p–n junction

About: p–n junction is a research topic. Over the lifetime, 7701 publications have been published within this topic receiving 108890 citations. The topic is also known as: p-n junction.

P-N Junction of NiO Thin Film for Photonic Devices

Abstract: The development of a short-wavelength p-n junction device is essentially important for the realization of transparent electronics for next-generation optoelectronics. Nickel oxide (NiO) thin films with a tunable electrical conductivity of both p-type and n-type under the optimized growth conditions using RF sputtering technique with high optical transmission in the visible region have been fabricated. The room-temperature conductivities for n-type and p-type NiO thin films were about 5.91 × 101 and 1.9 ×10-2 S·cm-1, respectively. A p-n junction of NiO thin film has been realized, successfully exhibiting good rectifying behavior with efficient UV photodiode characteristics, providing suitable solution for low-cost visible blind UV photodetector application.

Shallow-Etch Mesa Isolation of Graded-Bandgap “W”-Structured Type II Superlattice Photodiodes

Abstract: Shallow-etch mesa isolation (SEMI) of graded-bandgap “W”-structured type II superlattice (GGW) infrared photodiodes provides a powerful means for reducing excess dark currents due to surface and bulk junction related processes, and it is particularly well suited for focal-plane array fabrication. In the n-on-p GGW photodiode structure the energy gap is increased in a series of steps from that of the lightly p-type infrared-absorbing region to a value typically two to three times larger. The wider gap levels off about 10 nm short of the doping-defined junction, and continues for another 0.25 μm into the heavily n-doped cathode before the structure is terminated by an n +-doped InAs top cap layer. The increased bandgap in the high-field region near the junction helps to strongly suppress both bulk tunneling and generation–recombination (G–R) current by imposing a much larger tunneling barrier and exponentially lowering the intrinsic carrier concentration. The SEMI approach takes further advantage of the graded structure by exposing only the widest-gap layers on etched surfaces. This lowers surface recombination and trap-assisted tunneling in much the same way as the GGW suppresses these processes in the bulk. Using SEMI, individual photodiodes are defined using a shallow etch that typically terminates only 10 nm to 20 nm past the junction, which is sufficient to isolate neighboring pixels while leaving the narrow-gap absorber layer buried 100 nm to 200 nm below the surface. This provides for separate optimization of the photodiode’s electrical and optical area. The area of the junction can be reduced to a fraction of that of the pixel, lowering bulk junction current, while maintaining 100% optical fill factor with the undisturbed absorber layer. Finally, with the elimination of deep, high-aspect-ratio trenches, SEMI simplifies array fabrication. We report herein results from SEMI-processed GGW devices, including large-area discrete photodiodes, mini-arrays, and a focal-plane array. Current–voltage data show strong suppression of side-wall leakage relative to that for more deeply etched devices, as well as scaling of dark current with junction area without loss of quantum efficiency.

Experimental Realization of a Topological p-n Junction by Intrinsic Defect Grading.

Abstract: A Bi2Te3 single crystal is grown with the modified Bridgman technique. The crystal has a nominal composition with a Te content of 61 mol% resulting in the existence of two distinct regions, p- and n-doped, respectively; color-coded tunneling spectra are taken over 60 nm at the transition region.

Bidirectional lateral insulated gate bipolar transistor

Abstract: A bidirectional lateral insulated gate bipolar transistor (IGBT) includes two gate electrodes. The IGBT can conduct current in two directions. The IGBT relies on a RESURF operation to provide high voltage blocking in both directions. The IGBT is symmetrical, having N-type drift region in contact with an oxide layer. A P-type region is provided above the N-type-drift region, having a portion more heavily doped with P-type dopants. The RESURF operation can be provided by a buried oxide layer or by a P substrate or by a horizontal PN junction. The IGBT can be utilized in various power operations, including a matrix switch or a voltage source converter.

Semiconductor light emitting element

Abstract: PROBLEM TO BE SOLVED: To provide a small-sized semiconductor light emitting element having high directivity of the emitted light and a high output. SOLUTION: In the semiconductor light emitting element having a pn junction, the part of a light extracting unit is covered with a light shielding substance having low conductivity. The electric resistance of the substance is 10 Ωm or more. The substance contains one or more kinds of powder selected from the group consisting of a metal and a pigment. The powder of the metal contains at least one kind selected from the group consisting of Al, Cu, Ag, Au, PT, Ti, Ni, Sn, Pb, Mg, Zn, Fe, Co and Cr. The powder has a plate-like shape having a thickness within a range of 0.001 to 10 μm, and a length in a range of 0.01 to 100 μm.