p–n junction

About: p–n junction is a research topic. Over the lifetime, 7701 publications have been published within this topic receiving 108890 citations. The topic is also known as: p-n junction.

Betavoltaic and photovoltaic energy conversion in three-dimensional macroporous silicon diodes

Abstract: A three-dimensional p-n diode structure is presented for the generation of energy via photovoltaic and betavoltaic modes of operation. Macroporous Silicon (MPS) has a large degree of internal surface area and its vertically oriented pores, which extend deep into the bulk of the Si substrate, allow for the creation of three-dimensional structures. In this device the MPS will not only serve as a means for creating 3D diode structures, it will also serve as a host matrix for a tritium isotope which emits energetic beta particles. By varying electrochemical etching conditions and using a prepatterning technique, 1.1 μm diameter pores with a spacing of 2.5 μm were achieved. The p-n junction was created using a rapid thermal process (RTP) which relies on the diffusion from an n-type solid source into the MPS. To ensure the quality of the diode structure, devices were tested using a light source which resulted in a photovoltaic response. Finally, betavoltaic operation was demonstrated by exposing devices to a tritium gas source. The average energy conversion efficiency of the first generation 3D diode was one order of magnitude higher than that of a similar planar device.

Thin 3D Multiplication Regions in Plasmonically Enhanced Nanopillar Avalanche Detectors

Abstract: We demonstrate a nanopillar (NP) device structure for implementing plasmonically enhanced avalanche photodetector arrays with thin avalanche volumes (∼ 310 nm × 150 nm × 150 nm). A localized 3D electric field due to a core–shell PN junction in a NP acts as a multiplication region, while efficient light absorption takes place via surface plasmon polariton Bloch wave (SPP-BW) modes due to a self-aligned metal nanohole lattice. Avalanche gains of ∼216 at 730 nm at −12 V are obtained. We show through capacitance–voltage characterization, temperature-dependent breakdown measurements, and detailed device modeling that the avalanche region is on the order of the ionization path length, such that dead-space effects become significant. This work presents a clear path toward engineering dead space effects in thin 3D-confined multiplication regions for high performance avalanche detectors for applications in telecommunications, sensing and single photon detection.

InGaAs avalanche photodiode with InP p-n junction

Abstract: A new InGaAs avalanche photodiode structure that has an InGaAs light absorption region and InP avalanche multiplying region is proposed. A dark-current density of 2.2 × 10-3 A/cm2 at 90% of breakdown voltage and a multiplication factor of 45 were obtained for the new structure diode fabricated from a liquid-phase epitaxially grown wafer.

Temperature dependence of forward current characteristics of GaN junction and Schottky rectifiers

Abstract: A comparison was made of the forward current–voltage characteristics of bulk GaN Schottky and p–n junction rectifiers using a quasi-three-dimensional simulator. The model includes incomplete ionization of the deep Mg acceptor (175 meV) in the p+-GaN side of the junction and the temperature dependence of mobility and GaN band gap. The forward turn-on voltages, VF, decrease with increasing temperature for both types of rectifier and are ∼2.5 V at 100 A cm−2 at 573 K for the junction diodes and ⩽1 V under similar conditions for the Schottky diodes. The effect of p-layer thickness and doping in the p–n junction was also investigated.