Integrated circuit layout

Abstract: The Third Edition of CMOS Circuit Design, Layout, and Simulation continues to cover the practical design of both analog and digital integrated circuits, offering a vital, contemporary view of a wide range of analog/digital circuit blocks including: phase-locked-loops, delta-sigma sensing circuits, voltage/current references, op-amps, the design of data converters, and much more. Regardless of one's integrated circuit (IC) design skill level, this book allows readers to experience both the theory behind, and the hands-on implementation of, complementary metal oxide semiconductor (CMOS) IC design via detailed derivations, discussions, and hundreds of design, layout, and simulation examples.

Abstract: Feel lonely? What about reading books? Book is one of the greatest friends to accompany while in your lonely time. When you have no friends and activities somewhere and sometimes, reading book can be a great choice. This is not only for spending the time, it will increase the knowledge. Of course the b=benefits to take will relate to what kind of book that you are reading. And now, we will concern you to try reading combinatorial algorithms for integrated circuit layout as one of the reading material to finish quickly.

Abstract: This paper describes a project to create a novel design and simulation tool for quantum-dot cellular automata (QCA), namely QCADesigner. QCA logic and circuit designers require a rapid and accurate simulation and design layout tool to determine the functionality of QCA circuits. QCADesigner gives the designer the ability to quickly layout a QCA design by providing an extensive set of CAD tools. As well, several simulation engines facilitate rapid and accurate simulation. This tool has already been used to design full-adders, barrel shifters, random-access memories, etc. These verified layouts provide motivation to continue efforts toward a final implementation of QCA circuits.

Abstract: Reducing interconnect pitch improves layout density, but degrades interconnect RC delay. Increasing metal aspect ratio (thickness/width) improves RC delay, but maximum benefits are achieved at an aspect ratio of /spl sim/2. Adding more interconnect layers improves density and performance, but practical limits are reached in just a few generations. New conductor and dielectric materials and improved circuit design techniques will be needed to meet future ULSI interconnect requirements.

Abstract: The results of a comprehensive investigation into the characteristics and optimization of inductors fabricated with the top-level metal of a submicron silicon VLSI process are presented. A computer program which extracts a physics-based model of microstrip components that is suitable for circuit (SPICE) simulation has been used to evaluate the effect of variations in metallization, layout geometry, and substrate parameters upon monolithic inductor performance. Three-dimensional (3-D) numerical simulations and experimental measurements of inductors were also used to benchmark the model accuracy. It is shown in this work that low inductor Q is primarily due to the restrictions imposed by the thin interconnect metallization available in most very large scale integration (VLSI) technologies, and that computer optimization of the inductor layout can be used to achieve a 50% improvement in component Q-factor over unoptimized designs.