Topic
Material flow
About: Material flow is a research topic. Over the lifetime, 3050 publications have been published within this topic receiving 36844 citations. The topic is also known as: material stream.
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TL;DR: In this article, a literature review describes several approaches to the design of material flow networks, including conventional type systems and more recent developments like the single-hoop, tandem configuration, SBSL, and SFT.
Abstract: The effectiveness of a material handling system depends on several factors, among them a well-thought-out flow-path design. The flow path has a significant effect on the travel time, the operating expenses, and the installation costs of the system. Moreover, the flow-path configuration has a significant impact on the complexity of the system's control software. The literature review presented in this paper describes several approaches to the design of material flow networks, including conventional type systems and more recent developments like the single-hoop, tandem configuration, SBSL, and SFT.
38 citations
Patent•
18 Jan 1994
TL;DR: In this article, a mass flowmeter is disclosed having a flow tube inserted within the confines of a conduit containing a material flow, and mass flow information is derived for the material flow within the conduit by generating mass flow flow information for the flowing within the smaller flow tube positioned within a conduit.
Abstract: A mass flowmeter is disclosed having a flow tube inserted within the confines of a conduit containing a material flow. Mass flow information is derived for the material flow within the conduit by generating mass flow information for the material flowing within the smaller flow tube positioned within the conduit and then by adjusting the calculations for the flow tube to represent mass flow information for the conduit. In accordance with a first embodiment of the invention, a pressurized cover is positioned around the flow tube to isolate the exterior surface of the flow tube from the material in the conduit. The space between the exterior of the flow tube and the cover is pressurized to a pressure equal to that of the material in the conduit. Both sides of the flow tube walls are at the same pressure so that a flow tube comprised of thinner and more flexible material may be used. In accordance with a second embodiment of the invention, the cover is not used and the flow tube is inserted directly into the conduit and the exterior walls of the flow tube are in contact with the material within the conduit. This embodiment is advantageous in applications in which the conduit material is of low viscosity. The embodiment with the pressurized cover is ideally suited for use in applications with heavy viscosity material.
38 citations
TL;DR: In this article, a 3D Finite Element (FE) model was developed to simulate the bending process, based on the experimental conditions, and the results showed that it is possible to adopt a two-step forming process, "bending" and "flow forming", to enable material flow along the mandrel in order to form a thin-wall cup component using two different profiles and adopting an axial roller movement.
38 citations
TL;DR: In this paper, a due date assignment model (DDAM) was constructed by using the simulation method and queuing theory to find a suitable WIP level and then control the material release by fixed-WIP policy.
Abstract: High work-in-process (WIP) level, long manufacturing lead time, high lead time variation, and poor due date performance are the major problems for wafer fabrication factories. An order's due date relates to its releasing time and flow time. Due date performance will not be improved if WIP level is high and material flow is unstable. Too high WIP level cannot increase throughput but lengthens lead time. Find a suitable WIP level and then control the material release by fixed-WIP policy. In this paper, we construct a due date assignment model (DDAM) by using the simulation method and queuing theory. Observing the results of simulations, the lowest system WIP level corresponding to the desired up-time machine utilization rate of the bottleneck resource or the capacity constraint resource (CCR) and the shortest mean flow time can be found. To make the material flow stable, we also propose the methodology of determining a wafer's WIP level, daily moves, and flow time for each product type and for each circuitry layer; all of these can be used as the parameters for controlling flow time. Demonstration of the DDAM is provided with actual data. Comparing the performance of our DDAM with others, the results reveal that DDAM performs well in each performance criterion.
38 citations
TL;DR: In this paper, a numerical model was developed to investigate the material flow mechanism during the extrusion and deposition process, and an empirical parametric associative model was proposed to predict the filament deformation based on material yield stress and relative nozzle travel speed.
Abstract: The material flow mechanism affects the printing quality considerably in 3D cementitious material printing (3DCMP) area. A numerical model was developed to investigate the material flow mechanism during the extrusion and deposition process. To quantify the effects of flow mechanism on the filament printing quality, deformation of the printed filament was proposed. Then a Support Vector Machine (SVM) was employed to study various factors on flow mechanism, hence the deformation of the printed filament. The SVM model results showed that deformation of the printed filament is independent of plastic viscosity, however, material yield stress and relative nozzle travel speed significantly affect the deformation of the printed filament. Lastly, an empirical parametric associative model was proposed to predict the filament deformation based on material yield stress and relative nozzle travel speed.
38 citations