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Photomask

About: Photomask is a research topic. Over the lifetime, 7917 publications have been published within this topic receiving 54524 citations. The topic is also known as: photoreticle & reticle.


Papers
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Patent
18 Apr 2003
TL;DR: In this article, a method and apparatus for etching a metal layer disposed on a substrate, such as a photolithographic reticle, is provided, including positioning the reticle in a first orientation on a reticle support in a processing chamber.
Abstract: Method and apparatus for etching a metal layer disposed on a substrate, such as a photolithographic reticle, are provided. In one aspect, a method is provided for processing a photolithographic reticle including positioning the reticle in a first orientation on a reticle support in a processing chamber, wherein the reticle comprises a metal photomask layer formed on an optically transparent substrate, and a patterned resist material deposited on the metal photomask layer, etching the metal photomask layer in the first orientation, positioning the reticle in at least a second orientation, and etching the metal photomask layer in the at least second orientation.

162 citations

Patent
05 Mar 2001
TL;DR: In this article, a photomask pattern defect inspecting method for detecting a defect part of a mask by comparing the pattern of the mask with mask drawing data was proposed, where figure pattern data as drawing data and figure pattern arrangement information as drawing position information of the pattern data are included and the figure pattern as the drawing data are processed by the OPC correction.
Abstract: PROBLEM TO BE SOLVED: To provide a method for efficiently inspect a defect of a photomask after OPC correction. SOLUTION: This is a photomask pattern defect inspecting method for detecting a defect part of a photomask by comparing the pattern of a photomask with mask drawing data by a specific inspecting machine; and figure pattern data as drawing data and figure pattern data arrangement information as drawing position information of the figure pattern data are included and the figure pattern data as the drawing data are processed by the OPC correction. The photomask is inspected according to the mask drawing data to previously extract a fine figure pattern, such as a TEG pattern (test structure) of a part other than the OPC-corrected part as a fine figure pattern which should not be detected originally as a defective part, but is frequently detected as a defect part and when the photomask is inspected, the fine figure pattern part which should not be detected as a defect part originally is not regarded as a defect. COPYRIGHT: (C)2002,JPO

156 citations

Patent
25 Jun 2002
TL;DR: In this article, a non-rigid photomask is retained in a rigid, optically transparent holder that enables the photomasks to be handled as a rigid structure, and serial numbers are created onto wafer dies using a combined process involving photolithography, and a reactive ion etching process with a selective etch rate.
Abstract: A serialization process presents an efficient method of creating serial numbers on a ceramic-like semiconductor wafer by forming a non-rigid photomask that incorporates character specifications for the serial numbers. The non-rigid photomask is retained in a rigid, optically transparent photomask holder that enables the photomask to be handled as a rigid structure. Upon preparation of the wafer, the serial numbers are created onto wafer dies using a combined process involving photolithography, and a reactive ion etching process with a selective etch rate. The serialization process enables a rapid creation of serial numbers, with the selective RIE process substantially increasing the optical contrast of the characters without the need for deep trenches and without generation of excessive debris.

155 citations

Patent
Danny Rittman1, Micha Oren1
03 Mar 2003
TL;DR: In this paper, a photomask for reducing power supply voltage fluctuations in an integrated circuit and integrated circuit manufactured by the same is disclosed, which includes a substrate and a patterned layer formed on at least a portion of the substrate.
Abstract: A photomask for reducing power supply voltage fluctuations in an integrated circuit and integrated circuit manufactured by the same are disclosed. The photomask includes a substrate and a patterned layer formed on at least a portion of the substrate. The patterned layer may be formed using a mask pattern file created by analyzing a pattern in a mask layout file to identify a region in the pattern to add one or more decoupling capacitors. Once the region is identified, a feature located in the identified region is moved based on a design rule from a first position to a second position in the mask layout file to create a space in the identified region. The decoupling capacitors are placed in the space in the identified region.

154 citations

Patent
09 Aug 2007
TL;DR: In this paper, a method for processing a photolithographic reticle includes providing a reticle having a metal photomask layer formed on an optically transparent substrate and an imprinted resist material deposited on the metal photOMask layer.
Abstract: Methods for etching a metal layer using an imprinted resist material are provided. In one embodiment, a method for processing a photolithographic reticle includes providing a reticle having a metal photomask layer formed on an optically transparent substrate and an imprinted resist material deposited on the metal photomask layer, etching recessed regions of the imprinted resist material to expose portions of the metal photomask layer in a first etching step, and etching the exposed portions of the metal photomask layer through the imprinted resist material in a second etching step, wherein at least one of the first or second etching steps utilizes a plasma formed from a processing gas comprising oxygen, halogen and chlorine containing gases. In one embodiment, the process gas is utilized in both the first and second etching steps. In another embodiment, the first and second etching steps are performed in the same processing chamber.

154 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202322
202281
202150
2020124
2019179
2018195