Topic
Photomask
About: Photomask is a research topic. Over the lifetime, 7917 publications have been published within this topic receiving 54524 citations. The topic is also known as: photoreticle & reticle.
Papers published on a yearly basis
Papers
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15 Feb 2001
TL;DR: In this paper, the authors proposed a defect inspecting method by which necessary and sufficient defect inspection advantageous in time and cost is performed by performing the inspection while dividing a mask defect into an area where the influence of mask defect on the operation is large and an area with small influence when inspection sensitivity is adjusted.
Abstract: PROBLEM TO BE SOLVED: To provide a defect inspecting method by which necessary and sufficient defect inspection advantageous in time and cost is performed by performing the inspection while dividing a mask defect into an area where the influence of a mask defect on the operation is large and an area where the influence is small when inspection sensitivity is adjusted. SOLUTION: According to the influence of the defect on a photomask 10 on the operation of the device, inspection areas (e.g. areas A and B) on the photomask are divided into two or more areas and inspection sensitivity is set for each divided inspection area. According to the patterns A and B of the photomask 10, defect inspection is performed with desired inspection sensitivity to enable necessary and sufficient defect inspection. Further, defect inspection data wherein the defect inspections ensitivity and defect inspection positions are defined for the specific pattern of the mask having a plurality of inspection areas are prepared and photomask inspection is performed according to the data. COPYRIGHT: (C)2002,JPO
16 citations
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TL;DR: In this article, the femtosecond laser processing of a negative photoresist using a microlens array (MLA) was used for simultaneous multipoint fabrication of polymer rods.
Abstract: We report the simultaneous multipoint fabrication of polymer rods by the femtosecond laser processing of a negative photoresist using a microlens array (MLA). The rods were periodically arranged in the form of an array corresponding to the MLA and free-standing on a glass substrate. The use of a photomask enabled us to define the contour of the rod array. Furthermore, sample translation techniques were demonstrated for the effective fabrication of large-area structures.
16 citations
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01 Nov 2006TL;DR: In this article, a method of correcting the registration errors of a photomask includes the steps of forming an optical pattern on a photOMask substrate, measuring the registration error of the optical pattern, and forming a plurality of stress generation portions in the photOMAS substrate so that the stress generation portion correspond to the measured registration errors.
Abstract: Provided are photomask registration errors of which have been corrected and a method of correcting the registration errors of a photomask. The photomask includes a photomask substrate, an optical pattern formed on one surface of the photomask substrate, and a plurality of stress generation portions formed in the photomask substrate. A method of correcting the registration errors of a photomask includes the steps of forming an optical pattern on a photomask substrate, measuring the registration errors of the optical pattern, and forming a plurality of stress generation portions in the photomask substrate so that the stress generation portions correspond to the measured registration errors.
16 citations
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14 Jan 1999TL;DR: In this paper, a method of repairing defects in a photomask used in the formation of a semiconductor wafer using the use of a scanning tunneling microscope is described. But this method is limited to the case where the tip is placed in proximity to those areas in need of the excess material and caused to deposit such material upon application of a bias voltage to the tip.
Abstract: A method of repairing defects in a photomask used in the formation of a semiconductor wafer includes the use of a scanning tunneling microscope. The scanning tunneling microscope includes a very sharp tip having a diameter on the order of 100 Å or less. In order to remove excess material from a mask layer in the photomask, the tip is placed into contact with those regions having such excess material and the tip is used to scrape the excess material away. In order to add material to voids in a mask layer of the photomask, the tip is placed in proximity to those areas in need of the excess material and caused to deposit such material upon, for example, application of a bias voltage to the tip.
16 citations
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03 Jan 2002TL;DR: In this article, a photomask is placed and aligned above a wafer having a photoresist formed thereon at a predetermined distance, and multiple exposures are sequentially performed on the photoresists through the photomasks.
Abstract: A photolithography process with multiple exposures is provided. A photomask is placed and aligned above a wafer having a photoresist formed thereon at a predetermined distance. Multiple exposures are sequentially performed on the photoresist through the photomask. Each of the multiple exposures is provided with a respective illuminating setting that is optimized for one duty ratio of the photomask. Thereby, an optimum through-pitch performance for pattern transfer from the photomask unto the photoresist is obtained. Then, a development is performed on the photoresist.
16 citations