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Heat pipe

About: Heat pipe is a research topic. Over the lifetime, 30354 publications have been published within this topic receiving 243669 citations. The topic is also known as: heatpipe & heat-pipe.


Papers
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Journal ArticleDOI
TL;DR: In this paper, a two-dimensional finite volume based numerical model along with enthalpy-porosity technique is employed to simulate the phase change of storage media during the discharging mode.

115 citations

Journal ArticleDOI
TL;DR: In this article, an experimental investigation was conducted to determine the thermal behavior of micro heat pipe (MHP) arrays micromachined in silicon wafers, and two types of MHP arrays were tested, one with triangular channels, 230 μm wide, 170 μm deep, coupled with arteries.
Abstract: An experimental investigation was conducted to determine the thermal behaviour of micro heat pipe (MHP) arrays micromachined in silicon wafers. Two types of MHP arrays were tested, one with triangular channels, 230 μm wide, 170 μm deep, and the other with triangular channels, 500 μm wide, 340 μm deep, coupled with arteries. Both types of arrays were fabricated using an anisotropic etching process. Once fabricated, a plain Si wafer was used to seal the pipe array hermetically. Two working fluids were tested, ethanol and methanol. A polysilicon heater was used to supply the heat input, and cooling water flowing through the condenser was used as a heat sink. Fill charges from 0% up to 66% were tested. The axial temperature variation along the length of the pipe was measured using T-type thermocouples connected to a data acquisition system. The effective thermal conductivity was evaluated using the experimental temperature profiles and 3D thermal modelling. The results show a maximum improvement of 300% in effective thermal conductivity at high heat flux, which demonstrates enhanced heat transfer in a prototype with liquid arteries.

114 citations

Patent
02 May 2011
TL;DR: In this article, the authors present a cooling device consisting of an enclosure, an external heat rejection device, a primary cooling system including a loop heat pipe like device, and a secondary cooling system cooling a secondary heat rejecting component.
Abstract: A cooling device includes an enclosure, an external heat rejection device, a primary cooling system including a loop heat pipe like device. The LHPL device includes, an evaporator module, a condenser module, a vapor line, a liquid return line, and a working fluid having a liquid phase and a vapor phase. The evaporator module includes a component-evaporator heat spreader, an evaporator body, and an evaporator-component clamping mean. The evaporator body includes an evaporator outer shell, a working fluid inlet port, a compensation chamber, a working fluid exit port, and an evaporator wick having vapor escape channels. The condenser module includes a condenser coolant inlet, a condenser coolant exit, a condenser condensation channel, a condensation channel working fluid inlet, a condensation channel working fluid exit, and a condensation channel-coolant thermal interface further comprises a coolant passageway. The secondary cooling system including a secondary coolant, the secondary cooling system cooling a secondary heat rejecting component, wherein the secondary heat rejecting component is one of the plurality of other components.

114 citations

Journal ArticleDOI
TL;DR: In this article, a phase change thermal energy storage unit with copper foam was implemented in a shell-and-tube heat exchanger and compared with other heat exchangers such as finned copper tube, tube surrounded by carbon foam and a simple tube.

114 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
2023343
2022511
2021619
2020986
20191,301
20181,498