Showing papers on "Heat sink published in 1986"

Composite heat transfer means

Abstract: A thermal heat transfer member is disclosed for use with electronic or microwave systems. The thermal heat transfer member comprises a generally planar composite member in which elongated high thermal conductivity fibers are disposed within a matrix material. The matrix material may be an insulating epoxy or thermoplastic resin, while the fibers are elongated continuous commonly directed graphite fibers. The fiber ends terminate at a thermal contact surface which is interfaced with a heat sink. The thermal contact surface may be the transverse edge of the planar member or can be substantially parallel to the planar member. The fiber ends are inclined at an angle with respect to the plane of the planar member to provide for termination of the fibers at the thermal contact surface parallel to the planar member. Heat into the composite member is transferable along the commonly directed graphite fibers.

Semiconductor device and its manufacture

Abstract: A semiconductor device of the kind wherein one or more semiconductor chips are housed in a plug-in type package The package is being molded with a printed wiring substrate, head portions of terminals, and a heat sink for semiconductor chip attachment as an integral part of the package The one surface of the heat sink is being bared from one side of the package, and the semiconductor chips are being mounted on the other surface of the heat sink facing to the opening of the substrate

Fluid-cooled integrated circuit package

Abstract: A package for enclosing, protecting and cooling semiconductor integrated circuit chips. The package includes a generally planar substrate with the chips positioned thereon. Signal connections are provided between at least some of the chips. A heat sink is positioned in contact with the chips and includes microchannels through which a cooling fluid flows for purposes of transferring heat generated by the chips to such fluid. Manifolds are provided to direct the fluid to and from the microchannels, and microcapillary slots may be formed on the heat sink surface adjacent the chips to receive liquid to generate attractive forces between the heat sink and chips to facilitate heat transfer. Circuitry is provided to distribute power through the package and to the chips.

Electronic chip-carrier heat sinks

Abstract: Dissipation of heat from a socketed leadless electronic chip-carrier package is promoted by a heat-conducting metal socket cap distinctively overlying and guiding heat away from the socketed package fully along a broad planar surface area, the socket cap being of a unitary construction which both mechanically holds the package securely mated with a multi-pin socket and also cools the package by way of an integrated array of heat-radiating elements; edge clasping of the cap with a chip-carrying socket avoids interference with needed conduction of heat away from central areas of the package and cap.

Heat sink clip assembly

Abstract: Disclosed is a heat sink clip assembly for releaseably attaching a heat sink to a DIP or similar electronic device package. The clip assembly includes a non-conductive attachment clip which extends between the leads on the underside of the DIP and means for latching the attachment clip to a heat sink disposed adjacent the opposite side of the electronic device package with the heat sink in intimate thermal contact with the electronic device package.

Heat sink and mounting arrangement therefor

Abstract: A generally rectangular heat sink is mounted in a conduit box by tabs which are deformed to fit within channels along opposite edges of the heat sink. An access hole in the side of the conduit box and aligned with the channel permits a pin to be inserted therethrough to push the tabs out of the channel and release the heat sink and PC board from the conduit box.

Optimal Finned Heat Sinks

Abstract: In a multi-board computer system, the volume allocated for heat removal is often a significant fraction of the total system volume. Cooling requirements can thus impact performance, reliability, cost, acoustic noise, and floorspace. This work addresses the volume costs or space requirements for removing heat with optimally designed finned heat sinks. Simple formulas applicable to both gas and liquid cooling problems provide upper bounds on the thermal resistance of an optimal heat sink, without explicitly designing the part. Conservative junction temperature estimates can thus be made without detailed design.

Thermal conduction disc-chip cooling enhancement means

Abstract: A device to thermally couple a heat dissipating integrated circuit chip to the heat sink in a thermal conduction module for effective cooling of the chip by minimizing the thermal resistance path from the chip to the sink. The device is a combination of a heat conducting flat based, truncated solid conical disc which is spring loaded on the back of the chip and a heat conductive hat member having an opening with a continuous tapered wall to conformally fit over the truncated conical disc. The gap between the disc and the hat is packed with a thin layer of a high thermal conductivity grease to provide a low interfacial thermal resistance and mechanical flexibility between the disc and the hat. For additional cooling enhancement of the chip, at the interface between the chip back surface and the base of the disc a self-healing alloy having a high thermal conductivity and low melting point is provided.

Retention system for removable heat sink

Abstract: A heat sink (60) having one or more cooling fins (64) along a central shaft (66) is securable to an active device substrate (12) by a spring clip (80) whose latch sections (92) are latched under latch projections (44) on side walls (40) of the housing (30) to which the substrate (12) is mounted. The bow-shaped formed wire spring clip (80) has arcuate inner sections (82) disposed against the central shaft (66) of the heat sink (60) and exerts spring force downwardly on a retention fin (68) of the heat sink (60) when latched to the housing (30), which holds the bottom surface (62) of the heat sink (60) against the top substrate surface (22) to create a thermal connection.

Surgical instrument having a heat sink for irrigation, aspiration, and illumination

Abstract: A surgical instrument and support unit for enabling a user using one hand to probe an incision and illuminate, irrigate, and aspirate the incision. The surgical instrument has a probe with illumination, irrigation, and aspiration ports on the end. The probe is coupled to a handle having controls for the irrigation and aspiration functions. Light from a high intensity lamp in the handle is transmitted through an optical fiber to the illumination port. A heat sink enclosing the lamp draws heat away from the lamp and transfers the heat to the aspirated fluid passing through the heat sink. The support unit is controlled by a microcomputer and provides an electrical supply for the lamp and a pressurized fluid supply for irrigation. The sources of the irrigation fluid is a standard hospital flexible bag. A bladder inflated by an air pump pressurizes the flexible bag. The pump is also utilized to deflate the bladder to allow rapid changing of the flexible bag during a surgical procedure.

D.C. to A.C. inverter having improved structure providing improved thermal dissipation

Abstract: A DC to AC power inverter has an improved construction providing for substantially improved thermal disipation, reliability, and efficiency; the inverter has a unitary combination frame and heat diffuser with a pair of opposed U-shaped sections at right angles to each other and with a common base, a cover, a transformer, a primary internal heat sink inside of and on the frame, a plurality of power switches fastened on the internal heat sink, a printed circuit board fastened to and spaced from the heat sink with leads from the switches connected to the board, the transformer is fastened onto the frame in heat exchange relationship and part of the coil extends through the frame into an air passageway. All of the wiring access is on a field wiring end and the opposite end is a control end with the switches and circuit board; an improved arrangement of components and leads provides discrete separation of the high and low voltage components and leads. The inverter is extremely effective at heat disipation and has been UL tested and approved.

Multi-layer semiconductor device

Abstract: A multi-layer semiconductor device comprising: a stacked wafer body (7) consisting of a plurality of sets (4) of two semiconductor wafers (1) and a heat sink plate (3) interposed therebetween, an end of the heat sink plate (3) of each set (4) of wafers being exposed at at least one of the side surfaces of the stacked wafer body (7), there being an intermediate connecting circuit (8) provided for connecting circuits in each set of wafers (4), the intermediate connecting circuit (9) being provided on at least one side surface other than the surface at which the ends of the heat skin plates (3) are exposed

Heat sink device using composite metal alloy

Abstract: The present invention involves a metal alloy heat sink containing tungsten, copper, and nickel. The heat sink is affixed to a ceramic substrate which supports one or more heat-generating electrical components. By adjusting the ratio of tungsten, copper, and nickel, substantial matching of the heat sink CTE with the substrate CTE is possible. Because the CTE of the heat sink is matched with that of the substrate, problems associated with differential thermal expansion are minimized, including micro-cracking and delamination. In addition, the completed heat sink has a relatively high thermal conductivity, and is capable of dissipating substantial amounts of heat.

Method for producing heat sink and heat sink thus produced

Abstract: In a heat sink for semiconductor elements and the like, a pipe made of a heat-conductive material such as copper, aluminum and the like is bent at a middle portion thereof and wound such that a forward flow passage and a return flow passage for a liquid coolant are both formed into a spiral shape with the bent portion held at the center of the spiral.

Solid-state electrocaloric cooling system and method

Abstract: A solid-state system and method for extracting heat from a given load which includes connecting a first diode heat pipe between an electrocaloric heating and cooling element and a load and a second diode heat pipe between the electrocaloric heating and cooling element and a heat sink. By appropriately pulsing the electrocaloric element to provide continuous heating and cooling thereof, heat may be continuously extracted from the load and through the two diode heat pipes to a heat sink.

Heat exchanging unit with a hydrogen adsorption alloy

Abstract: This invention relates to a novel heat exchanging unit with a hydrogen adsorption alloy of which thermal conductivity is kept high over a long period of use. Particularly in order to solve problems occurring at the time of forming a heat exchanging unit, by forming a compact of a hydrogen adsorption alloy and inserting a heat transfer element in the compact, such as insufficient heat transfer due to a small spacing produced between the compact and the heat transfer element, surface irregularities, decline in function due to micronization and scattering of the compact, difficulty in build-up, etc., there is disclosed a heat exchanging unit comprising a heat transfer element and a hydrogen adsorption alloy fitted to an outer periphery of the heat transfer element and solidly molded.

Single chip thermal tester

Abstract: A thermal tester for measuring the efficiency of a heat transfer device for cooling semiconductor chips is disclosed having a positioning means operable to position the heat transfer device in thermal contact with the chip. The positioning means is adjustable in at least 5 degrees of freedom. Temperature sensors are provided to sense the temperature of the chip, the chip support substrate and the positioning means adjacent the heat transfer device. Means is provided to dispose the chip and heat transfer device in a vacuum. Control means is also provided to adjust the temperature of the chip unitl it is the same as the substrate to thereby assure heat transfer occurs only from the chip to the positioning means by way of the heat transfer device. When this thermal balance is achieved the thermal resistance of the heat transfer device can be calculated.

Conveyor oven design and method for using same

Abstract: A conveyor oven for cooking or heating food products and other items which utilizes a (preferably non-metallic) heat sink to absorb energy from an infrared heat source and then re-radiate the heat into the oven. Control over the degree and distribution of heat is exerted by bottom side vent holes and bottom sliding plates which control the size of the vent hole openings and top rotary flaps which deflect heat onto the food products. A method of cooking or heating food products and other items utilizing such a conveyor oven is also provided.

Liquid cooling system for integrated circuit chips

Abstract: A cooling system for integrated circuit chips comprises a substrate, a plurality of integrated circuit chips (2) mounted on a first surface of the substrate (3) and a second surface opposite to the first surface thereof, a heat conductive means (8) having a first surface and a second, flat surface opposite to the first surface, a layer of thermally conductive bonding material (9) between the second surface of the substrate and the first surface of the heat conductive means, and a heat exchanger (16) having a flat surface and provided with inlet (18) and outlet (19) means to permit liquid coolant to flow through the heat exchanger in contact with the flat surface. The heat exchanger is removably mounted to the heat conductive means with the flat surface thereof being in close proximity to the second surface of the heat conductive means. The thermally conductive bonding material allows a low thermal resistance contact to be made between the substrate and the heat conductive means and allows the latter to present a flat plane to the heat exchanger so that a low thermal resistance contact can also be established therebetween.

Flameless heat source

Abstract: This invention utilizes a combustionless heat source wherein a vaned rotor having efficiently designed vanes is rotatably supported within a cavity inside a cylindrically-shaped, cast aluminum block. The vaned rotor is rotated by connection to a power source and thereby imparts mechanical energy of motion to a heat transfer fluid encased within the cavity. Frictional forces developed by agitated molecules of the fluid convert the mechanical energy of motion into heat. The heat thus generated moves uniformly throughout the cylindrically-shaped block and heat transfer fluid is circulated through a circumferential passageway contiguous to substantially all of the outer cylindrical surface of the block and absorbs the heat generated inside the cavity. The heated fluid is then conducted to a remote heat transfer station. An electrical control circuit governs the sequencing of heat demand, heat production and heat transfer cycles.

Ambient air modulator for engine fluid heat exchanger

Abstract: An ambient air-to-engine fluid heat exchanger, vehicle having independent ambient air modulators are provided for both the radiator and the charge air cooler in the form of an apertured plate mounted adjacent the face of the heat exchanger and controllably slidable to bring the plate apertures in registry with the ambient air openings of the heat exchanger. For the heat exchanger for engine coolant, the front face of the heat exchanger comprises a second plate having the heat exchanger ambient air openings therein. For the charge air cooler, a second plate is unnecessary because, in an air-to-air heat exchanger, the charge air tubes are about the same width as the ambient air passages and thus the tubes can block the air flow through the modulator apertures when the plate is positioned to do so. The modulator plate is further preferably provided with integral louver portions between the apertures for channelling and streamlining the ambient air flow into the apertures and heat exchanger.

Expandable pulse power spacecraft radiator

Abstract: An expandable heat rejection system for radiating heat generated by a source of heat on a spacecraft or like vehicle is described and comprises a fluid heat exchange medium in operative heat exchange contact with the source for absorbing heat by evaporation of the liquid phase of the medium, a thin flexible wall structure having an inlet and an outlet and defining a volume expandable and collapsible between preselected limits and defining an inner condensation surface and an outer heat radiating surface, a multiplicity of capillary grooves on the condensation surface for promoting condensation of vaporous medium and for facilitating flow of condensate along the condensation surface toward the outlet, and a pump for circulating the medium through the system.

Constant impedance integrated circuit connector

Abstract: An interconnecting grid is disclosed for joining integrated circuit components. The grid has the form of a honeycomb, and is made up of a plurality of interconnected hexagonal conduits, each conduit surrounding an associated pin extended from the integrated circuit component. Each conduit surrounds its associated pin to protect the pin from mechanical damage and isolate the pin from signals emitted by neighboring pins and other extraneous noise. The grid further functions as a heat sink for the removal of heat from the integrated circuit component.

Multiple fastening clip and device for the collective mounting of electronic power components

Abstract: The invention relates to a multiple fastening clip (21) and its application to a device for the collective mounting of electronic power components (3) on a heat sink (15). This mounting device comprises a heat sink (15) in the form of an angle section perforated with apertures (18), a dielectric plate (20) interposed between said heat sink (15) and said components (13), and a thermally conductive multiple clip (21) provided with projections intended for cooperating with said apertures (18) in order to secure the clip.

Segmented heat sink device

Abstract: A segmented heat sink device is provided for application to integrated circuit packages for heat dissipation purposes. The segmented heat sink device involves four duplicate sectors, each of which has a patterned set of radial fin elements through which cooling air flow may run. The reduction of the base length of each segment provides for reduction in expansion/contraction stress due to the heating and cooling cycles involved.

Heat sink formed of stacked fin elements.

Abstract: A heat sink is formed of an interlocked stack of strip elements (10, 11) each having a heat-conducting base portion (12), and a thinner heat-radiating fin portion (23), the base portions (12) being configured for interlocking engagement to form a unitary heat-conductive mass and the fin portions (23) having relative large surface areas for efficient heat disposition into surrounding air.