Junction temperature

About: Junction temperature is a research topic. Over the lifetime, 5058 publications have been published within this topic receiving 58643 citations.

Thyristor junction temperature monitor

Abstract: A circuit for monitoring the junction temperature of a conducting thyristor by measuring the temperature of a reference point and synthesizing the thermal response of the physical configuration between the thyristor junction and that reference point. The synthesized signal generated is indicative of the temperature difference between the junction and said reference point. That signal is combined with a signal indicative of the measured reference temperature to provide an output signal indicative of junction temperature per se. The output signal may be utilized to stop conduction in the thyristor when the monitored temperature exceeds a predetermined level.

Differential radiation detector probe

Abstract: An infrared detector is positioned in a probe having leads which connect to a standard hand-held voltmeter. The detected voltage may indicate the difference between a target temperature surface and ambient temperature. For more accurate sensing of ambient temperature, a thermocouple may be connected in series with the thermopile with one junction at the thermopile cold junction temperature and another junction sensing ambient temperature. The ambient temperature may be that temperature surrounding the infrared detector or the temperature of the environment surrounding the meter. The infrared detector may be calibrated to provide a direct reading of temperature degrees by a factor of ten on the voltage scale of the meter. To that end, multiple thermocouples may be connected in series, each with a junction responding to ambient temperature and a junction responding to thermopile cold junction temperature.

Advanced setup for thermal cycling of power modules following definable junction temperature profiles

Abstract: In this paper a setup for performing power cycling tests of IGBT modules for the purpose of reliability analysis is presented. The main purpose of the setup is to provide experimental data for the parameterization and verification of a newly developed physical model of solder deformation leading to the failure of power electronic devices. The design procedure, including considerations of reliability, measurement, and cooling, for a 5 kW flexible power cycling system is presented. Experimental results of a sub-1 kW prototype setup are shown, demonstrating the ability of the system to force the junction temperature of the device under test to follow an arbitrary temperature profile.

Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power Cycling

Abstract: 2.5D packages have been widely used in electronics industry for high performance and product miniaturization. As Through-Silicon-Via (TSV) fabrication methods and multi-level assembly technologies get mature, 2.5D packaging becomes reliable and affordable. In this work, board-level life prediction was performed for a 2.5D Field-Programmable Gate Array (FPGA) assembly in both accelerated thermal cycling and power cycling. Finite element models were built and validated by warpage measurement. Solder fatigue life in power cycling was investigated by computational fluid dynamics (CFD) simulation and finite element analysis. Improved life prediction for power cycling was achieved by mapping temperature results from CFD model to finite element model. Parametric studies regarding geometry and material factors were performed including PCB, substrate, thermal interface material (TIM) and lid adhesive, to give design suggestions to improve board-level thermal reliability. Maximum junction temperature of a 2.5D FPGA package is dependent on application scenarios and working environment. It is found that the designed maximum junction temperature and applied heatsink clamping force have considerable influences on board-level reliability.