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Showing papers on "Heat sink published in 1994"


Journal ArticleDOI
A. Giesen1, Helmut Hügel1, A. Voss1, Klaus Wittig1, U. Brauch, H. Opower 
TL;DR: In this article, a very thin laser crystal disc with one face mounted on a heat sink is proposed for diode-pumped high-power solid-state laser systems, which allows very high pump power densities without high temperature rises within the crystal and leads to an almost homogeneous and one-dimensional heat flux perpendicular to the surface.
Abstract: A new, scalable concept for diode-pumped high-power solid-state lasers is presented The basic idea of our approach is a very thin laser crystal disc with one face mounted on a heat sink This allows very high pump power densities without high temperature rises within the crystal Together with a flat-top pump-beam profile this geometry leads to an almost homogeneous and one-dimensional heat flux perpendicular to the surface This design dramatically reduces thermal distortions compared to conventional cooling schemes and is particularly suited for quasi-three-level systems which need high pump power densities Starting from the results obtained with a Ti:Sapphire-pumped Yb:YAG laser at various temperatures, the design was proved by operating a diode-pumped Yb:YAG laser with an output power of 44 W and a maximum slope efficiency of 68% From these first results we predict an exctracted cw power of 100 W at 300 K (140 W at 200 K) with high beam quality from a single longitudinally pumped Yb: YAG crystal with an active volume of 2 mm3 Compact diode-pumped solid-state lasers in the kilowatt range seem to be possible by increasing the pump-beam diameter and/or by using several crystal discs

1,018 citations


Journal ArticleDOI
TL;DR: In this article, an experimental study of pressure drop and CHF in mini-channel (D = 2.54 mm ) and micro-channel heat sinks of 1 cm heated length was performed using R-113.

467 citations


Patent
13 Jun 1994
TL;DR: An ultrasound transducer assembly having a housing, a transducers array mounted in the housing, and an active cooling mechanism positioned adjacent to the transducers for actively removing heat generated by the array by transport of heat energy from the affected site is described in this paper.
Abstract: An ultrasound transducer assembly having a housing, a transducer array mounted in the housing, and active cooling mechanism positioned adjacent to the transducer array for actively removing heat generated by the array by transport of heat energy from the affected site. The active cooling mechanism may comprise a heat exchanger including a closed loop circulating coolant system circulating coolant, or a single-pass flowed coolant, passing through the heat exchanger, a heat pipe, a thermoelectric cooler, an evaporative/condenser system, and/or a phase change material. One or more heat exchangers may be used having gas or liquid coolants flowing therethrough. The heat exchangers and coolant pumps may be located in various components of the transducer assembly, including the array housing, the connector assemblies or the ultrasound console.

325 citations


Patent
02 Nov 1994
TL;DR: In this article, the authors define a gap between a heater blade and an adjacent heat sink blade to prevent heat loss during an electrical pulse which heats the heater blade, and during subsequent cooling period and puff interval, the adjacent heat sinks blades prevent heat from propagating to other parts of the aerosol generating tube, i.e., the cigarette.
Abstract: A heater having a generally cylindrical or tubular configuration comprised of a selected plurality of thermally conductive heater blades and adjacent heat sink and aerosol barrier blades interposed between the heater blades to form an interdigitated structure. A respective gap is defined between a heater blade and an adjacent heat sink blade to prevent heat loss during an electrical pulse which heats the heater blade. During the subsequent cooling period and puff interval, the adjacent heat sink blades prevent heat from propagating to other parts of the aerosol generating tube, i.e., the cigarette. In addition to the thermal function, the barrier blades also block the escape of moisture generated by the aerosol generating medium, thereby limiting the propagation of condensation. The respective gaps between the interdigitated blades are defined to be wide enough to prevent heat losses during pulsing from a heater blade to adjacent blades yet small enough to prevent escape of significant amounts of vapor.

238 citations


Patent
03 May 1994
TL;DR: In this paper, the authors define a locking moat as a cross-sectional shape that has, at a first distance beneath a locking surface of the heat sink, a width that is larger than a width at a second distance beneath the locking surface, the second distance being smaller than the first distance.
Abstract: A packaged semiconductor die includes a heat sink having a locking feature that interlocks with the encapsulant encapsulating the die to minimize or eliminate delamination of the encapsulant from the heat sink. A surface of the heat sink can be exposed to the exterior of the encapsulant. The invention applies broadly to packaged integrated circuits including multichip modules and hybrid circuits, as well as to packaged transistors. In one embodiment of the invention, a locking moat has a cross-sectional shape that has, at a first distance beneath a locking surface of the heat sink, a width that is larger than a width at a second distance beneath the locking surface, the second distance being smaller than the first distance. The locking moat can have, for example, a "keyhole" cross-sectional shape or a circular cross-sectional shape. The locking moat can be formed by, for example, stamping or chemical etching. In another embodiment of the invention, the locking feature is a locking region. The locking region can be, for example, a plurality of dimples or deep holes formed by, for instance, stamping, grinding, mechanical or laser drilling, or chemical etching, a roughened area formed by abrading or selective electroplating, or a patterned region formed by coining.

193 citations


Patent
29 Apr 1994
TL;DR: In this paper, a thermoelectric generator is used to convert the heat generated by a semiconductor integrated circuit into electrical energy, which is then used to drive a fan or other airflow generating device.
Abstract: An apparatus and method for recovering power dissipated by a semiconductor integrated circuit includes a thermoelectric generator which converts the heat generated by the integrated circuit into electrical energy. The electrical energy is used to drive a fan or other airflow generating device to cause heated air to be moved away from the integrated circuit and cooler air to be drawn to the integrated circuit to absorb further heat from the integrated circuit. In the described embodiment, the thermoelectric generator is a Peltier cooler positioned between the integrated circuit and a heatsink. The Peltier cooler is operated in the Seebeck mode to generate power in response to the temperature differential between the integrated circuit and the heatsink. The fan is positioned proximate to the heatsink to cause air flow over the heatsink thereby reducing the temperature of the heatsink and thus reducing the temperature of the integrated circuit by causing more heat to be transferred from the integrated circuit to the heatsink.

171 citations


Patent
29 Mar 1994
TL;DR: In this article, a metallic component for an electronic package is provided, which is coated with an electrically nonconductive layer and has a plurality of conductive circuit traces formed on a surface.
Abstract: There is provided a metallic component for an electronic package. The component is coated with an electrically non-conductive layer and has a plurality of conductive circuit traces are formed on a surface. The circuit traces are soldered directly to the input/output pads of an integrated circuit device and to a second plurality of circuit traces. The component may include a heat sink to enhance dissipation of heat from an encapsulated integrated circuit device.

163 citations


Patent
15 Mar 1994
TL;DR: In this article, an exhaust fan that creates a primary air flow across heat generating electronic components includes a cooling enclosure (11) which encloses predetermined components (C) to isolate them from other components in the cabinet.
Abstract: A cabinet (30) having an exhaust fan (F) that creates a primary air flow across heat generating electronic components includes a cooling enclosure (11) which encloses predetermined components (C) to isolate them from other components in the cabinet (30) An air inlet conduit (18) connects the cooling enclosure (11) with the air inlets in the cabinet (30) and an air outlet conduit (19) connects the enclosure (11) with the air outlets of the cabinet (30) and the fan (F) to define a separate secondary air flow across the isolated components (C) The fan (F) creating the primary air flow across the non-isolated components simultaneously creates the secondary air flow across the isolated components (C), where heat generated by the isolated components (C) and non-isolated components is not mixed to maximize cooling of all components within the cabinet (30) The cooling enclosure (11) may also contain a heat sink (H)

146 citations


Patent
14 Feb 1994
TL;DR: In this paper, a heat sink assembly adapted for use with an electronic device package (24) such as a microprocessor having a grid array is shown having, in a first embodiment, a threaded base (34) of a finned heat sink (28) adapted to be received in a threaded bore (26) of an adaptor (12) which mounts onto the EH package.
Abstract: A heat sink assembly (10) adapted for use with an electronic device package (24) such as a microprocessor having a grid array is shown having, in a first embodiment, a threaded base (34) of a finned heat sink (28) adapted to be received in a threaded bore (26) of an adaptor (12) which mounts onto the electronic device package (24). Desired thermal coupling is achieved by screwing down the heat sink (28) in biasing engagement with the package (24). Alternate embodiments show the heat sink (28) which has a snap on flange (20, 22) to attach the heat sink (28) to the adaptor (12) and the adaptor extending down to engage with the socket (60) in which the electronic device package (24) is installed.

138 citations


Journal ArticleDOI
TL;DR: In this article, the results of heat transfer measurement and analysis for two 5×5×1 cm porous channels were presented, made of sintered bronze beads with two different mean diameters, d p = 0.72 and 1.59 mm.
Abstract: This paper presents the results of heat transfer measurement and analysis for two 5×5×1 cm porous channels. The channels were made of sintered bronze beads with two different mean diameters, d p =0.72 and 1.59 mm. The local wall temperature distribution, inlet and outlet pressure and temperatures, and heat transfer coefficients were measured for heat flux of 0.8, 1.6, 2.4, and 3.2 W/cm 2 with air velocity ranging from 0.16 to 5 m/s and inlet air pressure of 1∼3 atm

135 citations


Journal ArticleDOI
TL;DR: In this paper, the authors explored the application of flow boiling in mini-channel and micro-channel heat sinks with special emphasis on reducing pressure drop and coolant flow rate and found that the major contributor to pressure drop was the acceleration caused by evaporation in the channels; however, compressibility effects proved significant for the micro channel geometiy.
Abstract: Increased rate of heat dissipation from electronic chips was explored by the application of flow boiling in mini-channel (D = 2.54 mm) and micro-channel (D — 510 \\x,m) heat sinks with special emphasis on reducing pressure drop and coolant flow rate. A pressure drop model was developed that accounts for the single-phase inlet region, the singleand two-phase heated region, and the two-phase unheated outlet region. Inlet and outlet losses associated with the abrupt contraction and expansion, respectively, were also accounted for, and so were the effects of compressibility and flashing within the two-phase region. Overall, the major contributor to pressure drop was the acceleration caused by evaporation in the channels; however, compressibility effects proved significant for the micro-channel geometiy. Based upon practical considerations such as pressure drop, erosion, choking, clogging, and manufacturing ease, the mini-channel geometiy was determined to offer inherent advantages over the microchannel geometiy. The latter is preferred only in situations calling for dissipation of high heat fluxes where minimizing weight and liquid inventory is a must.

Patent
16 Dec 1994
TL;DR: In this article, an improved heat dissipation device was proposed for removing heat from a surface mounted integrated circuit component coupled to a printed circuit board in a portable computer, which is at least partially filled with a heat conductive material, improving heat transfer between a component and a heat-conductive block mounted on opposite surfaces of the circuit board.
Abstract: An improved heat dissipation device particularly suited for removing heat from a surface mounted integrated circuit component coupled to a printed circuit board in a portable computer. Vias, which are at least partially filled with a heat conductive material, improve heat transfer between a component and a heat conductive block mounted on opposite surfaces of the circuit board. A first section near one end of the heat pipe is attached to the heat conductive block in a channel formed receptive to the heat pipe. A second section of the heat pipe including the second end is attached to a metal plate which is affixed beneath the keyboard. Heat from the component flows through the vias to the block and is transferred by the heat pipe to the metal plate where it is dissipated.

Journal ArticleDOI
TL;DR: In this paper, a heat sink thickness to channel diameter ratio of 1.2 provided a good compromise between minimizing overall thermal resistance and structural integrity, and a ratio of channel pitch to diameter of less than two produced negligible surface temperature gradients even with a surf ace heat flux of 200 Wcm.
Abstract: Mini-channel (D = 2.54 mm) and micro-channel (D = 510 pm) heat sinks with a 1-cm heated surface were tested for their high heat flux performance with flow boiling ofR-113. Experimental results yielded CHF values in excess of 200 W cm~ for flow rates less than 95 ml min~ (0.025 gpm) over a range of inlet subcooling from 10 to 32° C. Heat diffusion within the heat sink was analyzed to ascertain the optimum heat sink geometry in terms of channel spacing and overall thickness. A heat sink thickness to channel diameter ratio of 1.2 provided a good compromise between minimizing overall thermal resistance and structural integrity. A ratio of channel pitch to diameter of less than two produced negligible surface temperature gradients even with a surf ace heat flux of 200 Wcm~. To further aid in determining channel diameter for a specific cooling application, a pressure drop model was developed, which is presented in the second part of the study.

Proceedings ArticleDOI
13 Jun 1994
TL;DR: In this article, the authors evaluate the feasibility and benefits of using heat pipe technology to cool the turbine vanes of gas turbine engines and show a 7.2% increase in engine thrust, a 0.2 percent decrease in specific fuel consumption with engine weight increased by less than 1% by using this technology.
Abstract: This paper evaluates the basic feasibility and anticipated benefits to using heat pipe technology to cool the turbine vanes of gas turbine engines.This concept involves fitting out the vane interior as a heat pipe, extending the vane into an adjacent heat sink and then transferring the vane incident heat through the vane to the heat sink. The baseline is an advanced military fighter engine and the bypass air is the chosen heat sink. The results of this study show a 7.2% increase in engine thrust, a 0.2% decrease in specific fuel consumption with engine weight increased by less than 1% by using this technology.Copyright © 1994 by ASME

Patent
30 Nov 1994
TL;DR: In this article, a heat sink is formed as a stepped structure to increase the path of moisture penetration so as to improve moisture resistance and reliability, and the heat sink can be attached by one of various methods directly on to the integrated circuit die and a lead frame for external electrical connections.
Abstract: A structure and a method provide an assembly for receiving an integrated circuit die. The assembly comprises a heat sink selectively coated with electrically insulative material. The heat sink is attached by one of various methods directly on to the integrated circuit die and a lead frame for external electrical connections. The heat sink is formed as a stepped structure to increase the path of moisture penetration so as to improve moisture resistance and reliability. In one embodiment of the present invention, the electrically insulative material comprises anodized aluminum, which is formed on the heat sink by a vapor deposition step, followed by a hard anodization step. Other electrical insulative material which can be thinly applied on the surface of the heat sink are non-conductive resins and polymers. The heat sink is formed out of copper or a copper alloy, selected for strength and electrical and thermal conductivities. The heat sink can be connected to a power or a ground terminal of the integrated circuit, which is bonded on the heat sink on an exposed (i.e. unaluminized) exposed area of the heat sink. The exposed area of the heat sink is formed either by a step which masked off the exposed area from the aluminum deposition step, or by a subtractive process, such as sand-blasting, to selectively removing the anodized aluminum. In one embodiment, the assembly is encapsulated in plastic with one side of the heat sink flush with one outer surface of the plastic encapsulation.

Patent
08 Dec 1994
TL;DR: In this paper, an instrument employs a projector which projects a moving pattern of heat onto a test object, formed of bars or lines of infrared radiation separated by unheated areas, or areas of shadow.
Abstract: An instrument employs a projector which projects a moving pattern of heat onto a test object. An exemplary pattern is formed of bars or lines of infrared radiation separated by unheated areas, or areas of shadow. An infrared camera which is not sensitive to the wavelength of the projected light is used to detect the heat emitted by the test object. The projected bands of thermal radiation heat the surface of the test object. Some of the energy in the form of heat sinks into the structure, while some of the heat energy flows laterally from the heated band to the unheated bands between the projected bands. The lateral flow of heat between bands is resisted by cracks in the surface. This resistance causes heat energy to build up on one side of each crack. The downward flow of heat energy is resisted by less conductive material such as a debonding between layers which traps the heat, causing it to build up laterally. Thus, flaws caused by cracks normal to the surface and delaminations or cracks parallel to the surface may be detected by the same device.

Patent
23 May 1994
TL;DR: In this paper, the authors present a housing for a desk top personal computer incorporating a novel integrated cooling system, where a cast magnesium chassis acts as a heat sink that conductively absorbs heat from internal components.
Abstract: A housing for a desk top personal computer incorporating a novel integrated cooling system. The housing features a cast magnesium chassis that acts as a heat sink that conductively absorbs heat from internal components. A recessed, rectangular, open-sided cooling channel is integrally formed in the bottom of the chassis. A fan is mounted to one end of the cooling channel. A series of fins running lengthwise extends down from the top of the channel. A power supply module, which dissipates heat from a conduction plate along its bottom, is mounted on the top side of the chassis directly above the channel. In operation, the fan draws air into the housing through a series of openings along the top back edge of the chassis. The air passes over the inside surfaces of the chassis, dissipating the relatively small amount of heat generated by the components mounted thereon and flows into the cooling channel. The air flows through the channel and across the surfaces of the fins extending down from the top of the channel, dissipating the heat generated by the power supply mounted directly above.

Patent
29 Apr 1994
TL;DR: In this article, a temperature regulated specimen transporter for controlling the temperature and environment of a clinical specimen during transportation thereof comprising an insulated and thermally conductive storage compartment; a heat sink mechanism coupled to the storage compartment for heating and cooling the storage compartments; a temperature control mechanism coupled with a temperature sensing mechanism for setting a plurality of desired temperature set points; a power source mechanism for energizing and de-energizing the heat sink, temperature control, and temperature sensing mechanisms.
Abstract: A temperature regulated specimen transporter for controlling the temperature and environment of a clinical specimen during transportation thereof comprising an insulated and thermally conductive storage compartment; a heat sink mechanism coupled to the storage compartment for heating and cooling the storage compartment; a temperature control mechanism coupled to the storage compartment for setting a plurality of desired temperature set points; a temperature sensing mechanism coupled to the heat sink mechanism and temperature control mechanism, the temperature sensing mechanism having a first orientation for allowing the heat sink mechanism to heat the storage compartment and a second orientation for allowing the heat sink mechanism to cool the storage compartment based on the desired temperature set points; and a power source mechanism for energizing and de-energizing the heat sink mechanism, temperature control mechanism, and temperature sensing mechanism.

Patent
03 Oct 1994
TL;DR: An electromagnetic dispenser for dispensing viscous heated fluids, such as hot melt adhesives, is described in this article, where a fixed pole extends from a fluid chamber, and a coil is located about a portion of the fixed pole and spaced from the fluid chamber to isolate the coil from fluid flow path of the adhesive.
Abstract: An electromagnetic dispenser for dispensing viscous heated fluids, such as hot melt adhesives. A fixed pole extends from a fluid chamber. The coil is located about a portion of the fixed pole and spaced from the fluid chamber to isolate the coil from the fluid flow path of the adhesive. The coil is insulated from the heat which is conducted from the adhesive as well as provided with a heat sink for dissipating heat. A plunger is mounted within the fluid chamber for reciprocal movement therein to open and close dispensing orifice in response to the field generated by the coil. When mounted to a service block, the coil assembly may be serviced without disconnecting the dispenser body from the source of heated fluid.

Patent
29 Mar 1994
TL;DR: In this paper, an improved heat sink is proposed that utilizes either natural or forced convection to transfer heat generated by a high temperature medium to a lower temperature medium or converts cold energy from a low temperature fluid or solid medium to different or higher temperature stage or condition of energy.
Abstract: An improved heat sink apparatus that utilizes either natural or forced convection to transfer heat generated by a high temperature medium to a lower temperature medium or converts cold energy from a low temperature fluid or solid medium to a different or higher temperature stage or condition of energy. The apparatus includes a thermally conductive base plate, a plurality of thick corrugated finned assembly components constructed and arranged in abutting relationship and offset from each other so as to cause a circuitous path of fluid flow therethrough. The apparatus also may include the base plate and a plurality of thick, sawtooth shaped, or segmented fins mounted thereon. The length of fluid travel from one finned component to an abutting finned component along the heat transfer surface is controlled in order to prevent development of thermal boundary layer on the inner surface of the finned assembly components.

Patent
10 Mar 1994
TL;DR: In this article, a heat sink is mounted on an integrated circuit package mounted on a printed circuit board, and a cover is fixed to the guide member such that it covers over outer peripheral edge portions of an upper face of the heat sink.
Abstract: A structure for mounting a heat sink onto an integrated circuit package mounted on a printed circuit board is constructed such that a guide member having a frame portion and support post portions is fixed to the printed circuit board, and the heat sink is seated on an inner periphery of the guide member such that the heat: sink may be closely contacted with the integrated circuit package, and then a cover is fixed to the guide member such that it covers over outer peripheral edge portions of an upper face of the heat sink. This structure is high in cooling efficiency and is easy to mount.


Proceedings ArticleDOI
01 Feb 1994
TL;DR: In this article, the performance of the elliptical pin heat sink was compared with those of extruded straight and crosscut fin heat sinks, all designed for an ASIC chip, and the results of the straight fin were also compared by using Sauna, a commercially available heat sink modeling program developed based on empirical expressions.
Abstract: Comparative thermal tests have been carried out using, aluminum heat sinks made with extruded fin, cross-cut rectangular pins, and elliptical shaped pins in low air flow environments. The elliptical pin heat sink was designed to minimize the pressure loss across the heat sink by reducing the vortex effects and to enhance the thermal performance by maintaining large exposed surface area available for heat transfer. The performance of the elliptical pin heat sink was compared with those of extruded straight and crosscut fin heat sinks, all designed for an ASIC chip. The results of the straight fin were also compared with those obtained by using Sauna, a commercially available heat sink modeling program developed based on empirical expressions. In addition to the thermal measurements, the effect of air flow bypass characteristics in open duct configuration was investigated. As expected, the straight fin experienced the lowest amount of flow bypass over the heat sink. For this particular application, where the heat source is localized at the center of the heat sink base plate, the overall thermal resistance of the straight fin was lower than the other two designs mainly due to the combined effect of enhanced lateral conduction along the fins and the lower flow bypass characteristics. >

Patent
11 Jan 1994
TL;DR: In this article, an access door for computer systems comprising an outer case containing an electronic component of the computer system that is capable of generating heat during the operation of the system is described.
Abstract: Disclosed is an access door for computer systems comprising an outer case containing an electronic component of the computer system that is capable of generating heat during the operation of the computer system. The outer case has an aperture in its surface proximate the component to allow external access into the outer case. The access door is capable of assuming a closed position where it closes the aperture, covers the component and forms a part of the outer. The access door is also capable of being placed in an open position wherein the component is externally exposed through the aperture. The access door includes a heat sink having a heat receiving portion positioned to mechanically contact a surface of the component to allow transmission of heat from the component to the heat receiving portion. The heat sink further includes a heat dissipating portion forming an outer surface of the access door that is capable of dissipating heat received from the component via the heat receiving portion into an environment surrounding the computer system. The door thereby cools the component when in the closed position and allows access to the component when in the open position.

Patent
01 Apr 1994
TL;DR: In this article, a configuration of solid state thermoelectric heat transfer or removal elements is provided to enhance the rate and amount of heat removal from electrical and electronic circuit devices.
Abstract: A configuration of solid state thermoelectric heat transfer or removal elements is provided to enhance the rate and amount of heat removal from electrical and electronic circuit devices. By rotating the thermoelectric heat transfer modules ninety degrees and by disposing them between the interdigitated fingers of a cold plate and a heat transfer plate possessing fins, improved thermal transfer is produced without the necessity of liquid coolants or moving part cooling devices. Accordingly, a method and apparatus is provided for enhancing heat transfer using thermoelectric modules. One embodiment of the present invention is particularly seen to be easy to manufacture. Additionally, this embodiment also possesses desirable heat transfer characteristics in terms of the cross sections of thermally conductive components.

Journal ArticleDOI
TL;DR: In this paper, a steel pile used for building foundations as a heat exchanger with the soil was used to predict variations in the water temperature and the quantity of heat exchanged with soil.

Patent
19 Dec 1994
TL;DR: In this paper, a cooling apparatus with a plurality of heat pipes is improved to reduce the condensation capacity of selected heat pipes when ambient air temperature is low, so as to facilitate start-up of the cooling apparatus from a state in which the working fluid in the heat pipes has been frozen.
Abstract: A cooling apparatus having a plurality of heat pipes is improved to reduce the condensation capacity of selected heat pipes when ambient air temperature is low, so as to facilitate start-up of the cooling apparatus from a state in which the working fluid in the heat pipes has been frozen. The cooling apparatus has a block of a high heat conductivity in which one end of each heat pipe serving as an evaporation section of the heat pipe is embedded. Heat radiation fins are attached to portions of the heat pipes exposed from the block, so that the exposed portions of the heat pipes serve as condensation sections of the respective heat pipes. There are two types of heat radiation fins: a first type of fins which are attached to all the heat pipes and a second type of fins which are attached only to selected heat pipes.

Patent
16 Sep 1994
TL;DR: In this article, a heat dissipation assembly comprises an array of foil corrugations disposed in a generally parallel spaced relationship with the TEC, and at least one plate sandwiched there between and secured by vacuum brazing thereacross.
Abstract: Heat exchangers for a thermoelectric cooling (TEC) device. A heat dissipation assembly comprises an array of foil corrugations disposed in generally parallel spaced relationship with the heat dissipation plate of the TEC. The array of foil corrugations includes at least an inner and an outer bank of foil corrugations and at least one plate sandwiched therebetween and secured thereto by vacuum brazing thereacross. In this manner, heat conductivity is maximized for transfer of heat thereacross and from the TEC to the outer bank. A heat absorption assembly for use with the TEC comprises a thermal transfer plate having a teflon coated, serpentine fluid conduit therein facilitating the flow of a variety of fluids to be cooled therethrough without contamination thereof.

Patent
Masanori Muso1
22 Dec 1994
TL;DR: In this article, a cooling system for an electric vehicle inverter system having an inverter for converting electric power from a battery into alternating current and for supplying the current to a driving motor for driving the vehicle.
Abstract: A cooling system is provided for an electric vehicle inverter system having an inverter for converting electric power from a battery into alternating current and for supplying the current to a driving motor for driving the vehicle. The cooling system employs a heat sink having an internal coolant flow passage for conducting a liquid coolant which is forced to recirculate. The heat sink is vertically placed on a mounting base, and heat generating parts are placed and fixed on at least one side of said heat sink. In this way, a cooling system for an electric vehicle inverter system which is small in size and large in cooling capacity with a simple construction is easily provided.

Patent
16 May 1994
TL;DR: In this article, a flat heat source with a plural number of ring-shaped heating units of different diameters arranged concentrically and so as to face a processing surface of a semiconductor wafer is presented.
Abstract: A heat treatment apparatus including a flat heat source having a plural number of ring-shaped heating units of different diameters arranged concentrically and so as to face a processing surface of a semiconductor wafer for example, a heat control portion which performs either independent or batch control of a plural number of ring-shaped heating units, a process tube which houses the object for processing, and a movement mechanism which brings a processing surface of the object for processing and the flat heat source into relative proximity. By this configuration, it is possible to have fast heat treatment such as oxidation and diffusion processing, or CVD processing, to a uniform temperature for the entire processing surface of a flat object for processing.