Topic
Micro-loop heat pipe
About: Micro-loop heat pipe is a research topic. Over the lifetime, 3363 publications have been published within this topic receiving 46815 citations.
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TL;DR: In this paper, the effect of Fe2O3/Kerosene nanofluid to the copper closed-loop oscillating heat pipe under the magnetic field for inclination angles ranging from 0° to 90°, under different heat inputs (10 − 90 W).
158 citations
TL;DR: In this paper, a theoretical analysis is conducted to determine the primary factors affecting the startup characteristics of a pulsating heat pipe, and it is found that the wall surface condition, evaporation in the heating section, superheat, bubble growth, and vapor bubbles trapped in cavities at the capillary inner wall affect the startup of oscillating motion in the pulsing heat pipe.
151 citations
Patent•
12 Feb 1993TL;DR: In this paper, a computer chassis assembly that includes a heat pipe which thermally couples an electronic package to multiple fan units is described, and the heat pipe provides computer chassis that sufficiently cools internal heat generating components without placing the components in close proximity to the fans.
Abstract: A computer chassis assembly that includes a heat pipe which thermally couples an electronic package to multiple fan units. The heat pipe provides a computer chassis that sufficiently cools internal heat generating components without placing the components in close proximity to the fans.
150 citations
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25 Nov 1965
TL;DR: In this paper, a quantitative engineering theory for the design and performance analysis of heat pipes is given, where a heat pipe is a self-contained structure which achieves very high thermal conductance by means of two-phase fluid flow with capillary circulation.
Abstract: : A heat pipe is a self-contained structure which achieves very high thermal conductance by means of two-phase fluid flow with capillary circulation. A quantitative engineering theory for the design and performance analysis of heat pipes is given.
148 citations
TL;DR: In this article, the thermal behavior of arrays of micro heat pipes fabricated in silicon wafers was investigated using an infrared thermal imaging unit, the temperature gradients and maximum localized temperatures were measured and an effective thermal conductivity was computed.
Abstract: An experimental investigation was conducted to determine the thermal behavior of arrays of micro heat pipes fabricated in silicon wafers. Two types of micro heat pipe arrays were evaluated, one that utilized machined rectangular channels and the other that used an anisotropic etching process to produce triangular channels. Once fabricated, a clear pyrex cover plate was bonded to the top surface of each wafer using an ultraviolet bonding technique to form the micro heat pipe array. These micro heat pipe arrays were then evacuated and charged with a predetermined amount of methanol. Using an infrared thermal imaging unit, the temperature gradients and maximum localized temperatures were measured and an effective thermal conductivity was computed. The experimental results were compared with those obtained for a plain silicon wafer
144 citations