Indentation

About: Indentation is a research topic. Over the lifetime, 13002 publications have been published within this topic receiving 340476 citations.

Spherical indentation load-relaxation of soft biological tissues

Abstract: Elastic-viscoelastic correspondence was used to generate displacement–time solutions for spherical indentation testing of soft biological materials with time-dependent mechanical behavior. Boltzmann hereditary integral operators were used to determine solutions for indentation load-relaxation following a constant displacement rate ramp. A “ramp correction factor” approach was used for routine analysis of experimental load-relaxation data. Experimental load-relaxation tests were performed on rubber, as well as kidney tissue and costal cartilage, two hydrated soft biological tissues with vastly different mechanical responses. The experimental data were fit to the spherical indentation ramp-relaxation solutions to obtain values of short- and long-time shear modulus and of material time constants. The method is used to demonstrate linearly viscoelastic responses in rubber, level-independent indentation results for costal cartilage, and age-independent indentation results for kidney parenchymal tissue.

Cyclic Fatigue from Frictional Degradation at Bridging Grains in Alumina

Abstract: Tension-tension cyclic loading tests have been conducted on a coarse-grained alumina ceramic that exhibits toughness-curve behavior by grain-interlock bridging Fatigue effects are observed in the regions of both short cracks, using indentation flaws, and long cracks, using compact-tension specimens A true mechanical fatigue effect is demonstrated by running the tests below the static fatigue limit A custom-made device for in situ observation of crack propagation in the scanning electron microscope enables us to identify bridge degradation as a cause of the fatigue process

Strength and sharp contact fracture of silicon

Abstract: The fracture strength of Si is considered in the context of yield and reliability of microelectronic and microelectromechanical (MEMS) devices. An overview of Si fracture, including the strength of Si wafers, dice and MEMS elements, highlights the importance of understanding sharp contact flaws, with their attendant residual stress fields, lateral cracks and strength-limiting half-penny cracks in advanced Si device manufacturing. Techniques using controlled indentation flaws, including measurements of hardness, crack lengths, crack propagation under applied stress, and inert and reactive strengths, are applied in an extensive new experimental study of intrinsic, n- and p-type {100} and {110} Si single crystals and polycrystalline Si, addressing many of the issues discussed in the overview. The new results are directly applicable in interpreting the strengths of ground or diced Si wafer surfaces and provide a foundation for studying the strengths of MEMS elements, for which the strength-controlling flaws are less well-defined. Although the indentation fracture behavior of Si is shown to be quite anisotropic, the extensive lateral cracking greatly affects crack lengths and strengths, obscuring the underlying single crystal fracture anisotropy. No effects of doping on fracture are observed. Strength decreases in water and air suggest that Si is susceptible to reactive attack by moisture, although the effect is mild and extremely rapid. Strength increases of indented components after buffered HF etching are shown to be due to reactive attack of the contact impression, leading to residual stress relief.

Microhardness relating to crystalline polymers

Abstract: The present review shows how the microhardness technique can be used to elucidate the dependence of a variety of local deformational processes upon polymer texture and morphology. Microhardness is a rather elusive quantity, that is really a combination of other mechanical properties. It is most suitably defined in terms of the pyramid indentation test. Hardness is primarily taken as a measure of the irreversible deformation mechanisms which characterize a polymeric material, though it also involves elastic and time dependent effects which depend on microstructural details. In isotropic lamellar polymers a hardness depression from ideal values, due to the finite crystal thickness, occurs. The interlamellar non-crystalline layer introduces an additional weak component which contributes further to a lowering of the hardness value. Annealing effects and chemical etching are shown to produce, on the contrary, a significant hardening of the material. The prevalent mechanisms for plastic deformation are proposed. Anisotropy behaviour for several oriented materials is critically discussed.