Lithography

About: Lithography is a research topic. Over the lifetime, 23507 publications have been published within this topic receiving 348321 citations.

Three-dimensional microfabrication using synchrotron radiation

Abstract: For fabricating microstructures with extreme structural heights a technology has been developed which is based on deep-etch lithography and subsequent replication processes. A particularly high precision is achieved when the lithographic process is carried out by means of synchrotron radiation. Electroforming and molding processes are used for the replication of microstructures from a large variety of materials. The field of application comprises sensors, electrical and optical microconnectors, components for fluid technology, micromechanical components, microfiltration systems and novel composite materials.

Polymer materials for microlithography

Abstract: Since the last review on resist materials for microlithography appeared in the Annual Review of Materials Science (Vol. 6, 1976) (1), astonishing progress has been made in microelectronics, especially in the technology of lithography used to generate high-resolution patterns. In 1976, the state­ of-the-art dynamic random access memory (DRAM) device was capable of storing 4000 bits of data and had minimum features of 5-6 flm. Photo­ lithography was utilized to pattern these devices using either contact print­ ing or, the then relatively new, one-to-one projection printing. Today, devices with one million bits of storage capacity are commercially available with minimum features of 1.0 flm (2). By 1976 standards, it is surprising that photolithography is still the technology used to fabricate micro­ electronic chips. Step-and-repeat 5 or 10 x reduction cameras and highly sophisticated I -toI projection printers are the dominant printing tech­ nologies. There is perhaps no better example than lithography to illustrate the uncertainty associated with predicting technological direction and change. In 1976, it was generally believed (though not by everyone) that photolithography would not be able to produce features smaller than about l.5 flm with high chip yields in a production environment. The current belief is that conventional photolithography will be able to print 0.6-0.8 flm features and will be the dominant technology well into the first half of the 1990s. The same basic positive photoresist, a diazonaphtho­ quinone-novo lac composite, will likely still be the resist of choice. The cost of introducing a new resist material and the cost associated with new hardware are strong driving forces pushing photolithography to its absolute, ultimate limits.

Three-dimensional photonic crystals fabricated by visible light holographic lithography

Abstract: In this report, we present three-dimensional photonic crystals fabricated by a four-beam holographic lithography method using visible photoinduced polymerization. High-quality face-centered-cubic single crystals with a large range of polymeric matrix volume fraction were fabricated using optimal conditions obtained from computer simulations. Optical measurements of the crystals showing photonic band-gap-like behavior are presented for different polymeric matrix volume fractions.

Optically Clear and Resilient Free-Form µ-Optics 3D-Printed via Ultrafast Laser Lithography

Abstract: We introduce optically clear and resilient free-form micro-optical components of pure (non-photosensitized) organic-inorganic SZ2080 material made by femtosecond 3D laser lithography (3DLL). This is advantageous for rapid printing of 3D micro-/nano-optics, including their integration directly onto optical fibers. A systematic study of the fabrication peculiarities and quality of resultant structures is performed. Comparison of microlens resiliency to continuous wave (CW) and femtosecond pulsed exposure is determined. Experimental results prove that pure SZ2080 is ∼20 fold more resistant to high irradiance as compared with standard lithographic material (SU8) and can sustain up to 1.91 GW/cm2 intensity. 3DLL is a promising manufacturing approach for high-intensity micro-optics for emerging fields in astro-photonics and atto-second pulse generation. Additionally, pyrolysis is employed to homogeneously shrink structures up to 40% by removing organic SZ2080 constituents. This opens a promising route towards downscaling photonic lattices and the creation of mechanically robust glass-ceramic microstructures.

Nanoimprint lithography steppers for volume fabrication of leading-edge semiconductor integrated circuits.

Abstract: This article discusses the transition of a form of nanoimprint lithography technology, known as Jet and Flash Imprint Lithography (J-FIL), from research to a commercial fabrication infrastructure for leading-edge semiconductor integrated circuits (ICs) Leading-edge semiconductor lithography has some of the most aggressive technology requirements, and has been a key driver in the 50-year history of semiconductor scaling Introducing a new, disruptive capability into this arena is therefore a case study in a "high-risk-high-reward" opportunity This article first discusses relevant literature in nanopatterning including advanced lithography options that have been explored by the IC fabrication industry, novel research ideas being explored, and literature in nanoimprint lithography The article then focuses on the J-FIL process, and the interdisciplinary nature of risk, involving nanoscale precision systems, mechanics, materials, material delivery systems, contamination control, and process engineering Next, the article discusses the strategic decisions that were made in the early phases of the project including: (i) choosing a step and repeat process approach; (ii) identifying the first target IC market for J-FIL; (iii) defining the product scope and the appropriate collaborations to share the risk-reward landscape; and (iv) properly leveraging existing infrastructure, including minimizing disruption to the widely accepted practices in photolithography Finally, the paper discusses the commercial J-FIL stepper system and associated infrastructure, and the resulting advances in the key lithographic process metrics such as critical dimension control, overlay, throughput, process defects, and electrical yield over the past 5 years This article concludes with the current state of the art in J-FIL technology for IC fabrication, including description of the high volume manufacturing stepper tools created for advanced memory manufacturing