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Showing papers on "Lithography published in 1972"


14 Mar 1972
TL;DR: In this article, a newly developed x-ray lithographic process is described and its prospects for making sub-micron resolution pattern definition a common practice are assessed, and its performance is evaluated.
Abstract: : A newly developed x-ray lithographic process is described and its prospects for making sub-micron resolution pattern definition a common practice are assessed. (Author)

39 citations



Journal ArticleDOI
TL;DR: In this paper, an electron projection system that projects the whole electron image of the integrated circuit mask onto the wafer at once, enabling exposure times of 1 s or less to be attained.
Abstract: High-resolution electron-beam microfabrication requires long process times when using a single scanning beam to expose large-area integrated circuits. Exposure times for a 2-in wafer by a scanning beam system are typically between 30 min to 3 h, depending on the area and complexity of the circuit. This paper describes an electron projection system that projects the whole electron image of the integrated circuit mask onto the wafer at once, enabling exposure times of 1 s or less to be attained. The system incorporates a photocathode patterned into an integrated circuit mask. The pattern is projected and focused onto the wafer using axial magnetic and electrostatic fields. Described herein are factors affecting photocathode life and exposure times. A technique for automatic alignment of the mask to the wafer is also described which has achieved 0.25-µ alignment accuracies.

6 citations


Patent
24 Jul 1972
TL;DR: A lithographic and offset printing plate comprising an aluminum support having thereon image areas comprising copper electroplated on a metallic silver image formed in openings of or on an anodic oxidation film corresponding to said image areas of said support is described in this paper.
Abstract: A lithographic and offset printing plate comprising an aluminum support having thereon image areas comprising copper electroplated on a metallic silver image formed in openings of or on an anodic oxidation film corresponding to said image areas of said support is disclosed.