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Optical interconnect

About: Optical interconnect is a research topic. Over the lifetime, 2496 publications have been published within this topic receiving 31987 citations.


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Journal ArticleDOI
10 Jun 2009
TL;DR: The current performance and future demands of interconnects to and on silicon chips are examined and the requirements for optoelectronic and optical devices are project if optics is to solve the major problems of interConnects for future high-performance silicon chips.
Abstract: We examine the current performance and future demands of interconnects to and on silicon chips. We compare electrical and optical interconnects and project the requirements for optoelectronic and optical devices if optics is to solve the major problems of interconnects for future high-performance silicon chips. Optics has potential benefits in interconnect density, energy, and timing. The necessity of low interconnect energy imposes low limits especially on the energy of the optical output devices, with a ~ 10 fJ/bit device energy target emerging. Some optical modulators and radical laser approaches may meet this requirement. Low (e.g., a few femtofarads or less) photodetector capacitance is important. Very compact wavelength splitters are essential for connecting the information to fibers. Dense waveguides are necessary on-chip or on boards for guided wave optical approaches, especially if very high clock rates or dense wavelength-division multiplexing (WDM) is to be avoided. Free-space optics potentially can handle the necessary bandwidths even without fast clocks or WDM. With such technology, however, optics may enable the continued scaling of interconnect capacity required by future chips.

1,959 citations

Journal ArticleDOI
TL;DR: In this paper, two bonding technologies are used to realize the III-V/SOI integration: one based on molecular wafer bonding and the other based on DVS-BCB adhesive wafer-bonding.
Abstract: In this paper III-V on silicon-on-insulator (SOI) het- erogeneous integration is reviewed for the realization of near infrared light sources on a silicon waveguide platform, suitable for inter-chip and intra-chip optical interconnects. Two bonding technologies are used to realize the III-V/SOI integration: one based on molecular wafer bonding and the other based on DVS- BCB adhesive wafer bonding. The realization of micro-disk lasers, Fabry-Perot lasers, DFB lasers, DBR lasers and mode- locked lasers on the III-V/SOI material platform is discussed. Artist impression of a multi-wavelength laser based on micro- disk cavities realized on a III-V/SOI heterogeneous platform and a microscope image of a realized structure.

520 citations

Journal ArticleDOI
TL;DR: The International Technology Roadmap for Semiconductors (ITRS) is used as a reference to explore the requirements that silicon-based ICs must satisfy to successfully outperform copper electrical interconnects (IEs).
Abstract: Intrachip optical interconnects (OIs) have the potential to outperform electrical wires and to ultimately solve the communication bottleneck in high-performance integrated circuits. Performance targets and critical directions for ICs progress are yet to be fully explored. In this paper, the International Technology Roadmap for Semiconductors (ITRS) is used as a reference to explore the requirements that silicon-based ICs must satisfy to successfully outperform copper electrical interconnects (IEs). Considering the state-of-the-art devices, these requirements are extended to specific IC components

389 citations

Journal ArticleDOI
Alan F. Benner1, M. Ignatowski1, Jeffrey A. Kash1, Daniel M. Kuchta1, Mark B. Ritter1 
TL;DR: The various levels of a server interconnect hierarchy are reviewed and the current status of optical interconnect technology for these different levels is reviewed.
Abstract: Optical fiber links have become ubiquitous for links at the metropolitan and wide area distance scales, and have become common alternatives to electrical links in local area networks and cluster networks. As optical technology improves and link frequencies continue to increase, optical links will be increasingly considered for shorter, higher-bandwidth links such as I/O, memory, and system bus links. For these links closer to processors, issues such as packaging, power dissipation, and components cost assume increasing importance along with link bandwidth and link distance. Also, as optical links move steadily closer to the processors, we may see significant differences in how servers, particularly high-end servers, are designed and packaged to exploit the unique characteristics of optical interconnects. This paper reviews the various levels of a server interconnect hierarchy and the current status of optical interconnect technology for these different levels. The potential impacts of optical interconnect technology on future server designs are also reviewed.

378 citations

Journal ArticleDOI
TL;DR: In this article, an architectural approach for very high-capacity wide-area optical networks is presented, and a proposed program of research to address key system and device issues is described, where a distributed optical interconnect that is wavelength-selective and electronically controllable, permitting the same limited set of wavelengths to be reused among other access stations, is employed.
Abstract: An architectural approach for very-high-capacity wide-area optical networks is presented, and a proposed program of research to address key system and device issues is described. The network is based on dense multiwavelength technology and is scalable in terms of the number of networked users, the geographical range of coverage, and the aggregate network capacity. Of paramount importance to the achievement of scalability are the notions of wavelength reuse and wavelength translation. A distributed optical interconnect that is wavelength-selective and electronically controllable, permitting the same limited set of wavelengths to be reused among other access stations, is employed. By exercising the wavelength-selective switches, the wavelength-routed connectivity between stations can be reconfigured as needed. A multihop overlay network involving wavelength translation and self-routing fast packet switches permits full connectivity, if desired among the access stations at the individual virtual circuit level. Using just eight wavelengths, such a network could in principle interconnect a population of 100 million users over a nationwide geography with an expected delay equal to that of 12 hops. >

351 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
20236
202213
202134
202087
201976
201896