Topic
Microheater
About: Microheater is a research topic. Over the lifetime, 814 publications have been published within this topic receiving 12478 citations.
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TL;DR: In this article , a thin film microheater was developed for microthruster ignition, micro detonator, etc. The results showed that the thinner the thickness of the film, the smaller the grain size, the more uniform the grain distribution, and the better the compactness of the thin film when the sputtering power is the same.
Abstract: A thin film microheater is developed for microthruster ignition, micro detonator, etc. The microheater was fabricated onto a Prex bulk substrate using a micro-fabrication technology. Sputtering precession was studied for the effect on the properties of Nichrome film. The results show that the smaller the thickness of the film, the smaller the grain size of the film, the more uniform the grain distribution, and the better the compactness of the film When the sputtering power is the same. When the thickness of the film is the same, the smaller the sputtering power, the smaller the grain size of the deposited film, the more uniform the grain distribution, and the better the compactness of the film.
TL;DR: In this article , a bimodal sensor based on a dual-network hydrogel, combining a poly(ionic liquid) (PIL) with UCST behavior and a neutral polymer with LCST behavior, achieves thermochromic-based strain-insensitive temperature sensing.
11 Dec 2022
TL;DR: In this paper , a set of microheater structures on a PET substrate of 10 mm x 10 mm and 0.2 mm dimension are studied for flexible gas sensing applications and three different geometrical structures such as double meander (DM), double Meander with a perpendicular electrode (DMPE), and N-shaped (NS) heating circuit have been designed and electro-thermal analysis has been performed.
Abstract: Microheater is an integral part of gas/vapor sensing systems. Here, a set of microheater structures on a PET substrate of 10 mm x 10 mm x 0.2 mm dimension are studied for flexible gas sensing applications. Three different geometrical structures such as double meander (DM), double meander with a perpendicular electrode (DMPE), and N-shaped (NS) heating circuit have been designed and electro-thermal analysis has been performed. The temperature distribution over the microheater shows NS has the highest uniformity over the other two structures, which is 74.70 % over DMPE (least uniform). The dimension and shape of the structure are considered based on integration feasibility with gas sensor arrays. It is found that NS has the lowest power consumption (44.37 mW) among others, which is 34.02% lower than DM (highest power consumption). Hence, NS is the best structure both in terms of temperature uniformity and power consumption. The study of the heaters can bring insight to improve the performance of gas sensing arrays in the flexible domain.
15 Jan 2023
TL;DR: In this paper , a new MEMS-based vibrating mesh technology with an integrated microheater is proposed to atomize high viscosity liquids while maintaining low span or narrow uniform droplet size distribution.
Abstract: Atomizers are used to generate an aerosol, which can be applied to numerous applications including inhaled drug delivery, ink jet printing, additive manufacturing, and spray cooling. However, current atomizing mechanisms either have poor droplet size uniformity or an inability to atomize liquids with viscosities >2 cP. This paper investigates a new MEMS based vibrating mesh technology with an integrated microheater to reduce the liquid viscosity and allow atomization to occur. The device aims to atomize high viscosity liquids while maintaining low span or narrow uniform droplet size distribution. The paper demonstrates the ability to atomize various high viscous liquids such as Su-8, PEDOT, and propylene glycol (PG).
01 Jan 2003
TL;DR: In this paper, three closed-loop microheaters of 5μm, 7μm and 9μm width were designed and two classes of samples were presented by reactive ion sputtering technique, and the SEM testing result showed the eutectic bonding of Au-Sn by global heating was successful.
Abstract: This paper reports some results for an on-going program in wafer-level MEMS package Institute of Microsystems at Huazhong University of Science and Technology. The final goal was to come up with a method usable for various types of MEMS devices in wafer level so that the low cost and high reliability can be achieved at the same time. In this particular paper, three closed-loop microheaters of 5μm, 7μm and 9μm width were designed. By reactive ion sputtering technique, two classes of samples are presented. The first one was first co-sputtered with Ni/Cr and then sputtered with Au metal as heating with Ni/Cr and then sputtered with Au metal as heating material, the second one was sputtered with Cr, Sn and Au respectively as heating material. The bonding of the former sample based on the Ni/Cr and Au heating material failed. The eutectic bonding experiment of the later sample based on the Cr, Sn and Au heating material by global heating method was completed in annealing oven at temperature of about 400°C for 20 minutes and by local heating method was applyed current of 0.8 A into the microheater. The SEM testing result showed the eutectic bonding of Au-Sn by global heating was successful. More results will be reported during the conference presentation.Copyright © 2003 by ASME