Topic
Photomask
About: Photomask is a research topic. Over the lifetime, 7917 publications have been published within this topic receiving 54524 citations. The topic is also known as: photoreticle & reticle.
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Papers
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TL;DR: In this article, the use of focused ion beams was used to repair the mask stain caused by excess of chromium ionization during the repair process of a chromium-on-glass mask.
Abstract: Optical lithography of semiconductor microcircuits relies upon the use of chromium-on-glass masks or reticles. Opaque defects in the mask pattern due to excess of chromium can be repaired by the use of focused ion beams and commercial mask repair systems are now available. During the repair process, ions are implanted into the glass substrate of the mask, giving rise to a stain when the mask is inspected or used for lithography.
25 citations
20 Aug 2004
TL;DR: In this paper, the International Society for Optical Engineering (IOSE) has published an abstract of a paper entitled "The International Journal of Optical Engineering: 2004 Abstract No. 1, No.
Abstract: No Abstract Available.© (2004) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
25 citations
Patent•
17 Dec 2003TL;DR: In this paper, a method for fabricating a photomask for an integrated circuit was proposed, which includes a substrate with at least one trench, providing a prepatterned surface at the bottom of the trench, and providing a multilayer coating over the substrate.
Abstract: A method for fabricating a photomask for an integrated circuit. The method includes, for example, providing a substrate with at least one trench, providing a prepatterned surface at the bottom of the trench, and providing a multilayer coating over the substrate. As a result, the multilayer coating forms a reflection region on the surface of the substrate outside the trench and a non-reflection region in the trench. The invention additionally provides a corresponding photomask.
25 citations
Patent•
IBM1
TL;DR: In this paper, a method for aligning a substrate to a photomask was proposed, which includes: directing incident light through a pattern of clear regions transparent to the incident light in an opaque-to-the-incident-light region of a polysilicon mask, through a lens and onto a photodiode formed in a substrate.
Abstract: A method, structure, system of aligning a substrate to a photomask. The method includes: directing incident light through a pattern of clear regions transparent to the incident light in an opaque-to-the-incident-light region of a photomask, through a lens and onto a photodiode formed in a substrate, the photodiodes electrically connected to a light emitting diode formed in the substrate, the light emitting diode emitting light of different wavelength than a wavelength of the incident lights; measuring an intensity of emitted light from light emitting diode; and adjusting alignment of the photomask to the substrate based on the measured intensity of emitted light.
25 citations
Patent•
18 Aug 2005
TL;DR: In this article, a method for manufacturing a high quality photomask blank having extremely little defect by easily and reliably removing a foreign matter or the like depositing on the surface of a light transmitting substrate (the principal surface and the end faces comprising side faces and chamfered faces).
Abstract: PROBLEM TO BE SOLVED: To manufacture a high-quality photomask blank having extremely little defect by easily and reliably removing a foreign matter or the like depositing on the surface of a light transmitting substrate (the principal surface and the end faces comprising side faces and chamfered faces). SOLUTION: The method for manufacturing a photomask blank includes: cleaning the surface of a transparent substrate 1; and then forming a thin film as a transfer pattern to be transferred to a transfer material on the surface of the transparent substrate, wherein the surface of the transparent substrate is cleaned by carrying out surface improvement process to improve wettability of the surface of the transparent substrate by using, for example, a UV irradiation apparatus, and then the end faces of the surface of the transparent substrate are cleaned by using an end face cleaning apparatus, afterward the principal surface is subjected to at least one of scrub cleaning by using a cleaning tool, two-fluid spray cleaning by using a two-fluid spray nozzle 13, ultrasonic cleaning by using a ultrasonic cleaning nozzle 14, or the like. COPYRIGHT: (C)2005,JPO&NCIPI
25 citations