p–n junction

About: p–n junction is a research topic. Over the lifetime, 7701 publications have been published within this topic receiving 108890 citations. The topic is also known as: p-n junction.

Blue Electroluminescence from ZnSe p-n Junction Light-Emitting Diodes

Abstract: Pure blue-light emission has been obtained from homoepitaxial ZnSe p-n junction light-emitting diodes (LEDs). Homoepitaxy is made on ZnSe substrates dry-etched by a BCl3 plasma. High-quality p-n junctions consists; of N-doped p-type ZnSe formed by active-nitrogen doping and Cl-doped n-type ZnSe using ZnCl2 as a dopant source. Current-voltage characteristics of the LEDs exhibited good rectification properties. The peak energy of blue electroluminescence from the LEDs was 2.67 eV with a narrow full width at half-maximum of 49 meV.

Wide band gap semiconductor device including junction field effect transistor

Abstract: A wide band gap semiconductor device has a transistor cell region, a diode forming region, an electric field relaxation region located between the transistor cell region and the diode forming region, and an outer peripheral region surrounding the transistor cell region and the diode forming region. In the transistor cell region, a junction field effect transistor is disposed. In the diode forming region, a diode is disposed. In the electric field relaxation region, an isolating part is provided. The isolating part includes a trench dividing the transistor cell region and the diode forming region, a first conductivity-type layer disposed on an inner wall of the trench, and a second conductivity-type layer disposed on a surface of the first conductivity-type layer so as to fill the trench. The first conductivity-type layer and the second conductivity-type layer provide a PN junction.

Two-dimensionally confined injection phenomena at low temperatures in sub-10-nm-thick SOI insulated-gate p-n-junction devices

Abstract: This paper describes two-dimensionally confined carrier injection phenomena in thin-SOI insulated-gate pn-junction devices fabricated on SIMOX substrates. At 28 K conductance shows step-like anomalies due to the manifestation of a two-dimensional subband system in an 8-nm-thick-SOI structure at a low gate bias. Conductance shows an oscillation-like feature at a high gate bias because of the injection mode change. These effects are examined by theoretical simulations based on quantum mechanics.

Avalanche breakdown characteristics of a diffused P-N junction

Abstract: A one-dimensional analysis is presented on the avalanche breakdown characteristics of a diffused p-n junction diode. By numerically integrating the carrier ionization rate in a junction space-charge layer, avalanche breakdown voltage is calculated for diffused diodes of silicon and germanium; this voltage is graphically illustrated throughout a range of parameters applicable to most practical situations. In addition, for calculating the maximum cutoff frequency of varactor diodes, junction capacity is similarly illustrated assuming the device is biased to avalanche breakdown. From these illustrations, and from an accompanying nomograph which relates the physical constants of a junction to its impurity atom gradient, the above parameters can be readily established without additional calculations. Further, examples are also presented to demonstrate the reduction of breakdown voltage resulting from a rapid increase of conductivity within the space-charge layer of a diffused p-n junction; this situation approximates many epitaxial and double diffused structures.

Heterojunction semiconductor device

Abstract: A semiconductor device is described for sensing radiant energy incorporating a pn junction formed by two layers of materials each having a different energy band gap to form a heterojunction diode and wherein the layer having the greatest energy band gap fully covers the boundaries or perimeter of the layer having a lesser energy band gap to reduce surface leakage current. Further, a semiconductor device is described for sensing radiant energy incorporating a pn junction formed by two layers of materials each having a different energy band gap to form a heterojunction diode wherein the layer having the greatest energy band gap has spaced-apart P regions to form the anode of the heterojunction diode whereby the heterojunction diode is buried below the surface of the layer having the greatest energy band gap. The invention reduces the problem of surface and bulk leakage across heterojunction diodes.