Lithography

About: Lithography is a research topic. Over the lifetime, 23507 publications have been published within this topic receiving 348321 citations.

Design of orientation stages for step and flash imprint lithography

Abstract: This paper presents the design of orientation stages for high-resolution imprint lithography machines. These machines implement a new lithography process known as Step and Flash Imprint Lithography (SFIL) and are intended for 1) sub 100 nm imprint demonstrations on flat substrates and 2) investigation of potential defect propagation during step and repeat imprinting. SFIL is an imprint lithography process that is a combination of chemical and mechanical steps and its implementation at room temperature and low pressure makes it an attractive process as compared to other imprint techniques. A critical component of an imprint machine is the orientation stage that is required to provide uniform intimate contact between the template and substrate surfaces. The orientation stage requirements are distinct from those used in photolithography since the depth of focus of projection optics allows for larger errors in the orientation alignment. Also, due to contact between the template and substrate surfaces in imprint lithography, the separation kinematics must be carefully controlled in the SFIL process. Two different orientation stages are designed for single- and multi-imprint machines. In order to eliminate the particle contamination due to frictional contacts, all joints are made with flexure joints. Imprint experiments have been performed to demonstrate sub 100 nm imprints.

Lithography system and process for fabricating device

Abstract: PROBLEM TO BE SOLVED: To provide a lithography projector in which a space between a substrate and a projection system is filled with liquid while minimizing the quantity of the liquid required to be accelerated during a stage operation. SOLUTION: In the lithography projector, the space between the final element of the projection system and the substrate table of the lithography projector is surrounded by a sealing member. A gas seal is formed between the sealing member and the plane of the substrate and the liquid is confined in that space. COPYRIGHT: (C)2005,JPO&NCIPI

Seamless, maskless lithography system using spatial light modulator

Abstract: The invention is a seamless, projection lithography system that eliminates the need for masks through the use of a programmable Spatial Light Modulator (SLM) with high parallel processing power. Illuminating the SLM with a radiation source (1) provides a patterning image of many pixels via a projection system (4) onto a substrate (5). The preferred SLM is a Deformable Micromirror Device (3) for reflective pixel selection using a synchronized pulse laser. An alternative SLM is a Liquid Crystal Light Valve (LCLV) (45) for pass-through pixel selection. Electronic programming enables pixel selection control for error correction of faulty pixel elements. Pixel selection control also provides for negative and positive imaging and for complementary overlapping polygon development for seamless uniform dosage. The invention provides seamless scanning motion by complementary overlap to equalize radiation dosage, to expose a pattern on a large area substrate (5). The invention is suitable for rapid prototyping, flexible manufacturing, and even mask making.

Production of separation-nozzle systems for uranium enrichment by a combination of X-ray lithography and galvanoplastics

Abstract: X-ray lithography using synchrotron radiation has been applied in a multi-step process for the production of plastic moulds to be used in the fabrication of separation nozzles by electrodeposition. For characteristic dimensions of a few microns a total height of the nozzle structure of about 400 μm has been achieved. Structural details of about 0.1 μm are being reproduced across the total thickness of the polymer layer. The surface finish of metallic separation nozzles produced by electrodeposition was equivalent to the high quality of the polymer surface. The separation-nozzle systems fabricated by the described method allow an increase by a factor three of the gas pressure in separationnozzle plants as compared to the present standard. This results in considerable savings in the enrichment of 235U for nuclear power production.