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Plasma etching

About: Plasma etching is a research topic. Over the lifetime, 13023 publications have been published within this topic receiving 212982 citations.


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Book
28 Oct 1994
TL;DR: In this paper, the authors introduce the concept of particle and energy balance in discharges and introduce the theory of collision dynamics and wave-heated discharges, as well as chemical reactions and equilibrium.
Abstract: 1. Introduction. 2. Basic Plasma Equations and Equilibrium. 3. Atomic Collisions. 4. Plasma Dynamics. 5. Diffusion and Transport. 6. DC Sheaths. 7. Chemical Reactions and Equilibrium. 8. Molecular Collisions. 9. Chemical Kinetics and Surface Processes. 10. Particle and Energy Balance in Discharges. 11. Capacitive Discharges. 12. Inductive Discharges. 13. Wave-Heated Discharges. 14. DC Discharges. 15. Etching. 16. Deposition and Implantation. 17. Dusty Plasmas. 18. Kinetic Theory of Discharges. Appendix A: Collision Dynamics. Appendix B: The Collision Integral. Appendix C: Diffusion Solutions for Variable Mobility Model.

5,728 citations

Journal ArticleDOI
TL;DR: This article reviews the various common plasma techniques and experimental methods as applied to biomedical materials research, such as plasma sputtering and etching, plasma implantation, plasma deposition, plasma polymerization, laser plasma deposited, plasma spraying, and so on.
Abstract: Plasma-surface modification (PSM) is an effective and economical surface treatment technique for many materials and of growing interests in biomedical engineering This article reviews the various common plasma techniques and experimental methods as applied to biomedical materials research, such as plasma sputtering and etching, plasma implantation, plasma deposition, plasma polymerization, laser plasma deposition, plasma spraying, and so on The unique advantage of plasma modification is that the surface properties and biocompatibility can be enhanced selectively while the bulk attributes of the materials remain unchanged Existing materials can, thus, be used and needs for new classes of materials may be obviated thereby shortening the time to develop novel and better biomedical devices Recent work has spurred a number of very interesting applications in the biomedical field This review article concentrates upon the current status of these techniques, new applications, and achievements pertaining to biomedical materials research Examples described include hard tissue replacements, blood contacting prostheses, ophthalmic devices, and other products

1,404 citations

Journal ArticleDOI
Mamoru Omori1
TL;DR: In this paper, the graphite die set in a spark plasma system (SPS) is heated by a pulse direct current, which induces good effects on materials in the die.
Abstract: The graphite die set in spark plasma system (SPS) is heated by a pulse direct current. Weak plasma, discharge impact, electric field and electric current, which are based on this current, induce good effects on materials in the die. The surface films of aluminum and pure WC powders are ruptured by the spark plasma. Pure AlN powder is sintered without sintering additives in the electric field. The spark plasma leaves discharge patterns on insulators. Organic fibers are etched by the spark plasma. Thermosetting polyimide is consolidated by the spark plasma. Insoluble polymonomethylsilane is rearranged into the soluble one by the spark plasma. A single crystal of CoSb3 is grown from the compound powders in the electric field by slow heating. Coupled crystals of eutectic powder are connected with each other in the electric field.

953 citations

Patent
Franz Laermer1, Andrea Schilp1
27 Nov 1993
TL;DR: In this paper, anisotropic plasma etching of silicon is used to provide laterally defined recess structures therein through an etching mask employing a plasma, the method including anisotropically-plasmine etching, polymerizing in a polymerizing step at least one polymer former contained in the plasma onto the surface of the silicon during which the surfaces that were exposed in a preceding etching step are covered by a polymer layer thereby forming a temporary etching stop.
Abstract: A method of anisotropic plasma etching of silicon to provide laterally defined recess structures therein through an etching mask employing a plasma, the method including anisotropic plasma etching in an etching step a surface of the silicon by contact with a reactive etching gas to removed material from the surface of the silicon and provide exposed surfaces; polymerizing in a polymerizing step at least one polymer former contained in the plasma onto the surface of the silicon during which the surfaces that were exposed in a preceding etching step are covered by a polymer layer thereby forming a temporary etching stop; and alternatingly repeating the etching step and the polymerizing step. The method provides a high mask selectivity simultaneous with a very high anisotropy of the etched structures.

934 citations

Book
01 Jan 1990
TL;DR: A.R. Wrobel and M.N. Morosoff as mentioned in this paper, an Introduction to Plasma Polymerization, An Introduction to Plasminarization of Fluorocarbons, and Applications of Plasma Polymers.
Abstract: N. Morosoff, An Introduction to Plasma Polymerization. R. d'Agostino, F. Cramarossa, F. Fracassi, and F. Illuzzi, Plasma Polymerization of Fluorocarbons. A.M. Wrobel and M.R. Wertheimer, Plasma-Polymerized Organosilicones and Organometallics. H. Biederman and L. Martinu, Plasma Polymer-Metal Composite Films. F.D. Egitto, V. Vukanovic, and G.N. Taylor, Plasma Etching of Organic Polymers. S. Morita and S. Hattori, Applications of Plasma Polymers. B.D. Ratner, A. Chilkoti, and G.P. Lopez, Plasma Deposition and Treatment for Biomaterial Applications. Index.

921 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202369
2022138
2021137
2020207
2019199
2018239