom surface and an inner cavity that comprises a heat pipe. The semiconductor device is thermally coupled to the bottom external surface of the cover.
158 citations
TL;DR: In this paper, a flat plate loop heat pipe (FPLHP) was used as a heat exchanger in the thermal management system of the lithium-ion battery for electric vehicle application.
158 citations
TL;DR: In this paper, the effect of Fe2O3/Kerosene nanofluid to the copper closed-loop oscillating heat pipe under the magnetic field for inclination angles ranging from 0° to 90°, under different heat inputs (10 − 90 W).
158 citations
TL;DR: In this article, the junction temperatures of high power LED arrays with and without heat pipe at the same air velocity of 7 m/s were reported to be 87.6 °C and 63.3 °C, respectively.
157 citations
TL;DR: In this paper, a preliminary dynamic relationship between the heat load and the output temperature of the closed-loop pulsating heat pipes (CLPHPs) is analyzed, and the optimal liquid filling ratio for start-up is about 41% for water, 52% for ethanol, and falls within the range from 35% to 41% of methanol.
156 citations