Topic
Inductor
About: Inductor is a research topic. Over the lifetime, 52565 publications have been published within this topic receiving 484068 citations. The topic is also known as: passive two terminal.
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Patent•
16 Aug 1993
TL;DR: In this paper, the fabrication of thin-film inductors on a substrate is described, which may include thin film resistors, thin film capacitors, and semiconductor devices, and a combination of various individual process steps from various embodiments are suitable for use to fabricate the individual layers to achieve a structure of this invention.
Abstract: The fabrication of thin film inductors on a substrate, which may include thin film resistors, thin film capacitors, and semiconductor devices. In one embodiment an inductor is fabricated initially on a substrate and then integrated with other devices subsequently formed on the substrate. In this embodiment, process steps used to fabricate such other devices utilize temperatures sufficiently low to prevent damaging or destroying the characteristics of the inductor. In another embodiment the fabrication of an inductor is achieved through photoresist masking and plating techniques. In alternative embodiments, fabrication of an inductor is achieved by sputtering, photoresist processes and etching/ion-milling techniques. A combination of various individual process steps from various embodiments are suitable for use to fabricate the individual layers to achieve a structure of this invention. The inductor fabricated in accordance with this invention is connected to other passive or active components through metal interconnections in order to improve the frequency performance of the inductor. In certain embodiments, parasitic capacitance of the inductor is significantly reduced by fabricating inductor coils on dielectric bridges. In certain embodiments, a magnetic core of ferromagnetic material is used to improve the performance of the inductor at frequencies below about 100 MHz.
86 citations
TL;DR: In this article, a planar inductor with ferrite layers was fabricated by a screen printing, photolithography, and electroplating process, which achieved a high quality Q factor of 40-70 at 5 MHz.
Abstract: We fabricated planar inductors with ferrite layers by a screen printing, photolithography, and electroplating process. The screen printing method made it possible to obtain a coil spacing filled with ferrite. In this structure, the perpendicular leakage magnetic flux preferentially passes through the coil spacing and bypasses the copper conductor line, a path that is expected to reduce eddy current loss. Trial samples of a planar inductor with ferrite layers achieved a high-quality Q factor of 40-70 at 5 MHz. Magnetic field analysis revealed that the eddy current loss of the conductor line was only 2.4% of total loss.
86 citations
28 Mar 2013
TL;DR: Ultra-low power microsystems are gaining more popularity due to their applicability in critical areas of societal need, and the small form factors of such systems rule out the use of external inductors, making switched-capacitor (SC) DC-DC converters the favored topology.
Abstract: Ultra-low power microsystems are gaining more popularity due to their applicability in critical areas of societal need. Power management in these microsystems is a major challenge as a relatively high battery voltage (e.g., 4V) must be down-converted to several low supplies, such as 0.6V for near-threshold digital circuits and 1.2V for analog circuits [1]. Furthermore, the small form factors of such systems rule out the use of external inductors, making switched-capacitor (SC) DC-DC converters the favored topology [2-4].
86 citations
TL;DR: A new interleaved coupled-inductor nonisolated bidirectional dc–dc converter that provides high voltage gain ratio (VGR), low ripple current at the low-voltage side (LVS), and soft switching is presented.
Abstract: This paper presents a new interleaved coupled-inductor nonisolated bidirectional dc–dc converter that provides high voltage gain ratio (VGR), low ripple current at the low-voltage side (LVS), and soft switching. The high VGR is obtained by connecting in series the outputs of an interleaved bidirectional buck–boost converter and a dual-active half-bridge converter, using the turns ratio of a coupled inductor. Since the voltage of the high-voltage side is shared between the converters outputs, the voltage stress across the active switches decrease. The active switches turn ON under zero-voltage switching condition in both directions. Moreover, the low current ripple at the LVS is achieved due to the applied interleaved technique. By employing the phase-shift angle modulation, the output voltage is regulated. The proposed converter is analyzed in details and a 900-W experimental prototype with 48-V input voltage and 400-V output voltage under 100-kHz switching frequency is implemented to verify the theoretical results.
86 citations