Showing papers on "Heat sink published in 2011"

Near-Field Radiative Heat Transfer between Macroscopic Planar Surfaces

Abstract: Near-field radiation allows heat to propagate across a small vacuum gap at rates several orders of magnitude above that of far-field, blackbody radiation. Although heat transfer via near-field effects has been discussed for many years, experimental verification of this theory has been very limited. We have measured the heat transfer between two macroscopic sapphire plates, finding an increase in agreement with expectations from theory. These experiments, conducted near 300 K, have measured the heat transfer as a function of separation over mm to $\ensuremath{\mu}\mathrm{m}$ and as a function of temperature differences between 2.5 and 30 K. The experiments demonstrate that evanescence can be put to work to transfer heat from an object without actually touching it.

Two-Phase Microchannel Heat Sinks: Theory, Applications, and Limitations

Abstract: Boiling water in small channels that are formed along turbine blades has been examined since the 1970s as a means to dissipating large amounts of heat. Later, similar geometries could be found in cooling systems for computers, fusion reactors, rocket nozzles, avionics, hybrid vehicle power electronics, and space systems. This paper addresses (a) the implementation of two-phase microchannel heat sinks in these applications, (b) the fluid physics and limitations of boiling in small passages, and effective tools for predicting the thermal performance of heat sinks, and (c) means to enhance this performance. It is shown that despite many hundreds of publications attempting to predict the performance of two-phase microchannel heat sinks, there are only a handful of predictive tools that can tackle broad ranges of geometrical and operating parameters or different fluids. Development of these tools is complicated by a lack of reliable databases and the drastic differences in boiling behavior of different fluids in small passages. For example, flow boiling of certain fluids in very small diameter channels may be no different than in macrochannels. Conversely, other fluids may exhibit considerable “confinement” even in seemingly large diameter channels. It is shown that cutting-edge heat transfer enhancement techniques, such as the use of nanofluids and carbon nanotube coatings, with proven merits to single-phase macrosystems, may not offer similar advantages to microchannel heat sinks. Better performance may be achieved by careful optimization of the heat sink’s geometrical parameters and by adapting a new class of hybrid cooling schemes that combine the benefits of microchannel flow with those of jet impingement. [DOI: 10.1115/1.4005300]

Parametric numerical study of flow and heat transfer in microchannels with wavy walls

Abstract: Wavy channels were investigated in this paper as a passive scheme to improve the heat transfer performance of laminar fluid flow as applied to microchannel heat sinks. Parametric study of three-dimensional laminar fluid flow and heat transfer characteristics in microsized wavy channels was performed by varying the wavy feature amplitude, wavelength, and aspect ratio for different Reynolds numbers between 50 and 150. Two different types of wavy channels were considered and their thermal performance for a constant heat flux of 47 W/cm 2 was compared. Based on the comparison with straight channels, it was found that wavy channels can provide improved overall thermal performance. In addition, it was observed that wavy channels with a configuration in which crests and troughs face each other alternately (serpentine channels) were found to show an edge in thermal performance over the configuration where crests and troughs directly face each other. The best configuration considered in this paper was found to provide an improvement of up to 55% in the overall performance compared to microchannels with straight walls and hence are attractive candidates for cooling of future high heat flux electronics.

Monitoring Solder Fatigue in a Power Module Using Case-Above-Ambient Temperature Rise

Abstract: Condition monitoring is needed in power electronic systems as a cost-effective means of improving reliability. Packaging-related solder fatigue has been identified as one of the main root causes of power electronic module failures. This paper presents a method to monitor solder fatigue inside a module by identifying the increase of internal thermal resistance due to that solder fatigue, taking account of the masking effect of the variable operating point. It is assumed that the total loss in the module increases as junction temperature rises, causing an increase in case-above-ambient temperature rise, which can be measured. A dynamic thermal model of the heat sink is utilized to estimate the power loss from temperature measurements, while a device power loss model is developed to estimate the internal thermal resistance by considering the converter electrical loading. Experiment and simulation are used to demonstrate the concept and verify the method.

Method and system for providing an energy assisted magnetic recording writer having a heat sink and NFT

Abstract: A method provides an EAMR transducer. The EAMR transducer is coupled with a laser and has an ABS configured to reside in proximity to a media during use. The EAMR transducer includes an NFT for focusing the energy onto the media. A sacrificial layer is deposited on the NFT and a mask having an aperture provided on the sacrificial layer. A portion of the sacrificial layer exposed by the aperture is removed to form a trench above the NFT. A heat sink is then provided. At least part of the heat sink resides in the trench. The heat sink is thermally coupled to the NFT. Optical material(s) are provided around the heat sink. A write pole configured to write to a region of the media is also provided. The write pole is thermally coupled with the top of the heat sink. Coil(s) for energizing the write pole are also provided.

Effects of passive cooling on performance of silicon photovoltaic cells

Abstract: In this study, an experimental research concerning the effects of passive cooling on performance parameters of silicon solar cells was presented. An aluminum heat sink was used in order to dissipate waste heat from a photovoltaic (PV) cell. Dimensions of the heat sink were determined considering the results of a steady-state heat transfer analysis. The experiments were carried out for different ambient temperatures and various illumination intensities up to 1 sun under solar simulator. Experimental results indicate that energy, exergy and power conversion efficiency of the PV cell considerably increase with the proposed cooling technique. An increase of ∼20% in power output of the PV cell is achieved at 800 W/m-super-2 radiation condition. Maximum level of cooling is observed for the intensity level of 600 W/m-super-2. Performance of PV cells both with and without fins increases with decreasing ambient temperature. Copyright , Oxford University Press.

Method for providing an energy assisted magnetic recording (EAMR) transducer

Abstract: A method provides an EAMR transducer. A sacrificial post is provided on an NFT distal from the ABS. This post has an edge proximate and substantially parallel to the ABS. A sacrificial mask is provided on the NFT between the post and the ABS. Optical material(s) are provided. The post is between the optical material(s) and the ABS. The post is removed. A heat sink post corresponding to the post is provided. The heat sink post has a bottom thermally coupled with the NFT and an edge proximate and substantially parallel to the ABS. Part of the heat sink post is removed, forming a heat sink having a top surface at an acute angle from the ABS. Nonmagnetic material(s) are provided on the optical material(s). A pole having a bottom surface thermally coupled with the heat sink and coil(s) are provided.

Pool Boiling Heat Transfer and Bubble Dynamics Over Plain and Enhanced Microchannels

Abstract: Pool boiling is of interest in high heat flux applications because of its potential for removing large amount of heat resulting from the latent heat of evaporation and little pressure drop penalty for circulating coolant through the system. However, the heat transfer performance of pool boiling systems is not adequate to match the cooling ability provided by enhanced microchannels operating under single-phase conditions. The objective of this work is to evaluate the pool boiling performance of structured surface features etched on a silicon chip. The performance is normalized with respect to a plain chip. This investigation also focuses on the bubble dynamics on plain and structured microchannel surfaces under various heat fluxes in an effort to understand the underlying heat transfer mechanism. It was determined that surface modifications to silicon chips can improve the heat transfer coefficient by a factor up to 3.4 times the performance of a plain chip. Surfaces with microchannels have shown to be efficient for boiling heat transfer by allowing liquid to flow through the open channels and wet the heat transfer surface while vapor is generated. This work is expected to lead to improved enhancement features for extending the pool boiling option to meet the high heat flux removal demands in electronic cooling applications.

A Review of Cooling in Microchannels

Abstract: Advancements in electronic performance result in a decrease in device size and increase in power density. Because of these advancements, current cooling mechanisms for electronic devices are beginning to be ineffective. Within the localized hot spots, the materials of the components are reaching temperature values that can lead to improper functioning of the device. Many techniques have been successful in the past, such as heat sinks, cavities or grooves, micro pin-fins, etc., but still do not provide adequate cooling necessary to maintain temperature values low enough for the electronic components to operate. Microchannels, with their large heat transfer surface to volume ratio, cooled with either gas or liquid coolant, have shown some potential. By modifying the walls of the microchannel with fins, pins, or grooves, the cooling performance can be improved. A possible fin material used to increase the surface area of a microchannel is carbon nanotubes, which possess excellent thermal and mechanical prope...

Numerical Evaluation of Flow and Heat Transfer in Plate-Pin Fin Heat Sinks with Various Pin Cross-Sections

Abstract: A numerical investigation of the thermal and hydraulic performance of 20 different plate-pin fin heat sinks with various shapes of pin cross-sections (square, circular, elliptic, NACA profile, and dropform) and different ratios of pin widths to plate fin spacing (0.3, 0.4, 0.5, and 0.6) was performed. Finite volume method-based CFD software, Ansys CFX, was used as the 3-D Reynolds-averaged Navier-Stokes Solver. A k-ω based shear-stress-transport model was used to predict the turbulent flow and heat transfer through the heat sink channels. The present study provides original information about the performance of this new type of compound heat sink.

On the Cooling of Electronics With Nanofluids

Abstract: Nanofluids have been proposed to improve the performance of microchannel heat sinks. In this paper, we present a systematic characterization of aqueous silica nanoparticle suspensions with concentrations up to 31 vol %. We determined the particle morphology by transmission electron microscope imaging and its dispersion status by dynamic light scattering measurements. The thermophysical properties of the fluids, namely, their specific heat, density, thermal conductivity, and dynamic viscosity were experimentally measured. We fabricated microchannel heat sinks with three different channel widths and characterized their thermal performance as a function of volumetric flow rate for silica nanofluids at concentrations by volume of 0%, 5%, 16%, and 31%. The Nusselt number was extracted from the experimental results and compared with the theoretical predictions considering the change of fluids bulk properties. We demonstrated a deviation of less than 10% between the experiments and the predictions. Hence, standard correlations can be used to estimate the convective heat transfer of nanofiuids. In addition, we applied a one-dimensional model of the heat sink, validated by the experiments. We predicted the potential of nanofluids to increase the performance of microchannel heat sinks. To this end, we varied the individual thermophysical properties of the coolant and studied their impact on the heat sink performance. We demonstrated that the relative thermal conductivity enhancement must be larger than the relative viscosity increase in order to gain a sizeable performance benefit. Furthermore, we showed that it would be preferable to increase the volumetric heat capacity of the fluid instead of increasing its thermal conductivity.