Topic
Heat sink
About: Heat sink is a research topic. Over the lifetime, 44009 publications have been published within this topic receiving 526861 citations. The topic is also known as: heatsink.
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Patent•
18 Sep 1989
TL;DR: In this article, a three-dimensional high density package for integrated circuits for which integrated circuits are placed onto substrate layers and then stacked together is described, and techniques for interconnecting the layers to one another and for connecting the layer to external circuitry are also disclosed.
Abstract: This invention discloses a three-dimensional, high density package for integrated circuits for which integrated circuits are placed onto substrate layers and then stacked together. Techniques for interconnecting the layers to one another and for connecting the layers to external circuitry are also disclosed. Techniques for cooling the stack with heat sinks or fluid flow are also disclosed.
418 citations
Patent•
22 Feb 2001
TL;DR: In this paper, an electrically driven light emitting diode (LED) assembly comprising a light emitter (12), first ( 14 ) and second ( 16 ) electrical leads for conducting electricity to and from the light emitting dode (12 ), and a heat sink (18 ).
Abstract: An electrically driven light emitting diode (LED) assembly comprising a light emitting diode ( 12 ), first ( 14 ) and second ( 16 ) electrical leads for conducting electricity to and from the light emitting diode ( 12 ), and a heat sink ( 18 ). The assembly is characterized by the first lead ( 14 ) including the heat sink ( 18 ) for conducting electricity and heat from the light emitting diode ( 12 ) through the heat sink ( 18 ). In other words, the diode ( 12 ) conducts electricity through a heat sink ( 18 ) allowing the diode ( 12 ) to be in electrical conductivity with the heat sink ( 18 ).
417 citations
TL;DR: In this article, the equations governing the fluid dynamics and combined conduction/convection heat transfer in a heat sink are presented in dimensionless form for both laminar and turbulent flow.
Abstract: The equations governing the fluid dynamics and combined conduction/convection heat transfer in a heat sink are presented in dimensionless form for both laminar and turbulent flow. A scheme presented for solving these equations permits the determination of heat sink dimensions that display the lowest thermal resistance between the hottest portion of the heat sink and the incoming fluid. Results from the present method are applied to heat sinks reported by previous investigators to study effects of their restrictions regarding the nature of the flow (laminar or turbulent), the ratio of fin thickness to channel width, or the aspect ratio of the fluid channel. Results indicate that when the pressure drop through the channels is small, laminar solutions yield lower thermal resistance than turbulent solutions. Conversely, when the pressure drop is large, the optimal thermal resistance is found in the turbulent region. With the relaxation of these constraints, configurations and dimensions found using the present procedure produce significant improvement in thermal resistance over those presented by all three previous studies. >
407 citations
TL;DR: In this article, the use of phase change material (PCM)-based heat sink in transient thermal management of plastic quad flat package (QFP) electronic devices was investigated experimentally and numerically.
407 citations
TL;DR: In this paper, the authors describe the rationale for the selection of PFMs in ITER (Be, W, carbon fibre reinforced carbon) is described with regard to the critical issues concerning PFMs, esp. erosion during transient heat loads and the T-inventory in connection with the redeposition of carbon.
403 citations