Liquid metal

About: Liquid metal is a research topic. Over the lifetime, 6947 publications have been published within this topic receiving 77785 citations. The topic is also known as: liquid alloy & liquid metal alloy.

Self-diffusion in liquid tin and indium over extensive temperature ranges.

Abstract: The capillary-reservoir technique has been used to study the diffusion of Sn113 and Sb125 in liquid tin from 665°to 1746°K, and the self-diffusion of In114 from 621° to 1378°K. Multichannel scintillation radiotracer analyses were used to determine the total amount of diffusate migrating either into or out of a capillary tube. A definite wall effect was observed for In114 at 775°K. On the basis of the broad temperature range diffusivity data obtained, experimental criteria were established for very accurate measurement and calculation of liquid metal diffusivities using the capillary-reservoir technique. These criteria include: selection of the capillary tube material and diameter, determination of the magnitude of the △l effect, and careful identification of the radioisotopes employed in the determination of the diffusivities. It was found that the diffusion data do not fit any of the available theoretical models over the complete temperature range, nor any empirical relations of the formD =AT n. The observed nonlinear variation of logD vs logT was correlated with the disappearance of a second structure in the liquid state of tin.

Numerical and Experimental Investigations of the Thermal Management of Power Electronics With Liquid Metal Mini-Channel Coolers

Abstract: Thermal management became a limiting factor in the development of high-power electronic devices, and new methods of cooling are required. Therefore, the use of liquid gallium alloys, whose thermal conductivity (approximately 28 W/m/K) is 40 times greater than thermal conductivity of water, is introduced. In the first part of this paper, we present a numerical modeling and an experimental study of a mini-channel liquid metal cooler. In these experiments, the working fluid is moved via an electromagnetic pump. Numerical and experimental results are compared. Then, a numerical study dealing with the influence of the thermal conductivity of the cooler material is conducted, and a discussion on the use of classical convective heat transfer correlations is presented. In the last part, a numerical study of the cooling of a silicon chip is carried out. The cooling capacity of the liquid metal is compared with that of the water cooling, and very attractive results are obtained. The concept discussed in this paper is expected to provide a powerful cooling strategy for high-power-density electronic devices.