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Hydrostatic stress

About: Hydrostatic stress is a research topic. Over the lifetime, 1568 publications have been published within this topic receiving 37773 citations.


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TL;DR: In this paper, a 3D general coupling model for electromigration has been developed with the use of the mass conservation equation, and the numerical results reveal that the hydrostatic stress is significantly lower than predicted results in the existing literature for the totally fixed configuration.
Abstract: A three-dimensional (3D) general coupling model for electromigration has been developed with the use of the mass conservation equation. The flux terms that include concentration gradient, electron wind force, stress migration, and thermal migration are considered. The constitutive equation for the electromigration strain has been derived. Then, the governing equations for one-dimensional (1D) metal lines are obtained for both totally fixed and stress-free mechanical boundary conditions. The numerical results reveal that the hydrostatic stress is significantly lower than the predicted results in the existing literature for the totally fixed configuration. Extensive discussions are presented to provide the explanations of such difference. The vacancy concentration gradient plays an important role in formulating electromigration problems. The current-driven flux can be entirely balanced by the concentration gradient that acts as an opposing force during electromigration under a stress-free condition in steady-state. The new solutions of the critical threshold jL, the product of current density, and metal line length are obtained in terms of vacancy concentration. As electromigration is eventually determined by the void growth, the critical vacancy concentration is used to reanalyze Blech's experiment data. The theoretical predictions are consistent with the experimental observations.A three-dimensional (3D) general coupling model for electromigration has been developed with the use of the mass conservation equation. The flux terms that include concentration gradient, electron wind force, stress migration, and thermal migration are considered. The constitutive equation for the electromigration strain has been derived. Then, the governing equations for one-dimensional (1D) metal lines are obtained for both totally fixed and stress-free mechanical boundary conditions. The numerical results reveal that the hydrostatic stress is significantly lower than the predicted results in the existing literature for the totally fixed configuration. Extensive discussions are presented to provide the explanations of such difference. The vacancy concentration gradient plays an important role in formulating electromigration problems. The current-driven flux can be entirely balanced by the concentration gradient that acts as an opposing force during electromigration under a stress-free condition in stead...

17 citations

Journal ArticleDOI
TL;DR: In this paper, a rate-independent plasticity theory is presented that aims at describing the plastic behavior of incompressible, but hydrostatic pressure sensitive metals as experimentally observed by Spitzig and Richmond.

17 citations

Journal ArticleDOI
TL;DR: In this article, a numerical evaluation of the effects of geometrical factors on the hydrostatic stress and stress gradients in passivated copper interconnects was performed, which was correlated with experimental values in the literature on the location of voids in the interconnect.
Abstract: A numerical evaluation of the effects of geometrical factors on the hydrostatic stress and hydrostatic stress gradients in passivated copper interconnects was performed. These values were correlated with experimental values in the literature on the location of voids in the interconnect. Copper interconnects of aspect ratios between 0.1 and 10 were studied. Numerical work using the commercial ANSYS software and analytical work based on the Eshelby and Wikstrom models were performed. Comparison is made between the analytical, numerical and experimental results (obtained from the literature). It was found that for an interconnect with no pre-existing voids, maximum hydrostatic stress gradients occurred at the corners of the interconnects suggesting that void growth is most probable at the corners of the interconnect. The stress gradient within the interconnect with aspect ratio of 10 is about 10 times larger than that in interconnects of aspect ratios 0.1 and 1. This suggests that the narrowest interconnects are most likely to undergo voiding. This study found that it is insufficient to look only at the hydrostatic stress at the centre of the interconnect and that stress gradient also needs to be taken into consideration to assess reliability.

17 citations

Journal ArticleDOI
TL;DR: In this paper, the volumetric response between uniaxial tension and confined axial compression loading for commercial particle-filled hydrogenated nitrile butadiene rubber (HNBR) and fluoroelastomer (FKM) compounds was investigated.

17 citations

Journal ArticleDOI
TL;DR: In this paper, a micro-pillar tension testing protocol may serve as an effective method for quantitatively assessing the adhesion strength of ceramic hard coatings on substrates, and demonstrate its effectiveness through a combination of micro tension testing and crystal plasticity finite element analysis (CPFEA).

17 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202318
202246
202134
202047
201948
201839