Lead zirconate titanate

About: Lead zirconate titanate is a research topic. Over the lifetime, 7141 publications have been published within this topic receiving 150878 citations.

Reactive Ion Etching of Lead Zirconate Titanate (PZT) Thin Film Capacitors

Abstract: One of the key processing concerns in the integration of PbZr[sub x]Ti[sub 1[minus]x]O[sub 3](PZT) thin film capacitors into the existing VLSI for ferroelectric or dynamic random access memory applications is the patterning of these films and the electrodes. In this work, the authors have identified a suitable etch gas (CCl[sub 2]F[sub 2]) for dry etching of PZT thin films on RuO[sub 2] electrodes. The etch rate and anisotropy have been studied as a function of etching conditions. The trends in the effect on the etch rate of the gas pressure, RF power and O[sub 2] additions to the etch gas have been determined and an etching mechanism has been proposed. It was found that ion bombardment effects are primarily responsible for the etching of both PZT and RuO[sub 2] thin films. Etch rates of the order of 20--30 nm/min were obtained for PZT thin films under low gas pressure and high RF power conditions. The etch residues and the relative etch rates of the components of the PZT solid solution were determined using XPS. The results show that the etching of PbO is the limiting factor in the etch process.

Fabrication of Perovskite-Based High-Value Integrated Capacitors by Chemical Solution Deposition

Abstract: Projected trends for capacitors include increasing capacitance density and decreasing operating voltages, dielectric thickness and process cost. Advances in the fabrication and processing of barium strontium titanate (BST) and lead zirconate titanate (PZT)-based thin films are presented toward attaining these goals in next-generation high-value integrated capacitors. Increasing capacitance density has been demonstrated through the use of large-area electrodes, multilayer structures, and decreased dielectric layer thickness. Capacitance values as high as 10 μF were obtained in a single-layer, 10 cm2 film, and layer thicknesses as small as 9 nm have been achieved using chemical solution deposition. Base metal integration results for BST and PZT films are discussed in terms of additional cost and volume reduction; such films have achieved capacitance densities as high as 1.5 μF/cm2 and electric fields of 25 V/μm.

Sensing characteristics of in-plane polarized lead zirconate titanate thin films

Abstract: The sensing characteristics of in-plane polarized lead zirconate titanate (PZT) thin films were studied and compared with the through-thickness polarized PZT films. The in-plane polarized PZT films were deposited on ZrO2-passivated silicon substrates and had interdigitated electrode systems on the top surface; hence, they can be polarized in the film plane. This in-plane polarization configuration separates the electrode spacing and film thickness as independent variables; thus, the voltage sensitivity can be increased by using wider electrode spacing even for fixed film thickness. The results show that for films with a thickness of 1 μm the voltage sensitivity of in-plane polarized PZT films can be more than 20 times higher than that of the conventional, through-thickness polarized PZT films which were deposited on Pt-buffered silicon substrates.

Manufacture and characterization of high activity piezoelectric fibres

Abstract: Piezoelectric fibres are finding increasing application in a variety of piezoelectric composites, including active fibre composites (AFCs). This paper describes the manufacture and characterization of lead zirconate titanate (PZT) fibres manufactured by viscous plastic processing (VPP). The manufacturing method will be described along with a systematic characterization of the macrostructure, microstructure, phase composition and low and high field piezoelectric properties. A comparison with other available PZT fibres will be made, which demonstrates that the VPP PZT fibres display high piezoelectric coefficients.

Liquid spray head and its production method

Abstract: The present invention relates to a liquid spray head provided with a plurality of liquid spray elements arranged in an array on a substrate. Each element comprises a chamber arranged on the substrate for holding a liquid to be sprayed, a nozzle, a liquid path for communication with the nozzle and the chamber, a diaphragm arranged on the liquid chamber, a piezoelectric element comprising a lower electrode arranged on the diaphragm, a piezoelectric film comprising a lead zirconate titanate film arranged on the lower electrode and an upper electrode arranged on the piezoelectric film. Energy is applied to the piezoelectric element so as to bend the diaphragm for deforming a volume of the liquid chambers to spray the liquid. The liquid chambers have a pitch equal to the pitch of the nozzles, and the following relationships are satisfied: 1) 10≦W/L≦150 2) tp≧tv 3) 0.012≦(tp+tv)/L<0.08 where L is a length of the liquid chambers in an array direction, W is a length of the liquid chambers in a depth direction, tp is a thickness of the lead zirconate titanate film and tv is a thickness of the diaphragms.