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Lithography
About: Lithography is a research topic. Over the lifetime, 23507 publications have been published within this topic receiving 348321 citations.
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TL;DR: Using a very fine electron beam in a dedicated field emission scanning electron microscope produces nanometer size deposits which extend from surfaces to heights in the micrometer range as mentioned in this paper, and these nanostructures have very special characteristics with respect to resistivity and shape.
Abstract: Two‐ and three‐dimensional patterns and structures can be grown by electron‐beam induced deposition from organic and metalorganic precursors. Using a very fine electron beam in a dedicated field emission scanning electron microscope produces nanometer size deposits which extend from surfaces to heights in the micrometer range. The material is fed to the sample through a nozzle which presents a small leakage flux to the specimen chamber. Having an image processor attached to the microscope allows two‐ and three‐dimensional deposition of material to be controlled. Selecting special speed rates for the motion of the beam generates inclined deposits even at a 90° beam landing angle. Combining a tilted sample and the two‐dimensional way of structuring yield three‐dimensional structures. These nanostructures have very special characteristics with respect to resistivity and shape. Selecting dimethyl‐ gold‐trifluoro‐acetylacetonate as precursor, a current of 1 nA, and a low electron energy of 10 keV for the depos...
70 citations
25 Jun 2003
TL;DR: In this paper, the authors present a sophisticated various on Kirchhoff approximation capable of modeling rigorous near field effects while retaining the simplicity of the scalar model, based on a comparison of the fields produced by both the thick and ideal thin masks on the wafer.
Abstract: The lack of transparent optical components at short wavelengths limits the available wavelengths in Deep Ultraviolet lithography, while the required minimum feature on wafer continues to shrink towards deeper sub-wavelength scales. This places a serious limitation on Kirchhoff boundary conditions that replace the field on the mask openings by the incident field, since this approximation fails to account for the increasingly important topographical effects (thick mask effects) in the computation of the lithographic image. In this paper we present a sophisticated various on Kirchhoff approximation capable of modeling rigorous near field effects while retaining the simplicity of the scalar model. Our model is based on a comparison of the fields produced by both the thick and ideal thin masks on the wafer. Polarization and edge diffraction effects as well as phase and transmission errors, are included in our model.
70 citations
TL;DR: The feasibility of using hydrogen silsesquioxane (HSQ) to directly pattern the relief layer of step and flash imprint lithography (SFIL) templates has been successfully demonstrated as mentioned in this paper.
Abstract: The feasibility of using hydrogen silsesquioxane (HSQ) to directly pattern the relief layer of step and flash imprint lithography (SFIL) templates has been successfully demonstrated. HSQ is a spin-coatable oxide, which is capable of high resolution electron-beam lithography. Negative acting and nonchemically amplified, HSQ has moderate electron-beam sensitivity and excellent processing latitude. In this novel approach, 6 ×6 × 0.25 in.3 quartz photomask substrates are coated with a 60 nm indium tin oxide (ITO) charge dissipation layer and directly electron-beam written using a 100 nm film of HSQ. Direct patterning of an oxide relief layer eliminates the problems of critical dimension control associated with both chromium and oxide etches, both required processes of previous template fabrication schemes. Resolution of isolated and semidense lines of 30 nm has been demonstrated on imprinted wafers using this type of template. During this evaluation, a failure of the release layer to provide a durable nonstic...
70 citations
TL;DR: A thermocouple with a thickness of 10 µm and a height of 250 µm, consisting of platinum and gold pillars is demonstrated, which enables manufacturing in the micrometer to millimeter range, i.e., between lithography and other 3D printing technologies.
Abstract: Slender, out-of-plane metal microdevices are made in a new spatial domain, by using laser-induced forward transfer (LIFT) of metals. Here, a thermocouple with a thickness of 10 µm and a height of 250 µm, consisting of platinum and gold pillars is demonstrated. Multimaterial LIFT enables manufacturing in the micrometer to millimeter range, i.e., between lithography and other 3D printing technologies.
70 citations
TL;DR: Inhibition effects in UV radiation curing by oxygen were utilized for fabricating monolithic, micro/nanoscale hierarchical polymer structures via two-step UVassisted capillary force lithography (CFL), finding that the UV exposure time for the partial curing was a crucial parameter.
Abstract: Inhibition effects in UV radiation curing by oxygen were utilized for fabricating monolithic, micro/nanoscale hierarchical polymer structures via two-step UVassisted capillary force lithography (CFL). It was found that the UV exposure time for the partial curing of microstructure was a crucial parameter; a shorter exposure time induced collapse of the underlying microstructure while a longer time gave rise to non-fluidity of the microstructure. The partial curing is attributed to inhibition of UV crosslinking by trapped or permeated oxygen within mold cavities. Using this method, various dual-scale hierarchical structures were fabricated with minimum resolution to 50 nm over a large area (5×5 cm 2 ) in a fast and reproducible manner.
70 citations