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Showing papers on "Heat sink published in 1984"


Patent
15 Nov 1984
TL;DR: In this paper, a signal light unit having a heat dissipating function includes a heat radiator member (4) which is formed of a material having good thermal conductivity and is disposed on the reverse side of a base (3) on which are arranged a multiplicity of light-emitting diodes serving as a light source of the signal light.
Abstract: A signal light unit having a heat dissipating function includes a heat radiator member (4) which is formed of a material having good thermal conductivity. The heat radiator member (4) is disposed on the reverse side of a base (3) on which are arranged a multiplicity of light-emitting diodes (1) serving as a light source of the signal light. The heat radiator member (4) is generally constituted by an assembly of fins. It is not always necessary to provide the heat radiator member (4) integrally with the reverse surface of the base (3). An endothermic member (12) may be interposed between the heat radiator member (4) and the reverse surface of the base (3).

338 citations


Book
01 Jan 1984
TL;DR: In this paper, a liquid partially fills an array of micron-wide repentant capillaries in the heat sink substrate, so that surface tension holds the polished back of an IC in intimate thermal contact with the sink.
Abstract: : The design of high-speed integrated circuits and systems is often constrained by thermal considerations. As late as 1981 it was authoritatively predicted that the maximum achievable power flux for liquid-cooled, densely-packed integrated circuits (ICs) would be about 20 W/sq cm. Convective heat-transfer theory indicates that well over 1000 W/sq cm can be compactly removed from ICs at normal operating temperatures, provided microscopic (e.g., 50-microns wide) extended-surface structures are used. The difficulty of constructing high-conductance, low-stress thermal interfaces between ICs and heat sinks suggests the use of an integral heat sink. Accordingly, IC microfabrication techniques were employed to design, fabricate, and test novel, ultracompact water-cooled, laminar-flow, optimized plate-fin and pin-fin heat sinks directly within standard-thickness silicon substrates. Worst-case thermal resistances as low as 0.083 deg C/W were measured from 1-sq cm thin-film resistors (e.g., a 108 deg C temperature rise at 1309 W), in good agreement with predictions. Further increases in heat transfer are achievable. The use of integral liquid-cooled heat sinks in multichip systems presents potential yield, reliability, cost and packaging problems. Attachment of unmodified ICs to micro-heat sinks seems a more attractive approach. A novel die-attachment technique has been developed which avoids the problems of conventional attachments. In this technique, a liquid partially fills an array of micron-wide repentant capillaries in the heat sink substrate, so that surface tension holds the polished back of an IC in intimate thermal contact with the heat sink. The bond is void-free, virtually stress-free, long-lived, and allows repeated detachment and replacement of ICs without damaging the heat sink substrate. The repentant grooves were fabricated by a novel process using electroless plating of nickel onto vertical silicon microgrooves.

217 citations


Patent
20 Sep 1984
TL;DR: A sintered polycrystalline diamond compact having an integral metallic heat sink bonded to and covering at least the outer diamond surface is used to increase compact life when the compact is used for material removal without a fluid coolant as discussed by the authors.
Abstract: A sintered polycrystalline diamond compact having an integral metallic heat sink bonded to and covering at least the outer diamond surface is used to increase compact life when the compact is used for material removal without a fluid coolant.

150 citations


Patent
18 Jan 1984
TL;DR: In this paper, a housing assembly for retaining components of an electronic engine control system is described, which includes electrical and sensor elements mounted on printed circuit boards including heat producing elements on a first board and logic, memory and processor elements together with sensors on a second board.
Abstract: A housing assembly for retaining components of an electronic engine control system is disclosed. Components include electrical and sensor elements mounted on printed circuit boards including heat producing elements on a first board and logic, memory and processor elements together with sensors on a second board. The first board is enclosed within and connected to a main housing so that it provides a heat sink. The second board is electrically connected to the first board within the housing and supports both a fuel command sensor and also engine pressure sensors.

109 citations


Journal ArticleDOI
TL;DR: In this article, the authors show that for laminar flow in confined channels, the heat transfer coefficient is inversely proportional to the width of the channel, and that the area of the heat sink in contact with the coolant contributes a significant fraction of the thermal resistance of a package.
Abstract: The heat transfer between the coolant anti the heat sink contributes a significant fraction of the thermal resistance of a package. It has been widely recognized that the heat transfer can be increased by increasing the area of the heat sink in contact with the coolant, and therefore the use of fins is common. However it has not been generally recognized that for laminar flow in confined channels, the heat transfer coefficient is inversely proportional to the width of the channel. Narrow channel forced air heat sinks have been designed, built, and tested. Three different channel widths, 5, 10, and 25 mils, were investigated. The design of the sinks permit integrated circuits (IC's) on 1/2 in centers and printed circuit (PC) boards on I in centers. The measured values of individual heat sinks with 30 I/min air flow are 5.5, 3.7, and 3.4°C/W for 25,10, and 5 mil channel widths, respectively. These values are in good agreement with calculated values. A 16 chip package with chips on 1/2 in centers was assembled utilizing 10 mil channel width heat sinks. A plenum fitted over the sinks supplied air to each of the sinks from a single source. The measured values of thermal resistance of the four center dies were between 5.3 and 5.9°C/W. If the chips are mounted directly on the sink instead of on the alumina substrate, the thermal resistance would be reduced by about 2°C/W.

95 citations


Journal ArticleDOI
TL;DR: In this paper, the creep equations for cold-worked Zr-2.5 wt% Nb pressure tubes were developed from uniaxial creep tests and applied to CANDU reactors.

71 citations


Patent
31 Jul 1984
TL;DR: In this article, a semiconductor loading part is formed thicker than the average thickness of the lead frame to improve the radiating capacity while reducing transient heat resistance and restraining temperature rise in case of switching operations.
Abstract: PURPOSE:To extend the life of titled device by a method wherein a semiconductor loading part is formed thicker than average thickness of lead frame to improve the radiating capacity while reducing especially transient heat resistance and restraining temperature rise in case of switching operations. CONSTITUTION:A semiconductor loading part 4 to be a bed 31 of lead frame is formed thicker than average thickness of lead frames 3. Then a semiconductor element pellet 5 is mounted on the semiconductor loading part 4 through the intermediary of a bonding member 6 such as solder etc. and then an electrode on the pellet 5 is connected to an inner lead of lead frame 3 by a metallic fine wire 7. Later a heat sink 2 is placed below a cavity of a transfer mold metal die and then the lead frame 3 is placed to be resin-formed. Finally the space between the semiconductor loading part 4 and the heat sink 2 is filled with thermoconductive epoxy sealing resin 1.

67 citations


Patent
10 May 1984
TL;DR: In this paper, a heat sink housing for electronic components comprises a metal tube having four walls formed with internal and external ridges and grooves, and two cover plates are attached to open ends of the tube to form a closed compartment in the tube.
Abstract: A heat sink housing for electronic components comprises a metal tube having four walls formed with internal and external ridges and grooves. The inside ridges and grooves removably support circuit boards and separate circuit members. The external ridges maximize radiation of heat from inside the tube. Two cover plates are removably attached to open ends of the tube to form a closed compartment in the tube.

66 citations


Journal ArticleDOI
TL;DR: In this paper, ground heat losses from solar ponds are modelled numerically for various perimeter insulation strategies and several solar pond sizes, and the numerical results are used to derive coefficients for a semi-empirical equation describing ground heat loss as a function of pond area, pond perimeter and insulation strategy.

64 citations


Journal ArticleDOI
Robert W. Keyes1
TL;DR: In this article, a novel structure for cooling silicon chips involving passage of water through fins etched in the back of the chips has been described in the literature, and the properties of silicon and the nature of the structure are such that approximations that allow an analytic solution to the heat transfer problem in the structure can be introduced.
Abstract: A novel structure for cooling silicon chips involving passage of water through fins etched in the back of the chips has recently been described in the literature. The properties of silicon and the nature of the structure are such that approximations that allow an analytic solution to the heat transfer problem in the structure can be introduced. Formulas for the fin and channel dimensions that provide optimum cooling under various conditions can then be derived. The results are also presented in graphical form and by means of examples.

62 citations


Journal ArticleDOI
TL;DR: In this paper, the authors discuss the resource for radiative cooling and its implementation with thin solid films (SiO 0.6 N 0.2 coatings on Al) and with slabs of certain gases (C 2 H 4, C 2H 4 O and NH 3 backed by Al).

Patent
06 Jul 1984
TL;DR: In this paper, a heat exchange attachment device for integrated circuits is presented which eliminates any need for contact with adhesive pastes or solder, and a snap-on holding piece permits a finned cooling unit to be threaded through an aluminum base plate attached to the pin grid array package so that a threaded shaft of the cooling unit may be screwed into adjustable contact with a beryllium oxide disk mounted on the integrated circuit package.
Abstract: A heat exchange attachment device for integrated circuits is presented which eliminates any need for contact with adhesive pastes or solder. A snap-on holding piece permits a finned cooling unit to be threaded through an aluminum base plate attached to the pin grid array package so that a threaded shaft of the cooling unit may be screwed into adjustable contact with a beryllium oxide disk mounted on the integrated circuit package.

Patent
Kenji Oogaki1, Hiroshi Sato1
30 Mar 1984
TL;DR: In this article, a heat radiator assembly conducts the heat generated by electronic parts mounted on a printed board, such as integrated circuits, resistors, and semiconductor elements, through first and second heat sinks to a shield case, so that the heat is radiated therefrom and thus natural air cooling is effected.
Abstract: A heat radiator assembly conducts the heat generated by electronic parts mounted on a printed board, such as integrated circuits, resistors, and semiconductor elements, through first and second heat sinks to a shield case, so that the heat is radiated therefrom and thus natural air cooling is effected. The first heat sink is provided on the shield case, and the second heat sink is passed through a through hole in the shield case and the first heat sink and is threadedly engaged with the first heat sink, to engage the electronic parts. If necessary, a lock nut or a lock screw may be used for fixing the threaded engagement of the second heat sink.

Patent
Toshihiko Watari1
29 Nov 1984
TL;DR: In this article, an integrated circuit chip package has a substrate, a plurality of integrated circuit chips, a heat radiation plate and a heat sink rigidly mounted on the heat radiation cover.
Abstract: An integrated circuit chip package has a substrate, a plurality of integrated circuit chips, a plurality of heat radiation plates, a heat radiation cover, a heat sink rigidly mounted on the heat radiation cover and a plurality of terminals. The plurality of integrated circuit chips are each provided with a plurality of flexible beam leads on a body thereof and electrically and mechanically connected with the substrate via the beam lead. The heat radiation plates are each composed of a good thermal conductor and rigidly joined with the integrated circuit chips and a one-to-one correspondence by a first adhesive material. A radiation cover is also composed of a good thermo conductor and covers the chip mounting surface of the substrate and is held in contact with the heat radiation plates through a second adhesive material. The plurality of terminals are attached on a chip non-mounting surface of the substrate for input and output of signals to and from the chips and for supplying a voltage from the power source to the chips.

Patent
31 Aug 1984
TL;DR: In this article, a heat pipe heat sink for air cooling of semiconductor devices characterized by arranging heat pipes in a zigzag form toward the direction of air flow around the fin section in the heat sinks is presented.
Abstract: A heat pipe heat sink for air cooling of semiconductor devices characterized by arranging heat pipes in a zigzag form toward the direction of air flow around the fin section in the heat sinks. A block for mounting the semiconductor device is fitted to the heat-in sections of the plural heat pipes arranged in parallel, and a large number of radiating fins crossing over the heat pipes are fitted to the heat-out sections of the heat pipes protruding from the block.

Patent
01 Nov 1984
TL;DR: An internally cooled semiconductor package including a wafer-like semiconductor body (diodes 12) with at least two electrical elements, one at a relatively flat surface (18) of the body, is considered in this paper.
Abstract: An internally cooled semiconductor package including a wafer-like semiconductor body (diodes 12) with at least two electrical elements, one at a relatively flat surface (18) of the body. A wall (20, 22) if high electrical and heat conductive material abuts the flat surface of the semiconductor body to be in good heat conductive relation therewith and in electrical contact with the same. A fluid flow heat exchanger (10) is on the other side of the wall in heat exchange relation therewith and along with the wall and other components serves to encapsulate the semiconductor.

Patent
02 May 1984
TL;DR: In this article, a platen is used to define a thermal transfer region between a semiconductor wafer and a heat sink or source in a vacuum processing chamber, and a fluid-actuated valve is closed when the pressure in the chamber reaches a predetermined value.
Abstract: Apparatus for providing thermal transfer between a semiconductor wafer and a heat sink or source in a vacuum processing chamber includes a platen against which the wafer is sealed to define a thermal transfer region therebetween. The platen includes a passage for gas flow between the chamber and the thermal transfer region and a conduit for circulation of a cooling fluid. The platen further includes a fluid-actuated valve responsive to the pressure of the cooling fluid for closing the passage. When the pressure in the chamber reaches a predetermined value, the cooling fluid is turned on and closes the valve. Gas at the predetermined pressure, typically in the range of 0.5 to 100 Torr, is trapped in the thermal transfer region and conducts thermal energy. In a preferred embodiment, a plurality of platens are positioned on a rotating disc in an ion implantation system.

Patent
20 Jun 1984
TL;DR: In this paper, a synthetic diamond heat sink which can be easily shaped and which ensures a consistently high thermal conductivity in which the diamond is a Type Ib diamond containing 5 to 100 ppm nitrogen is presented.
Abstract: A synthetic diamond heat sink which can be easily shaped and which ensures a consistently high thermal conductivity in which the diamond is a Type Ib diamond containing 5 to 100 ppm nitrogen. The synthetic diamond crystal has a shape approaching that of a hexahedron with a high proportion of (100) planes and is synthesized by heating a carbon source, a solvent and a diamond seed crystal in the stability region of diamond at a high pressure. The temperature gradient between the carbon source and the seed crystal is adjusted to cause diamond growth on the seed crystal. The solvent employed is selected from the group of cobalt, nickel, iron, chromium and manganese. The diamond crystal is caused to grow as the temperature of the solvent is gradually decreased at a rate of 0.15 to 10°C per hour so that the temperature of the area where growth occurs on the seed crystal is held constant within a range the lower limit of which is a temperature 20°C higher than the melting point of the solvent and carbon source system and the upper limit of which is a temperature 40°C higher than the lower limit.

Patent
19 Jul 1984
TL;DR: An improved rotary magnet thermal generator as mentioned in this paper, having an array of magnets in alternating disposition coaxially disposed about and parallel with the shaft of a motor driving the rotary array and having a copper heat absorber and a ferro-magnetic plate fixed on a face of the heat absorbing plate, includes as efficiency improver a plurality of heat sink plates extending beyond the ferromagnet plate into a plenum through a respective plurality of close-fitting apertures.
Abstract: An improved rotary magnet thermal generator system of the type having an array of magnets in alternating disposition coaxially disposed about and parallel with the shaft of a motor driving the rotary array and having a copper heat absorber and a ferro-magnetic plate fixed on a face of the heat absorber, includes as efficiency improver a plurality of heat sink plates extending beyond the ferro-magnet plate into a plenum through a respective plurality of close-fitting apertures. In a further embodiment the heat sink plates are in thermal contact with sinusoidally convoluted tubing that both increases surface area and provides for optional heating of gases and/or fluids at the same time.

Book ChapterDOI
01 Jan 1984
TL;DR: In this article, the authors summarize the basic theory of heat conduction and show that convection only intervenes through boundary conditions in solid-fluid interfaces and radiation is usually negligible, except eventually when setting up boundary conditions.
Abstract: Before dealing with the application of the Boundary Element Method (BEM) to heat transfer problems we shall summarize the basic theory of heat conduction. It is known from experience that heat flows from the hotter parts of a body to the cooler. The mechanisms responsible for this phenomena are conduction, radiation and convection. Since we are concerned in this paper exclusively with solid bodies, convection only intervenes through boundary conditions in solid-fluid interfaces. Radiation is usually negligible, except eventually when setting up boundary conditions.

Patent
20 Jan 1984
TL;DR: A transitory or temporary storage for highly radioactive waste, in which the transitory storage incorporates containers for the receipt of the waste, and a cooling system for the discharge of the heat which is produced during the storage of waste as mentioned in this paper.
Abstract: A transitory or temporary storage for highly radioactive waste, in which the transitory storage incorporates containers for the receipt of the waste, and a cooling system for the discharge of the heat which is produced during the storage of the waste. The cooling system incorporates a cooling air duct, as well as a coolant circuit for a coolant which is conveyed in a closed circuit between coolant conduits which conduct off heat generated in the storage space and a heat sink arranged externally of the storage space.

Patent
08 Mar 1984
TL;DR: In this article, a heat sink is constructed from two plate-like heat sink parts, the latter being bonded by stepping hydraulic resistances from the centre of the heat sink to improve uniformity of cooling.
Abstract: The heat sink has a plurality of cooling ducts (4) and is assembled from two plate-like heat sink parts (2, 3), the latter expediently being bonded. The cooling ducts (4) are connected to a common inlet opening for the cooling liquid and to a common outlet opening. The cooling ducts (4) are designed with hydraulic resistances stepped from the centre, which is achieved in one variant by means of expanding cross-sections of the cooling ducts (4). It is expedient to use metal or ceramic as the material. The heat sink is of very simple design, and the stepping of the hydraulic resistances improves the uniformity of cooling.

Patent
06 Mar 1984
TL;DR: In this article, an improved engine system is provided which includes a synthetic low temperature sink that is developed in conjunction with an absorbtion-refrigeration subsystem having inputs from an external low-grade heat energy supply (21) and from external source of cooling fluid (24).
Abstract: An improved engine system is provided which includes a synthetic low temperature sink that is developed in conjunction with an absorbtion-refrigeration subsystem (23) having inputs from an external low-grade heat energy supply (21) and from an external source of cooling fluid (24). A low temperature engine is included which has a high temperature end (22) that is in heat exchange communication with the external heat energy source (21) and a low temperature end (36) in heat exchange communication with the synthetic sink provided by the absorbtion-refrigeration subsystem (23). By this invention, it is possible to vary the sink temperature as desired, including temperatures that are lower than ambient temperatures such as that of the external cooling source. This feature enables the use of an external heat input source that is of a very low grade because an advantageously low heat sink temperature can be selected.

Journal ArticleDOI
TL;DR: In this article, the authors describe a new method of cooling of planar VLSI circuits which allows one to obtain chip heat fluxes in excess of 500 W/cm2 with acceptable temperature rises.

Patent
20 Sep 1984
TL;DR: A cooling means for a circuit chip device employs a noneutectic metal alloy to form a low thermal resistance bridging interface between the surface of the chip device and a heat sink as discussed by the authors.
Abstract: A cooling means for a circuit chip device employs a noneutectic metal alloy to form a low thermal resistance bridging interface between the surface of the chip device and a heat sink. The alloy has a solidus-liquidus temperature range such that the solidus is slightly below the maximum operating temperature of the chip, and thus has the capability to reestablish and maintain the interface at a low thermal resistance if stressed during circuit operation, even with a low current load at the interface of the chip device and the heat sink. In addition to the chip interface, the above cooling means is also used at other interfacial regions of the heat sink, dependent on design, to achieve very low thermal resistance.

Journal ArticleDOI
TL;DR: In this article, a heat-sink structure for single crystalline silicon films over SiO2 has been designed for best utilization of temperature gradients during resolidification process induced by an incident cw Ar laser beam.
Abstract: Complete single crystalline silicon films over SiO2 have been produced with a heat‐sink structure designed for best utilization of temperature gradients during resolidification process induced by an incident cw Ar laser beam. The structure includes device regions with thin SiO2 layers which act as a heat sink to the substrate and the peripheral regions with thick SiO2 layers. By using this technique, residual grain boundaries in the laser recrystallized silicon over insulator can be eliminated. N‐channel metal‐oxide‐semiconductor field‐effect transistors fabricated in the recrystallized silicon films with a heat‐sink structure exhibit good device characteristics, having a surface electron mobility of 500 cm2/V s which is comparable to that of bulk devices.

Patent
05 Nov 1984
TL;DR: In this article, a plurality of adsorption containers are provided which are separated into heater adsorber zones and condenser evaporator zones, which are successfully rotated through flow segments which form a passageway for heat carrier flows.
Abstract: A plurality of adsorption containers are provided which are separated into heater adsorber zones and condenser evaporator zones. The zones are successfully rotated through flow segments which form a passageway for heat carrier flows. The heater adsorption zones contain an adsorption substance from which an operating substance is extracted by adsorbing heat from a heat carrier flow and is again adsorbed by emitting heat to a further heat carrier flow. The operating substance condenses and evaporates by means of a heat exchange with further heat exchangers. The adsorption devices are suitable as cooling devices and heat pumps as well as heat transformers and heat exchangers.

Journal ArticleDOI
TL;DR: In this article, a general procedure for estimating the seasonal performance of solar-assisted heat pumps with refrigerant-filled collectors is presented, which accounts for variations in collector design and orientation and also for heat pump capacity and efficiency.
Abstract: A general procedure is presented for estimating the seasonal performance of solar-assisted heat pumps with refrigerant-filled collectors. The procedure accounts for variations in collector design and orientation and also for heat pump capacity and efficiency. The results from this design procedure for space heating applications are compared against those for both conventional heat pumps and liquid solar systems. The effects of collector area and design, heat pump size and degradation due to cycling, and energy storage are discussed. For space heating, uncovered collector heat pump systems have better performance than both conventional air-source heat pumps and covered collector heat pump systems over a wide range of collector areas. The cooling performance of a collector heat pump system is inferior to that of conventional heat pumps.

Patent
24 Aug 1984
TL;DR: In this paper, a compensating roll pin (10) is disclosed for use in securing a heat sink (12) to a circuit board (14), which is formed by rolling a deformable material, such as annealed spring steel, into a generally cylindrical shape.
Abstract: A compensating roll pin (10) is disclosed for use in securing a heat sink (12) to a circuit board (14). The roll pin (10) is formed by rolling a deformable material, such as annealed spring steel, into a generally cylindrical shape. The pin (10) has first and second end portions (22, 26) separated by a middle portion (24) of increased external diameter. The first end portion (22) can be inserted in the aperture (34) in the heat sink (12) and the middle portion (24) can be deformed within the aperture (34) to form a tight fit between the pin and heat sink. A substantial part of the middle portion (24) remains outside the aperture (34) in the heat sink. The second end portion (26) can be slidably inserted within the hole (38) in the circuit board (14) for an interference fit therebetween. The middle portion (24) forms a stop to prevent further insertion of the roll pin (10) within the circuit board (14) so that a gap of predetermined distance separates the heat sink and circuit board to enhance cooling.

Patent
24 Aug 1984
TL;DR: In this article, a fastener is provided for mounting a heat sink to the surface of a circuit board, which includes a body having structure extending from the body for engaging the heat sink.
Abstract: A fastener is provided for mounting a heat sink to the surface of a circuit board. The fastener includes a body having structure extending from the body for engaging the heat sink. The body further includes structure extending in a direction opposite the engaging structure for contacting the surface of the circuit board. The contacting structure includes a surface parallel to the surface of the circuit board and is coated with a solder-promoting material for surface mounting the heat sink to the circuit board.