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Heat sink

About: Heat sink is a(n) research topic. Over the lifetime, 44009 publication(s) have been published within this topic receiving 526861 citation(s). The topic is also known as: heatsink.

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Journal ArticleDOI
Abstract: The problem of achieving compact, high-performance forced liquid cooling of planar integrated circuits has been investigated. The convective heat-transfer coefficient h between the substrate and the coolant was found to be the primary impediment to achieving low thermal resistance. For laminar flow in confined channels, h scales inversely with channel width, making microscopic channels desirable. The coolant viscosity determines the minimum practical channel width. The use of high-aspect ratio channels to increase surface area will, to an extent, further reduce thermal resistance. Based on these considerations, a new, very compact, water-cooled integral heat sink for silicon integrated circuits has been designed and tested. At a power density of 790 W/cm2, a maximum substrate temperature rise of 71°C above the input water temperature was measured, in good agreement with theory. By allowing such high power densities, the heat sink may greatly enhance the feasibility of ultrahigh-speed VLSI circuits.

3,666 citations

01 Nov 1997
Abstract: Part 1 Fundamentals: basic concepts of thermodynamics and heat transfer heat conduction steady heat conduction transient heat conduction numerical methods in heat transfer forced convection natural convection boiling and condensation radiation heat transfer heat exchangers mass transfer. Part 2 Applications: heating and cooling of buildings refrigeration and freezing of foods cooling of electronic equipment property tables and charts (SI units and English units) about the software.

2,029 citations

Journal ArticleDOI
A. Giesen1, Helmut Hügel1, A. Voss1, Klaus Wittig1, U. Brauch, H. Opower 
Abstract: A new, scalable concept for diode-pumped high-power solid-state lasers is presented The basic idea of our approach is a very thin laser crystal disc with one face mounted on a heat sink This allows very high pump power densities without high temperature rises within the crystal Together with a flat-top pump-beam profile this geometry leads to an almost homogeneous and one-dimensional heat flux perpendicular to the surface This design dramatically reduces thermal distortions compared to conventional cooling schemes and is particularly suited for quasi-three-level systems which need high pump power densities Starting from the results obtained with a Ti:Sapphire-pumped Yb:YAG laser at various temperatures, the design was proved by operating a diode-pumped Yb:YAG laser with an output power of 44 W and a maximum slope efficiency of 68% From these first results we predict an exctracted cw power of 100 W at 300 K (140 W at 200 K) with high beam quality from a single longitudinally pumped Yb: YAG crystal with an active volume of 2 mm3 Compact diode-pumped solid-state lasers in the kilowatt range seem to be possible by increasing the pump-beam diameter and/or by using several crystal discs

979 citations

Journal ArticleDOI
Abstract: The limitation of hot spot cooling in microchips represents an important hurdle for the electronics industry to overcome with coolers yet to exceed the efficiencies required. Nanotechnology-enabled heat sinks that can be magnetophoretically formed onto the hot spots within a microfluidic environment are presented. CrO2 nanoparticles, which are dynamically chained and docked onto the hot spots, establish tuneable high-aspect-ratio nanofins for the heat exchange between these hot spots and the liquid coolant. These nanofins can also be grown and released on demand, absorbing and releasing the heat from the hot spots into the microfluidic system. It is shown that both high aspect ratio and flexibility of the fins have a dramatic effect on increasing the heat sinking efficiency. The system has the potential to offer a practical cooling solution for future electronics.

854 citations

Journal ArticleDOI
Issam Mudawar1
TL;DR: This paper explores the recent research developments in high-heat-flux thermal management and demonstrates that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme.
Abstract: This paper explores the recent research developments in high-heat-flux thermal management. Cooling schemes such as pool boiling, detachable heat sinks, channel flow boiling, microchannel and mini-channel heat sinks, jet-impingement, and sprays, are discussed and compared relative to heat dissipation potential, reliability, and packaging concerns. It is demonstrated that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme. It is also shown that extensive fundamental electronic cooling knowledge has been amassed over the past two decades. Yet there is now a growing need for hardware innovations rather than perturbations to those fundamental studies. An example of these innovations is the cooling of military avionics, where research findings from the electronic cooling literature have made possible the development of a new generation of cooling hardware which promise order of magnitude increases in heat dissipation compared to today's cutting edge avionics cooling schemes.

745 citations

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No. of papers in the topic in previous years