scispace - formally typeset
Search or ask a question
Topic

Photomask

About: Photomask is a research topic. Over the lifetime, 7917 publications have been published within this topic receiving 54524 citations. The topic is also known as: photoreticle & reticle.


Papers
More filters
Patent
14 Aug 1996
TL;DR: In this paper, an aerial image of a portion of a photomask is generated and a simulated image corresponding to original pattern data is also generated; the aerial image and simulated image are then compared and discrepancies are detected as possible defects.
Abstract: The present invention provides a process for performing automatic inspection of advanced design photomasks. In a preferred embodiment, an aerial image of a portion of a photomask is generated. A simulated image corresponding to original pattern data is also generated. The aerial image and simulated image are then compared and discrepancies are detected as possible defects.

92 citations

Journal ArticleDOI
01 Jun 2005-Langmuir
TL;DR: A novel microreactor-based photomask capable of effecting high resolution, large area patterning of UV/ozone treatments of poly(dimethylsiloxane) (PDMS) surfaces is described and provides new insights into the mechanisms that contribute to the chemistry responsible for the interfacial adhesion of DTL transfers.
Abstract: A novel microreactor-based photomask capable of effecting high resolution, large area patterning of UV/ozone (UVO) treatments of poly(dimethylsiloxane) (PDMS) surfaces is described. This tool forms the basis of two new soft lithographic patterning techniques that significantly extend the design rules of decal transfer lithography (DTL). The first technique, photodefined cohesive mechanical failure, fuses the design rules of photolithography with the contact-based adhesive transfer of PDMS in DTL. In a second powerful variation, the UVO masks described in this work enable a masterless soft lithographic patterning process. This latter method, UVO-patterned adhesive transfer, allows the direct transfer of PDMS-based polymer microstructures from a slab of polymer to silicon and other material surfaces. Both methods exploit the improved process qualities that result from the use of a deuterium discharge lamp to affect the UVO treatment to pattern complex, large area PDMS patterns with limiting feature sizes ex...

91 citations

Journal ArticleDOI
TL;DR: The study and optimization of epoxy-based negative photoresist (SU-8) microstructures through a low-cost process and without the need for cleanroom facility is presented, and the Ultraviolet Rays (UV) exposure equipment can replace the more expensive and less available equipment.
Abstract: The study and optimization of epoxy-based negative photoresist (SU-8) microstructures through a low-cost process and without the need for cleanroom facility is presented in this paper. It is demonstrated that the Ultraviolet Rays (UV) exposure equipment, commonly used in the Printed Circuit Board (PCB) industry, can replace the more expensive and less available equipment, as the Mask Aligner that has been used in the last 15 years for SU-8 patterning. Moreover, high transparency masks, printed in a photomask, are used, instead of expensive chromium masks. The fabrication of well-defined SU-8 microstructures with aspect ratios more than 20 is successfully demonstrated with those facilities. The viability of using the gray-scale technology in the photomasks for the fabrication of 3D microstructures is also reported. Moreover, SU-8 microstructures for different applications are shown throughout the paper.

91 citations

Journal ArticleDOI
TL;DR: This paper describes a paper-based microfluidic analytical device for iron assay using a photomask printed with a 3D printer for fabrication of hydrophilic and hydrophobic zones on the paper by photolithography.

90 citations

Journal ArticleDOI
Roger H. French1, Hoang Vi Tran
TL;DR: In this paper, the authors highlight the recent materials advances in photomasks, immersion fluids, topcoats, and photoresists, and double-patterning lithography.
Abstract: Optical immersion lithography utilizes liquids with refractive indices >1 (the index of air) below the last lens element to enhance numerical aperture and resolution, enabling sub-40-nm feature patterning. This shift from conventional dry optical lithography introduces numerous challenges requiring innovations in materials at all imaging stack levels. In this article, we highlight the recent materials advances in photomasks, immersion fluids, topcoats, and photoresists. Some of the challenges encountered include the fluids’ and photomask materials’ UV durability, the high-index liquids’ compatibility with topcoats and photoresists, and overall immersion imaging and defectivity performance. In addition, we include a section on novel materials and methods for double-patterning lithography—a technique that may further extend immersion technology by effectively doubling a less dense pattern’s line density.

90 citations


Network Information
Related Topics (5)
Silicon
196K papers, 3M citations
82% related
Chemical vapor deposition
69.7K papers, 1.3M citations
81% related
Nanowire
52K papers, 1.5M citations
80% related
Transistor
138K papers, 1.4M citations
80% related
Thin film
275.5K papers, 4.5M citations
80% related
Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202322
202281
202150
2020124
2019179
2018195