Topic
Microelectromechanical systems
About: Microelectromechanical systems is a research topic. Over the lifetime, 10255 publications have been published within this topic receiving 151342 citations. The topic is also known as: MEMS & microelectromechanical system.
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TL;DR: In this paper, the authors synthesized high-quality PMN-PT epitaxial thin films on vicinal (001) Si wafers with the use of a template layer with superior piezoelectric coefficients (e31,f = −27 ± 3 coulombs per square meter).
Abstract: Microelectromechanical systems (MEMS) incorporating active piezoelectric layers offer integrated actuation, sensing, and transduction. The broad implementation of such active MEMS has long been constrained by the inability to integrate materials with giant piezoelectric response, such as Pb(Mg1/3Nb2/3)O3-PbTiO3 (PMN-PT). We synthesized high-quality PMN-PT epitaxial thin films on vicinal (001) Si wafers with the use of an epitaxial (001) SrTiO3 template layer with superior piezoelectric coefficients (e31,f = –27 ± 3 coulombs per square meter) and figures of merit for piezoelectric energy-harvesting systems. We have incorporated these heterostructures into microcantilevers that are actuated with extremely low drive voltage due to thin-film piezoelectric properties that rival bulk PMN-PT single crystals. These epitaxial heterostructures exhibit very large electromechanical coupling for ultrasound medical imaging, microfluidic control, mechanical sensing, and energy harvesting.
366 citations
TL;DR: In this article, an electrostatic microelectromechanical system (MEMS) gripper with an integrated capacitive force sensor is described for aligning microobjects suspended in water using ultrasonic fields.
Abstract: This paper reports an electrostatic microelectromechanical systems (MEMS) gripper with an integrated capacitive force sensor. The sensitivity is more than three orders of magnitude higher than other monolithically fabricated MEMS grippers with force feedback. This force sensing resolution provides feedback in the range of the forces that dominate the micromanipulation process. A MEMS ultrasonic device is described for aligning microobjects suspended in water using ultrasonic fields. The alignment of the particles is of a sufficient accuracy that the microgripper must only return to a fixed position in order to pick up particles less than 100 mum in diameter. The concept is also demonstrated with HeLa cells, thus providing a useful tool in biological research and cell assays
360 citations
TL;DR: In this article, the authors focus on the analysis of various surface micromechanisms, such as solid bridging, liquid meniscus formation, van der Waals force and electrostatic charging, and the significance of surface roughness and material properties.
356 citations
TL;DR: In this article, the basic operation principle for MEMS with wide band gap semiconductors is described, and the first applications of SiC based MEMS are demonstrated, and innovative MEMS and NEMS devices are reviewed.
Abstract: With the increasing requirements for microelectromechanical systems (MEMS) regarding stability, miniaturization and integration, novel materials such as wide band gap semiconductors are attracting more attention. Polycrystalline SiC has first been implemented into Si micromachining techniques, mainly as etch stop and protective layers. However, the outstanding properties of wide band gap semiconductors offer many more possibilities for the implementation of new functionalities. Now, a variety of technologies for SiC and group III nitrides exist to fabricate fully wide band gap semiconductor based MEMS. In this paper we first review the basic technology (deposition and etching) for group III nitrides and SiC with a special focus on the fabrication of three-dimensional microstructures relevant for MEMS. The basic operation principle for MEMS with wide band gap semiconductors is described. Finally, the first applications of SiC based MEMS are demonstrated, and innovative MEMS and NEMS devices are reviewed.
352 citations
TL;DR: A major problem with the Si-based MEMS technology is that Si has poor mechanical and tribological properties as discussed by the authors, which makes it unsuitable for MEMS devices, and therefore it is not suitable for them.
351 citations