Topic
Heat pipe
About: Heat pipe is a research topic. Over the lifetime, 30354 publications have been published within this topic receiving 243669 citations. The topic is also known as: heatpipe & heat-pipe.
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22 Jul 2002TL;DR: In this paper, a heat sink provides efficient heat transfer from a heat-producing semiconductor device to the ambient air by spreading heat from a spreader plate in contact with the device and distributing heat to multiple cooling fins.
Abstract: A heat sink provides efficient heat transfer from a heat-producing semiconductor device. Heat pipes project from a spreader plate in contact with the device and distribute heat to multiple cooling fins. The fins are arranged for maximum contact with the ambient air. An active fan is internally disposed within the fins, for further cooling efficiency. The heat sink may be permanently affixed to a printed circuit board holding the semiconductor device or the heat sink may be attached and released thereto without need of tools. A base plate maintains spring-like compliance of the printed circuit board while allowing sufficient clamping force on the heat sink to sustain thermal contact with the heat-producing surface during shock-loading.
108 citations
TL;DR: In this paper, an advanced heat pipe mechanism that has the potential of achieving heat flux capabilities over 250 W/cm/sup 2 was discussed, which utilizes thermally driven pulsating two-phase flow to achieve high heat flux capability and heat transfer coefficient.
Abstract: This paper discusses an advanced heat pipe mechanism that has the potential of achieving heat flux capabilities over 250 W/cm/sup 2/. The mechanism utilizes thermally driven pulsating two-phase flow to achieve high heat flux capability and heat transfer coefficient. A simplified hydrodynamic model in was developed to guide the proof-of-concept heat pipe design. A more detailed numerical model was also developed and will be solved to predict the heat pipe's thermal performance. Test results of proof-of-concept heat pipes verified the heat flux capability of the advanced mechanism and the accuracy of the simplified model. Pulsating heat pipes are feasible approaches to removing increasing heat dissipation densities in electronic equipment.
108 citations
TL;DR: In this paper, an experimental study was carried out to investigate the effects of aqueous CuO nanofluids on thermal performance of a horizontal mesh heat pipe working at steady sub-atmospheric pressures.
108 citations
TL;DR: In this paper, a thermal equivalent circuit model (TECM) is developed to describe the thermal behavior of the battery module, and the TECM has potential usefulness in the real-time prediction of temperature, analysis of large battery pack and development of control strategy.
107 citations
TL;DR: In this article, the authors summarized the research outcomes of various experimental and numerical studies, and provided an overview of heat transfer mechanisms responsible for the change in thermal performance of heat pipes.
107 citations